公开(公告)号：EP2958408A1

公开(公告)日：2015-12-23

申请号：EP13874923.9

申请日：2013-02-12

申请人： Meiko Electronics Co., Ltd.

发明人： SHIMADA, Hiroshi ,  TODA, Mitsuaki ,  MATSUMOTO, Tohru

IPC分类号： H05K3/46

CPC分类号： H05K3/20 ,  C23F1/00 ,  H05K1/0298 ,  H05K1/185 ,  H05K1/188 ,  H05K3/22 ,  H05K3/4611 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09009 ,  H05K2201/10636 ,  H05K2203/11 ,  Y02P70/611

摘要： A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12).

摘要翻译： 一种器件嵌入式衬底（15）包括绝缘层（12），其包括绝缘树脂材料，嵌入在绝缘层（12）中的电子或电子器件（4），金属膜（9） 以及通过使金属膜（9）的至少一部分表面粗糙化而形成的粗糙部（10）。 优选地，所述器件嵌入式衬底（15）还包括：至少在底面（7）上图案形成的导电层（6），所述底面（7）是所述绝缘层（12）的一个面; 以及由与所述绝缘层（12）不同的材料制成并且将所述导电层（6）和安装面（8）接合的接合剂（3），所述安装面（8）是所述装置（4）的一个面， 。 金属膜（9）仅形成在与安装面（8）相反的面上，粘接剂（3）的厚度比从金属膜（9）到顶面（11）的厚度小， 所述顶面（11）是所述绝缘层（12）的另一面。

公开(公告)号：EP3162172A4

公开(公告)日：2018-02-28

申请号：EP15814407

申请日：2015-06-26

申请人： 3M INNOVATIVE PROPERTIES CO

发明人： STAY MATTHEW S ,  SMITH MATTHEW R ,  PEKUROVSKY MIKHAIL L ,  STRAND JOHN T ,  DAVID MOSES M ,  JERRY GLEN A ,  STARKEY JAMES R ,  KAWAKAMI ELLISON ,  STENSVAD KARL K

IPC分类号： G06F3/044 ,  H05K1/02 ,  H05K3/04

CPC分类号： H05K3/048 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/06 ,  H05K3/22 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0108 ,  H05K2203/095 ,  H05K2203/11

摘要： Electrically conductive patterns formed on a substrate are provided with a reduced visibility. A region of a major surface of the substrate is selectively roughened to form a roughened pattern on the major surface of the substrate. Electrically conductive traces are directly formed on the roughened region and are conformal with the roughened pattern on the major surface of the substrate.

公开(公告)号：EP3188314A1

公开(公告)日：2017-07-05

申请号：EP15835308.6

申请日：2015-08-18

申请人： Mitsui Mining and Smelting Co., Ltd.

发明人： KAMIKORIYAMA, Yoichi ,  YAMAUCHI, Shinichi ,  YOSHIDA, Mami ,  NAKAYAMA, Shigeki

IPC分类号： H01R4/02 ,  H01B1/22 ,  H01R11/01 ,  H05K3/32

CPC分类号： H01B1/026 ,  C08K3/08 ,  C08K9/06 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/003 ,  H01B1/22 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/4007 ,  H05K2201/0239 ,  H05K2201/0272 ,  H05K2203/11 ,  H05K2203/1131 ,  H05K2203/121

摘要： To provide a connection structure (10) including two conductors (21, 31) and a copper connection (11) electrically connecting the conductors. The connection (11) is made mainly of copper. The connection (11) has a plurality of voids. The connection (11) contains an organosilicon compound in the voids. The connection preferably has a microstructure including an aggregate of a plurality of particles that are fused and bonded to each other to form a neck therebetween. Preferably, the connection has a microstructure including a plurality of large-diameter copper particles having a relatively large diameter and small-diameter copper particles having a smaller diameter than the large-diameter copper particles, the large-diameter copper particles each being fused and bonded to the small-diameter copper particles, the small-diameter copper particles being fused and bonded to each other, and a plurality of the small-diameter copper particles being located around the large-diameter copper particle.

摘要翻译： 为了提供包括两个导体（21,31）和电连接导体的铜连接（11）的连接结构（10）。 连接（11）主要由铜制成。 连接（11）具有多个空隙。 连接（11）在空隙中含有有机硅化合物。 该连接部优选具有微结构，该微结构包括彼此融合并结合以在其间形成颈部的多个颗粒的聚集体。 优选地，所述连接部具有微结构，所述微结构包括多个具有相对较大直径的大直径铜颗粒和具有比所述大直径铜颗粒小的直径的小直径铜颗粒，所述大直径铜颗粒各自熔合并结合 小直径铜粒子彼此融合而接合，多个小直径铜粒子位于大直径铜粒子的周围。

