公开(公告)号：EP3125254A4

公开(公告)日：2017-11-08

申请号：EP15770214

申请日：2015-03-27

申请人： MITSUBISHI MATERIALS CORP ,  MITSUBISHI MAT ELECTRONIC CHEMICALS CO LTD

发明人： HIGANO SATOKO ,  YAMASAKI KAZUHIKO ,  KAGEYAMA KENSUKE ,  TSUKADA HIROKAZU

IPC分类号： H01B1/22 ,  C08K3/38 ,  C08K5/17 ,  C08K5/3445 ,  C08K9/02 ,  C08L63/00 ,  C09D11/52 ,  H01B1/00 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC分类号： H01B1/02 ,  C08K9/12 ,  C08K2003/0806 ,  C08L63/00 ,  C09D11/037 ,  C09D11/102 ,  C09D11/52 ,  H01B1/22 ,  H05K1/095

摘要： A conductive paste includes: a silver-coated resin; and an organic vehicle that includes a thermosetting resin composition, a curing agent, and a solvent, in which the thermosetting resin composition is an epoxy resin composition which is solid at room temperature and has a melt viscosity of 0.5 Pa·s or lower at 150°C, and a mass ratio of a content of the thermosetting resin composition to a content of the silver-coated resin is 10 to 40:60 to 90.

公开(公告)号：EP3118159A4

公开(公告)日：2017-08-30

申请号：EP15761609

申请日：2015-03-11

申请人： MITSUBISHI MATERIALS CORP

发明人： MASUYAMA KOUTARO ,  HIGANO SATOKO ,  YAMASAKI KAZUHIKO

IPC分类号： C01B33/12 ,  B01D71/02 ,  C01B33/14

CPC分类号： C01B33/126 ,  B01D53/228 ,  B01D67/0048 ,  B01D71/027 ,  B01D2325/02 ,  B01J21/08 ,  B01J35/0013 ,  B01J37/0215 ,  B01J37/0236 ,  C09D1/00

摘要： A liquid composition for forming a silica porous film of the invention is prepared by mixing a hydrolyzate of tetramethoxysilane or tetraethoxysilane as a silicon alkoxide with a silica sol in which fumed silica particles having primary particles having a mean particle diameter of 40 nm or less and secondary particles having a mean particle diameter of 20 nm to 400 nm, that is greater than the mean particle diameter of the primary particles, are dispersed in a liquid medium, in which the mass ratio (A/B) of the SiO 2 content (B) of the silica sol to the SiO 2 content (A) in the hydrolyzate is in a range of 1/99 to 60/40.

摘要翻译： 本发明的二氧化硅多孔质膜形成用液状组合物通过将作为硅醇盐的四甲氧基硅烷或四乙氧基硅烷的水解物，与平均粒径为40nm以下的一次粒子的二氧化硅粒子和二次粒子 将平均粒径为20nm〜400nm的比一次粒子的平均粒径大的粒子分散在SiO 2含量（B）的质量比（A / B） ）的硅溶胶与水解产物中的SiO 2含量（A）之比在1/99至60/40的范围内。