公开(公告)号：EP3188314A4

公开(公告)日：2018-04-25

申请号：EP15835308

申请日：2015-08-18

申请人： MITSUI MINING AND SMELTING CO LTD

发明人： KAMIKORIYAMA YOICHI ,  YAMAUCHI SHINICHI ,  YOSHIDA MAMI ,  NAKAYAMA SHIGEKI

IPC分类号： H01R4/02 ,  H01B1/22 ,  H01R11/01 ,  H05K3/32

CPC分类号： H01B1/026 ,  C08K3/08 ,  C08K9/06 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/003 ,  H01B1/22 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/11

摘要： To provide a connection structure (10) including two conductors (21, 31) and a copper connection (11) electrically connecting the conductors. The connection (11) is made mainly of copper. The connection (11) has a plurality of voids. The connection (11) contains an organosilicon compound in the voids. The connection preferably has a microstructure including an aggregate of a plurality of particles that are fused and bonded to each other to form a neck therebetween. Preferably, the connection has a microstructure including a plurality of large-diameter copper particles having a relatively large diameter and small-diameter copper particles having a smaller diameter than the large-diameter copper particles, the large-diameter copper particles each being fused and bonded to the small-diameter copper particles, the small-diameter copper particles being fused and bonded to each other, and a plurality of the small-diameter copper particles being located around the large-diameter copper particle.