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公开(公告)号：EP1578500A1
公开(公告)日：2005-09-28
申请号：EP03812860.9
申请日：2003-12-09
申请人： MEDTRONIC, INC.
发明人： WAHLSTRAND, Carl, D. , JANZIG, Darren, A. , SINGHAL, Ruchika , SKIME, Robert, M. , SCOTT, Erik, R. , RANDALL, James, E.
CPC分类号： A61N1/375 , A61N1/3605 , A61N1/3754 , A61N1/3758
摘要： At least one surface (120,126) of an implantable medical device (10,90,100) is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4.5 and 9.5 centimeters, and is preferably approximately equal to 7 centimeters. The implantable medical device comprises a plurality of interconnected modules (30,32,34), and an overmold (48,92,102) that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing (36,38,40), and at least one surface of at least one of the housings may be concave along at least one axis.
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公开(公告)号：EP1578498A1
公开(公告)日：2005-09-28
申请号：EP03796790.8
申请日：2003-12-09
申请人： MEDTRONIC, INC.
发明人： SINGHAL, Ruchika , JANZIG, Darren, A. , WAHLSTRAND, Carl, D. , SKIME, Robert, M. , OLSON, Paulette, C.
CPC分类号： A61N1/375 , A61N1/3605 , A61N1/3754 , A61N1/3758
摘要： A modular implantable medical device (101, 201, 301, 401, 801, 901, 1001, 1101, 1201, 1301) permits implantable medical devices to have a smaller profile in order to better fit into locations within the human body. A modular implantable medical device separates various functional components of the implantable medical device into a set of interconnected modules (201-212, 410-412, 510, 701-702, 810). This distributed architecture of a modular implantable medical device may permit the device footprint to be distributed over a larger area while making the profile smaller, and may permit the overall shape of the implantable medical device to better match the body location into which it is to be implanted. An overmold (214, 322, 422, 522, 822, 922, 1022, 1122, 1222, 1322) integrates the modules of a modular implantable medical device into a single structure. In some embodiments the overmold is flexible and provides a biocompatible interface from the component modules and the patient, while restraining potentially harmful intermodule motion.
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公开(公告)号：EP1578493A1
公开(公告)日：2005-09-28
申请号：EP03787284.3
申请日：2003-12-09
申请人： MEDTRONIC, INC.
CPC分类号： A61N1/375 , A61N1/3605 , A61N1/3754 , A61N1/3758
摘要： An implantable medical device (10, 80, 90, 120, 130, 140, 150, 170, 180) includes a plurality of separately housed and flexibly interconnected modules (30, 32, 34, 172, 182). A first module (30) includes a control electronics within a first housing (36), and may be coupled to a second module (32) that includes a second housing (38) by a flexible interconnect member (44, 46, 174, 184). In some embodiments, an overmold (48, 82, 92, 122, 132, 176, 186), which may be flexible, at least partially encapsulates the first and second housings. The second module may be a power source module that includes a power source, such as a rechargeable battery, within the second housing. The implantable medical device may also include a third module, such as a recharge module that includes a coil within a third housing. The overmold may at lest partially encapsulate the third housing, or the third module may be tethered to the overmold by a flexible tether member (124). A flexible interconnect member and/or flexible overmold may allow multiples degrees of freedom of movement between modules of an implantable medical device.
摘要翻译： 可植入医疗装置（10,80,90,120,130,140,150,170,180）包括多个单独容纳且柔性互连的模块（30,32,34,172,182）。 第一模块（30）包括位于第一壳体（36）内的控制电子器件，并且可以通过柔性互连构件（44,46,174,184）耦合到包括第二壳体（38）的第二模块（32） ）。 在一些实施例中，可以是柔性的包覆模制件（48,82,92,122,132,176,186）至少部分地包封第一壳体和第二壳体。 第二模块可以是在第二壳体内包括诸如可再充电电池的电源的电源模块。 可植入医疗装置还可以包括第三模块，例如包括第三外壳内的线圈的再充电模块。 包胶模可以部分地包封第三壳体，或者第三模块可以通过柔性系绳构件（124）系连到包覆模制件。 柔性互连件和/或柔性包覆模制件可允许可植入医疗设备的模块之间的多个运动自由度。
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公开(公告)号：EP1626773B1
公开(公告)日：2009-03-11
申请号：EP04752173.7
申请日：2004-05-12
申请人： MEDTRONIC, INC.