公开(公告)号：EP3325264A1

公开(公告)日：2018-05-30

申请号：EP16741600.7

申请日：2016-07-18

申请人： Rogers Germany GmbH

发明人： MEYER, Andreas ,  SCHMIDT, Karsten

IPC分类号： B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B9/06 ,  B32B29/08

CPC分类号： B32B9/005 ,  B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/041 ,  B32B9/06 ,  B32B15/043 ,  B32B15/12 ,  B32B15/20 ,  B32B29/002 ,  B32B29/08 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/54 ,  B32B2457/08 ,  B32B2605/00 ,  C25D11/005 ,  C25D11/04 ,  C25D11/08 ,  C25D17/12 ,  H01L23/3735 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/053 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0338 ,  H05K2203/0315 ,  H05K2203/11 ,  H05K2203/1126

摘要： The invention relates to a substrate (1, 10) for electrical circuits, comprising at least one metal layer (2, 3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2, 3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a', 6a'', 6b', 6b'') to the metal layer (2, 3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a', 6a'', 6b', 6b'').

公开(公告)号：EP2958408A4

公开(公告)日：2016-11-30

申请号：EP13874923

申请日：2013-02-12

申请人： MEIKO ELECTRONICS CO LTD

发明人： SHIMADA HIROSHI ,  TODA MITSUAKI ,  MATSUMOTO TOHRU

IPC分类号： H05K3/46

CPC分类号： H05K3/20 ,  C23F1/00 ,  H05K1/0298 ,  H05K1/185 ,  H05K1/188 ,  H05K3/22 ,  H05K3/4611 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09009 ,  H05K2201/10636 ,  H05K2203/11 ,  Y02P70/611

摘要： A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12).

公开(公告)号：EP3325265A1

公开(公告)日：2018-05-30

申请号：EP16745646.6

申请日：2016-07-18

申请人： Rogers Germany GmbH

发明人： MEYER, Andreas ,  SCHMIDT, Karsten

IPC分类号： B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B9/06 ,  B32B29/08 ,  C25D7/00 ,  H01L23/373 ,  H05K3/00

CPC分类号： B32B9/005 ,  B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/041 ,  B32B9/06 ,  B32B15/043 ,  B32B15/12 ,  B32B15/20 ,  B32B29/002 ,  B32B29/08 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/54 ,  B32B2457/08 ,  B32B2605/00 ,  C25D11/005 ,  C25D11/04 ,  C25D11/08 ,  C25D17/12 ,  H01L23/3735 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/053 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0338 ,  H05K2203/0315 ,  H05K2203/11 ,  H05K2203/1126

摘要： The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodised for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2') or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6').

公开(公告)号：EP3188314A4

公开(公告)日：2018-04-25

申请号：EP15835308

申请日：2015-08-18

申请人： MITSUI MINING AND SMELTING CO LTD

发明人： KAMIKORIYAMA YOICHI ,  YAMAUCHI SHINICHI ,  YOSHIDA MAMI ,  NAKAYAMA SHIGEKI

IPC分类号： H01R4/02 ,  H01B1/22 ,  H01R11/01 ,  H05K3/32

CPC分类号： H01B1/026 ,  C08K3/08 ,  C08K9/06 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/003 ,  H01B1/22 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/11

摘要： To provide a connection structure (10) including two conductors (21, 31) and a copper connection (11) electrically connecting the conductors. The connection (11) is made mainly of copper. The connection (11) has a plurality of voids. The connection (11) contains an organosilicon compound in the voids. The connection preferably has a microstructure including an aggregate of a plurality of particles that are fused and bonded to each other to form a neck therebetween. Preferably, the connection has a microstructure including a plurality of large-diameter copper particles having a relatively large diameter and small-diameter copper particles having a smaller diameter than the large-diameter copper particles, the large-diameter copper particles each being fused and bonded to the small-diameter copper particles, the small-diameter copper particles being fused and bonded to each other, and a plurality of the small-diameter copper particles being located around the large-diameter copper particle.

公开(公告)号：EP3162172A1

公开(公告)日：2017-05-03

申请号：EP15814407.1

申请日：2015-06-26

申请人： 3M Innovative Properties Company

发明人： STAY, Matthew S. ,  SMITH, Matthew R. ,  PEKUROVSKY, Mikhail L. ,  STRAND, John T. ,  DAVID, Moses M. ,  JERRY, Glen A. ,  STARKEY, James R. ,  KAWAKAMI, Ellison ,  STENSVAD, Karl K.

IPC分类号： H05K1/02 ,  H05K3/06

CPC分类号： H05K3/048 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/06 ,  H05K3/22 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0108 ,  H05K2203/095 ,  H05K2203/11

摘要： Electrically conductive patterns formed on a substrate are provided with a reduced visibility. A region of a major surface of the substrate is selectively roughened to form a roughened pattern on the major surface of the substrate. Electrically conductive traces are directly formed on the roughened region and are conformal with the roughened pattern on the major surface of the substrate.

摘要翻译： 电形成在衬底的导电图案设置有能见度降低。 衬底的主表面的区域被选择性地粗糙化，以在基板上形成的主表面上的粗糙图案。 导电迹线被直接形成在粗糙化区域，并且保形与在基板的主表面上的粗糙图案。