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    IMPLANTABLE MEDICAL LEAD
    2.
    发明授权
    IMPLANTABLE MEDICAL LEAD 有权
    可植入医疗领导

    公开(公告)号：EP1904154B1

    公开(公告)日：2011-01-26

    申请号：EP06760740.8

    申请日：2006-06-09

    申请人： Medtronic, Inc.

    发明人： ROONEY, Ethan, A. ,  WAHLSTRAND, Carl, D. ,  KING, Gary, W. ,  CROSS, Thomas, E. ,  STONE, Richard, T.

    IPC分类号： A61N1/05

    CPC分类号： A61N1/0531 ,  A61N1/0534 ,  A61N1/0553 ,  A61N1/36071 ,  A61N1/37211

    摘要： The disclosure describes an implantable medical lead for delivering stimulation to a patient. Electrodes may be located on two or more surfaces of the lead to, for example, selectively deliver stimulation to one or more tissue layers within the patient. The lead may be implanted within or between intra-dermal, deep dermal, or subcutaneous tissue layers, and may be used to, for example, deliver peripheral nerve field stimulation to treat pain experienced by the patient at the site at which the lead is implanted. The lead may comprise a paddle lead or a multiple level lead, e.g., a lead having a plurality of flat or paddle shaped lead bodies arranged in substantially parallel planes. Further, the lead may include fixation structures on the distal end, proximal end, or both ends to prevent migration.

    摘要翻译： 本公开描述了用于向患者传递刺激的可植入医疗导线。 电极可以位于引线的两个或更多个表面上，以例如选择性地向患者体内的一个或多个组织层递送刺激。 引线可以被植入到真皮内，深层真皮或皮下组织层内或真皮层，深层真皮层或皮下组织层内，并且可以用于例如递送周围神经区刺激以治疗患者在植入引线的部位所经历的疼痛 。 引线可以包括桨形引线或多级引线，例如具有布置在基本上平行的平面中的多个扁平或桨形引线体的引线。 此外，引线可以在远端，近端或两端包括固定结构以防止迁移。

    CRANIAL IMPLANT
    3.
    发明公开
    CRANIAL IMPLANT 审中-公开

    公开(公告)号：EP2019716A1

    公开(公告)日：2009-02-04

    申请号：EP07749161.1

    申请日：2007-01-25

    申请人： MEDTRONIC, INC.

    发明人： WAHLSTRAND, Carl, D.

    IPC分类号： A61N1/375 ,  A61N1/36

    CPC分类号： A61B5/0478 ,  A61B5/6868 ,  A61N1/0529 ,  A61N1/0534 ,  A61N1/0539 ,  A61N1/3605 ,  A61N1/3606 ,  A61N1/36082 ,  A61N1/36135 ,  A61N1/375

    摘要： Implantable medical devices (IMD) configured for implantation within a recess formed in a cranium of a patient, as well as associated methods, are described. In some embodiments, the IMD includes a top external surface and another adjacent external surface, e.g., a side surface, which are oriented with respect to each other to define an acute angle. A connection module for an electrical lead or catheter may be included on the top external surface. Embodiments of the invention may facilitate implantation of an IMD within a recess formed in the cranium of a patient at a location remote to an incision made in the scalp of the patient.

    摘要翻译： 描述了被配置用于植入患者头盖中形成的凹陷内的可植入医疗装置（IMD）以及相关方法。 在一些实施例中，IMD包括顶部外表面和另一相邻外表面，例如侧表面，所述外表面相对于彼此定向以限定锐角。 用于电引线或导管的连接模块可以包括在顶部外表面上。 本发明的实施例可促进IMD在远离患者头皮中形成的切口的位置处的患者头盖中形成的凹陷内植入IMD。

    CONCAVITY OF AN IMPLANTABLE MEDICAL DEVICE
    7.
    发明公开
    CONCAVITY OF AN IMPLANTABLE MEDICAL DEVICE 审中-公开
    凹部可植入医疗装置

    公开(公告)号：EP1578500A1

    公开(公告)日：2005-09-28

    申请号：EP03812860.9

    申请日：2003-12-09

    申请人： MEDTRONIC, INC.

    发明人： WAHLSTRAND, Carl, D. ,  JANZIG, Darren, A. ,  SINGHAL, Ruchika ,  SKIME, Robert, M. ,  SCOTT, Erik, R. ,  RANDALL, James, E.

