公开(公告)号：EP3114911A1

公开(公告)日：2017-01-11

申请号：EP15758971.4

申请日：2015-03-04

申请人： MC10, INC.

发明人： GARLOCK, Dave ,  GAUDETTE, Harry ,  FASTERT, Steven ,  STANDLEY, Adam ,  ELOLAMPI, Brian ,  HSU, Yung-Yu

IPC分类号： H05K3/34 ,  H05K3/40 ,  H05K1/03

CPC分类号： H05K5/0034 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/32 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/065 ,  H05K2201/09063 ,  H05K2201/09872 ,  H05K2201/10151 ,  H05K2203/1311 ,  H05K2203/1316

摘要： Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

摘要翻译： 封装的适形电子器件，封装的保形集成电路（IC）系统以及制造和使用封装的适形电子器件的方法在本文中给出。 公开了一种保形IC装置，其包括柔性基板，附接到柔性基板的电子电路以及包含电子电路和柔性基板的柔性多部分封装壳体。 多部分壳体包括第一和第二封装壳体部件。 第一封装壳体部件具有凹入区域，用于将电子电路放置在其中，而第二封装壳体部件具有用于在其中安置柔性基板的凹陷区域。 第一封装壳体部件可选地包括用于在其中安置柔性基板的凹陷区域。 两个壳体部件可以包括一个或多个穿过基板中的孔的突起，以接合另一壳体部件中的互补的凹部，从而使密封壳体部件与柔性基板和电子电路对准和互锁。