CPC分类号： A61N1/3787
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公开(公告)号：EP1890764A1
公开(公告)日：2008-02-27
申请号：EP06750269.0
申请日：2006-04-12
申请人： MEDTRONIC, INC.
CPC分类号： A61B5/053 , A61B5/04012 , A61B5/0402 , A61B5/103 , A61N1/36071 , A61N1/36521 , A61N1/37247 , G06F19/00 , G16H40/63
摘要： Techniques for selectably providing either constant voltage or constant current stimulation are described. A programming device provides a user interface by which a user selects either constant voltage or constant current stimulation, and selects either a voltage or current amplitude based on the selected stimulation mode. The programming device configures a medical device to provide the selected mode of stimulation at the selected amplitude. For example, when a medical device has constant voltage stimulation circuitry, e.g., circuitry including a voltage source, and the user selects constant current stimulation, the programming device configures the medical device to adjust the voltage amplitude based on a measured impedance to provide substantially constant current amplitude.
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公开(公告)号：EP1861162A1
公开(公告)日：2007-12-05
申请号：EP06734238.6
申请日：2006-02-02
申请人： MEDTRONIC, INC.
IPC分类号： A61N1/05
CPC分类号： A61N1/0504 , A61N1/0456 , A61N1/0476 , A61N1/0492 , A61N1/0502 , A61N1/36071 , A61N1/3756
摘要： The disclosure describes an implantable neurostimulator device for delivery of neurostimulation to treat head, neck, or facial pain or tension, including pain or tension caused by occipital neuralgia. The device may be a neurostimulation device having a miniaturized housing with a low profile that permits subcutaneous implantation at a stimulation site directly adjacent a neuralgic region at the back of the neck of a patient. For example, the device may be subcutaneously implanted at the back of the neck of a patient to relieve symptoms of occipital neuralgia.
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公开(公告)号：EP1699526A1
公开(公告)日：2006-09-13
申请号：EP04813524.8
申请日：2004-12-09
申请人： MEDTRONIC, INC.
发明人： COBIAN, Kenneth, E. , RIES, Richard, D. , DONOVAN, Maura, G. , SPARER, Randall, V. , SKIME, Robert, M. , SINGHAL, Ruchika , LENT, Mark, S. , HOOPER, William, J. , HOBOT, Christopher, M. , HERUTH, Kenneth, T.
CPC分类号： A61N1/375 , A61L27/34 , A61L27/54 , A61L31/10 , A61L31/16 , A61L2300/406 , A61N1/3605
摘要： An anti-infective covering for an implantable medical device is described. The covering may be a polymeric boot that comprises an anti-infective agent in an amount effective to prevent an infection when implanted in a pocket of a patient. The boot is configured to snuggly engage at least a portion of the implantable medical device. The boot may contain a side hole that allows a housing of the implantable medical device to serve as a return electrode. The boot may be placed about the implantable medical device to render the device anti-infective.
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公开(公告)号：EP1578494B1
公开(公告)日：2010-05-26
申请号：EP03787285.0
申请日：2003-12-09
申请人： Medtronic, Inc.
CPC分类号： A61N1/375 , A61N1/3605 , A61N1/3754 , A61N1/3758
摘要： A modular implantable medical device (101, 201, 301, 401, 501, 601, 701, 801) includes two or more interconnected modules (103-105, 210-212, 410-412, 510-512, 610, 710-712, 810, 910) and an overmold (106, 214, 302, 413, 522, 622, 722, 822) that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module (213A-B, 303A-B, 415A-B, 613, 813) for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.
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公开(公告)号：EP1624927B1
公开(公告)日：2010-05-05
申请号：EP04751951.7
申请日：2004-05-12
申请人： Medtronic, Inc.
CPC分类号： A61N1/375
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