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公开(公告)号：EP1749334A1
公开(公告)日：2007-02-07
申请号：EP05755116.0
申请日：2005-05-27
申请人： MOLEX INCORPORATED
CPC分类号： H01R4/028 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81012 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01R12/52 , H01R12/57 , H01R12/714 , H01R13/2407 , H01R13/2464 , H05K3/325 , H05K2201/0311 , H05K2201/10265 , H05K2201/10719 , H05K2201/10946 , H01L2224/29099 , H01L2224/05599
摘要： Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (23, 80, 82) and a microelectronic device package (88). Each ring is formed to have at least one protuberance (20) on the a ring's exterior surface. The protuberance has an apex (22) or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
摘要翻译： 多个小的导电且柔性的空心环（10），每个都由柔韧材料制成，提供用于基底（23,80,82）和微电子器件封装（88）之间的柔性连接介质。 每个环形成为在环的外表面上具有至少一个突起（20）。 突起具有顶点（22）或顶点，当顶着表面放置时，当环被径向作用在环上的力压缩时，它将擦洗或刮擦表面。 通过擦洗与顶点的接触表面，可以去除可能干扰电信号的表面污染物和分层材料。
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公开(公告)号：EP1749334B1
公开(公告)日：2007-11-14
申请号：EP05755116.0
申请日：2005-05-27
申请人： MOLEX INCORPORATED
CPC分类号： H01R4/028 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81012 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01R12/52 , H01R12/57 , H01R12/714 , H01R13/2407 , H01R13/2464 , H05K3/325 , H05K2201/0311 , H05K2201/10265 , H05K2201/10719 , H05K2201/10946 , H01L2224/29099 , H01L2224/05599
摘要： Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (23, 80, 82) and a microelectronic device package (88). Each ring is formed to have at least one protuberance (20) on the a ring's exterior surface. The protuberance has an apex (22) or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
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公开(公告)号：EP1766726A1
公开(公告)日：2007-03-28
申请号：EP05754814.1
申请日：2005-05-27
申请人： Molex Incorporated
CPC分类号： H01R12/714 , H01R4/028 , H01R12/52 , H01R12/57 , H01R13/24 , H01R13/2414 , H05K3/305 , H05K3/3436 , H05K2201/0133 , H05K2201/0311 , H05K2201/10242 , H05K2201/10257 , H05K2201/10378 , H05K2201/10424 , H05K2201/10977 , H05K2201/2081 , Y02P70/613
摘要： Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (8) and a microelectronic device package (4). Each ring is soldered to both the substrate and the device. A portion (20, 22) of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
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