    IPC分类号： A61N1/375 ,  A61N1/36

    CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

    摘要： At least one surface (120,126) of an implantable medical device (10,90,100) is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4.5 and 9.5 centimeters, and is preferably approximately equal to 7 centimeters. The implantable medical device comprises a plurality of interconnected modules (30,32,34), and an overmold (48,92,102) that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing (36,38,40), and at least one surface of at least one of the housings may be concave along at least one axis.

    OVERMOLD FOR A MODULAR IMPLANTABLE MEDICAL DEVICE
    8.
    发明公开
    OVERMOLD FOR A MODULAR IMPLANTABLE MEDICAL DEVICE 审中-公开
    模块化植入医疗设备的组成部分

    公开(公告)号：EP1578498A1

    公开(公告)日：2005-09-28

    申请号：EP03796790.8

    申请日：2003-12-09

    申请人： MEDTRONIC, INC.

    发明人： SINGHAL, Ruchika ,  JANZIG, Darren, A. ,  WAHLSTRAND, Carl, D. ,  SKIME, Robert, M. ,  OLSON, Paulette, C.

    IPC分类号： A61N1/375 ,  A61N1/36

    CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

    摘要： A modular implantable medical device (101, 201, 301, 401, 801, 901, 1001, 1101, 1201, 1301) permits implantable medical devices to have a smaller profile in order to better fit into locations within the human body. A modular implantable medical device separates various functional components of the implantable medical device into a set of interconnected modules (201-212, 410-412, 510, 701-702, 810). This distributed architecture of a modular implantable medical device may permit the device footprint to be distributed over a larger area while making the profile smaller, and may permit the overall shape of the implantable medical device to better match the body location into which it is to be implanted. An overmold (214, 322, 422, 522, 822, 922, 1022, 1122, 1222, 1322) integrates the modules of a modular implantable medical device into a single structure. In some embodiments the overmold is flexible and provides a biocompatible interface from the component modules and the patient, while restraining potentially harmful intermodule motion.

    MODULAR IMPLANTABLE MEDICAL DEVICE
    9.
    发明公开
    MODULAR IMPLANTABLE MEDICAL DEVICE 审中-公开
    模块化植入式医疗设备

    公开(公告)号：EP1578493A1

    公开(公告)日：2005-09-28

    申请号：EP03787284.3

    申请日：2003-12-09

    申请人： MEDTRONIC, INC.

    发明人： WAHLSTRAND, Carl, D. ,  SINGHAL, Ruchika ,  SKIME, Robert, M.

    IPC分类号： A61N1/375 ,  A61N1/36

    CPC分类号： A61N1/375 ,  A61N1/3605 ,  A61N1/3754 ,  A61N1/3758

    摘要： An implantable medical device (10, 80, 90, 120, 130, 140, 150, 170, 180) includes a plurality of separately housed and flexibly interconnected modules (30, 32, 34, 172, 182). A first module (30) includes a control electronics within a first housing (36), and may be coupled to a second module (32) that includes a second housing (38) by a flexible interconnect member (44, 46, 174, 184). In some embodiments, an overmold (48, 82, 92, 122, 132, 176, 186), which may be flexible, at least partially encapsulates the first and second housings. The second module may be a power source module that includes a power source, such as a rechargeable battery, within the second housing. The implantable medical device may also include a third module, such as a recharge module that includes a coil within a third housing. The overmold may at lest partially encapsulate the third housing, or the third module may be tethered to the overmold by a flexible tether member (124). A flexible interconnect member and/or flexible overmold may allow multiples degrees of freedom of movement between modules of an implantable medical device.

    摘要翻译： 可植入医疗装置（10,80,90,120,130,140,​​150,170,180）包括多个单独容纳且柔性互连的模块（30,32,34,172,182）。 第一模块（30）包括位于第一壳体（36）内的控制电子器件，并且可以通过柔性互连构件（44,46,174,184）耦合到包括第二壳体（38）的第二模块（32） ）。 在一些实施例中，可以是柔性的包覆模制件（48,82,92,122,132,176,186）至少部分地包封第一壳体和第二壳体。 第二模块可以是在第二壳体内包括诸如可再充电电池的电源的电源模块。 可植入医疗装置还可以包括第三模块，例如包括第三外壳内的线圈的再充电模块。 包胶模可以部分地包封第三壳体，或者第三模块可以通过柔性系绳构件（124）系连到包覆模制件。 柔性互连件和/或柔性包覆模制件可允许可植入医疗设备的模块之间的多个运动自由度。