公开(公告)号：EP1578494B1

公开(公告)日：2010-05-26

申请号：EP03787285.0

申请日：2003-12-09

申请人： Medtronic, Inc.

发明人： SINGHAL, Ruchika ,  WAHLSTRAND, Carl, D. ,  JANZIG, Darren, A. ,  SKIME, Robert, M.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

摘要： A modular implantable medical device (101, 201, 301, 401, 501, 601, 701, 801) includes two or more interconnected modules (103-105, 210-212, 410-412, 510-512, 610, 710-712, 810, 910) and an overmold (106, 214, 302, 413, 522, 622, 722, 822) that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module (213A-B, 303A-B, 415A-B, 613, 813) for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.

公开(公告)号：EP1578497A1

公开(公告)日：2005-09-28

申请号：EP03796789.0

申请日：2003-12-09

申请人： MEDTRONIC, INC.

发明人： JANZIG, Darren, A. ,  WAHLSTRAND, Carl, D. ,  OLSON, Paulette, C. ,  SKIME, Robert, M.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

摘要： Components (114, 116) of an implantable medical device (10) are arranged to facilitate a low-profile housing (36). A circuit board (80) within the housing carries integrated circuits (114) and discrete components (116). The integrated circuits and discrete components are located on first and second opposing surfaces (110, 112) of the circuit board, respectively. In some embodiments, the implantable medical device is implanted on a cranium of a patient and the housing is concave such that it substantially conforms to the cranium. In such embodiments, the integrated circuits and/or discrete components can be arranged on the circuit board according to height to better conform to the concavity of the housing. In some embodiments, the implantable medical device includes a telemetry coil (82) that is positioned within the housing such that it occupies space that cannot be practically occupied by the circuit board. The housing may comprise a feed through oriented at an angle relative to a major surface of the housing.

公开(公告)号：EP2841155A1

公开(公告)日：2015-03-04

申请号：EP13712440.0

申请日：2013-03-12

申请人： Medtronic Inc. ,  Janzig, Darren A. ,  Lindner, Gerald G. ,  Paidosh, Chris J. ,  Thom, Andrew J. ,  Tischendorf, Brad C.

发明人： JANZIG, Darren, A. ,  LINDNER, Gerald, G. ,  PAIDOSH, Chris, J. ,  THOM, Andrew, J. ,  TISCHENDORF, Brad, C.

IPC分类号： A61N1/375

摘要： A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.

公开(公告)号：EP1578497B1

公开(公告)日：2010-04-21

申请号：EP03796789.0

申请日：2003-12-09

申请人： Medtronic, Inc.

发明人： JANZIG, Darren, A. ,  WAHLSTRAND, Carl, D. ,  OLSON, Paulette, C. ,  SKIME, Robert, M.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

公开(公告)号：EP1578495A1

公开(公告)日：2005-09-28

申请号：EP03790404.2

申请日：2003-12-09

申请人： MEDTRONIC, INC.

发明人： JANZIG, Darren, A. ,  WAHLSTRAND, Carl, D. ,  SKIME, Robert, M. ,  LENT, Mark, S. ,  MIESEL, Keith, A. ,  CABAK, James, E.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

摘要： In an implantable medical device (101, 201, 401A-F, 501, 601, 701, 801, 901) having individual modules (103-105, 210-212, 410-412, 510-512, 610-611, 711-713, 811-812, 911-912, 1110-1111, 1201-1202), a coupling module (521, 612, 721, 722, 821, 921, 1001, 1101, 1222) couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.

公开(公告)号：EP1578495B1

公开(公告)日：2010-06-02

申请号：EP03790404.2

申请日：2003-12-09

申请人： Medtronic, Inc.

发明人： JANZIG, Darren, A. ,  WAHLSTRAND, Carl, D. ,  SKIME, Robert, M. ,  LENT, Mark, S. ,  MIESEL, Keith, A. ,  CABAK, James, E.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

摘要： In an implantable medical device (101, 201, 401A-F, 501, 601, 701, 801, 901) having individual modules (103-105, 210-212, 410-412, 510-512, 610-611, 711-713, 811-812, 911-912, 1110-1111, 1201-1202), a coupling module (521, 612, 721, 722, 821, 921, 1001, 1101, 1222) couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.

公开(公告)号：EP1578496A1

公开(公告)日：2005-09-28

申请号：EP03796788.2

申请日：2003-12-09

申请人： MEDTRONIC, INC.

发明人： WAHLSTRAND, Carl, D. ,  JANZIG, Darren, A. ,  SKIME, Robert, M.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

摘要： A modular implantable medical device (201, 301, 401, 701, 801) includes a plurality of modules (210-212, 310-312, 410-412, 710, 810, 811) that are at least partially encapsulated by an overmold (214, 314, 422, 722, 822). The modules may be connected by coupling modules, which may be flexible to provide for one or more degrees of relative intermodular motion. The overmold may also be flexible. In order to reduce relative intermodule motion to acceptable direction and/or ranges, the overmold may include one or more motion reduction elements (421, 622, 623, 826).

公开(公告)号：EP1578494A1

公开(公告)日：2005-09-28

申请号：EP03787285.0

申请日：2003-12-09

申请人： MEDTRONIC, INC.

发明人： SINGHAL, Ruchika ,  WAHLSTRAND, Carl, D. ,  JANZIG, Darren, A. ,  SKIME, Robert, M.

IPC分类号： A61N1/375 ,  A61N1/36

CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

摘要： A modular implantable medical device (101, 201, 301, 401, 501, 601, 701, 801) includes two or more interconnected modules (103-105, 210-212, 410-412, 510-512, 610, 710-712, 810, 910) and an overmold (106, 214, 302, 413, 522, 622, 722, 822) that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module (213A-B, 303A-B, 415A-B, 613, 813) for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.

公开(公告)号：EP2841155B1

公开(公告)日：2020-01-22

申请号：EP13712440.0

申请日：2013-03-12

申请人： Medtronic, Inc.

发明人： JANZIG, Darren, A. ,  LINDNER, Gerald, G. ,  PAIDOSH, Chris, J. ,  THOM, Andrew, J. ,  TISCHENDORF, Brad, C.

IPC分类号： A61N1/375

公开(公告)号：EP2968959B1

公开(公告)日：2017-09-20

申请号：EP14719162.1

申请日：2014-03-14

申请人： Medtronic, Inc.

发明人： JANZIG, Darren, A.

IPC分类号： A61N1/375

CPC分类号： A61N1/3752