公开(公告)号：EP2532216A4

公开(公告)日：2018-04-11

申请号：EP11740411

申请日：2011-02-04

Applicant: BLACK TANK LLC

Inventor： KODADEK III ROBERT E

IPC: H05K1/02 ,  F21V29/67 ,  F21Y115/10

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

公开(公告)号：EP3388889A1

公开(公告)日：2018-10-17

申请号：EP18166348.5

申请日：2018-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： OH, Sang-Gi ,  WI, Sang Hyuk ,  YU, Chang Geun ,  HONG, Sang Ho

IPC: G02F1/1333 ,  G06F1/16

CPC classification number: H05K1/142 ,  G02B6/0055 ,  G02B6/0085 ,  G02F1/133308 ,  G02F1/13452 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  G06F1/1601 ,  G06F1/1637 ,  G06F1/20 ,  H01P3/122 ,  H01P11/002 ,  H04N5/64 ,  H05K1/0237 ,  H05K1/0274 ,  H05K1/18 ,  H05K5/0017 ,  H05K2201/10098 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10189 ,  H05K2201/10257

Abstract: A display apparatus (1) includes a display panel (10); a backlight (70) configured to provide light to the display panel (10); a heat sink (80) configured to absorb heat generated by the backlight (70); a bottom chassis (50) configured to support the backlight (70) and the heat sink (80); a first circuit board (91) mounted on the bottom chassis (50); a second circuit board (92) mounted on the bottom chassis (50); and a waveguide (100) formed between the first circuit board and the second circuit board for wireless communication between the first and second circuit boards (91, 92).

公开(公告)号：EP2076100B1

公开(公告)日：2010-11-10

申请号：EP09003831.6

申请日：2006-01-24

Applicant: JUMATECH GmbH

Inventor： Wölfel, Markus

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

公开(公告)号：EP1842402B1

公开(公告)日：2009-03-18

申请号：EP06706388.3

申请日：2006-01-24

Applicant: JUMATECH GmbH

Inventor： WÖLFEL, Markus

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising conductors (6) that run on and/or in the circuit board or card between connection points (4). The aim of the invention is to improve a circuit board of this type. To achieve this, at least one of the conductors (6) has a rectangular or square cross-section. In addition, at least some of the conductors have a hollow cross-section, in which a coolant or heating agent circulates.

公开(公告)号：EP1041616A1

公开(公告)日：2000-10-04

申请号：EP98953052.2

申请日：1998-11-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： TAKEZAWA, Hiroaki ,  TSUKAMOTO, Masahide ,  ITAGAKI, Minehiro ,  BESSHO, Yoshihiro ,  HATANAKA, Hideo ,  FUKUMURA, Yasushi ,  EDA, Kazuo ,  ISHIDA, Toru

IPC: H01L21/60 ,  H01L21/768

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

Abstract: A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

Abstract translation: 一种应用松弛型电子部件，其安装在电路板上，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于所述电子部件要连接的连接部分的一侧 到所述电路板，并且所述应力松弛机构构件是导电的。

公开(公告)号：EP3387888A1

公开(公告)日：2018-10-17

申请号：EP16806015.0

申请日：2016-11-28

Applicant: Philips Lighting Holding B.V.

Inventor： DIJKEN, Durandus Kornelius ,  EGGINK, Hendrik Jan

IPC: H05K1/02

CPC classification number: H05K1/0272 ,  F21V29/83 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/021 ,  H05K3/445 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10257

Abstract: An assembly (1) is disclosed, comprising at least one electrical device (5) and at least one carrier substrate (2) arranged to support the at least one electrical device (5). The at least one carrier substrate (2) is arranged with at least one tubular structure (6), which is at least in part hollow and arranged so as to permit passage of fluid through the at least one carrier substrate (2), for example between a first side (3) of the carrier substrate (2) and a second side (4) of the carrier substrate (2), and wherein the at least one tubular structure (6) is arranged such that it has an extension so that it protrudes a predefined distance from at least one of the first side (3) and the second side (4). A lighting device comprising the assembly (1) and a method (30) for manufacturing the assembly (1) are also disclosed.

公开(公告)号：EP3170376A1

公开(公告)日：2017-05-24

申请号：EP15759501.8

申请日：2015-07-09

Applicant: Valeo Equipements Electriques Moteur

Inventor： GUERIN, Fabien ,  CANCIANI, Thierry ,  DUARTE, Johnny

IPC: H05K1/05 ,  H05K3/34 ,  H05K7/20 ,  H05K7/14 ,  H02K11/00 ,  F02B39/00

CPC classification number: H05K7/1432 ,  F02B33/40 ,  F02B39/10 ,  F04D25/068 ,  F04D25/0693 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K1/05 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/445 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2201/10962 ,  Y02P70/611

Abstract: The invention relates to an electric supercharging compressor comprising: a rotary electric machine (200) intended to drive the compressor, a power supply device intended to power the rotary electric machine (200) and configured to be mounted on a housing (50) of the compressor, said power supply device comprising at least one electronic component (30), said electronic component (30) being mounted on one side of the power supply device so that the electronic component is positioned above the rotary electric machine (200).

Abstract translation: 本发明涉及一种电动增压压缩机，其包括：用于驱动压缩机的旋转电机（200），用于为旋转电机（200）供电并且被配置为安装在电动机（200）的壳体（50）上的电源装置 所述电源装置包括至少一个电子部件（30），所述电子部件（30）安装在所述电源装置的一侧上，使得所述电子部件位于所述旋转电机（200）的上方。

公开(公告)号：EP3047707A1

公开(公告)日：2016-07-27

申请号：EP14844739.4

申请日：2014-06-02

Applicant: Advantec Sensing AS

Inventor： GUNDERSEN, Tore

IPC: H05K1/14 ,  G01F23/26 ,  G01N27/22 ,  H05K7/02 ,  H05K7/20

CPC classification number: H01R12/58 ,  G01D5/24 ,  G01F23/265 ,  G01F23/268 ,  H01R43/0256 ,  H05K1/0201 ,  H05K1/144 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10303 ,  H05K2201/10356 ,  H05K2201/1059 ,  H05K2201/2036

Abstract: Connecting a capacitive measuring probe at elevated temperatures is achieved by direct attachment of metallic connecting components on a temperature substrate. A method and apparatus for a high temperature cable to circuit board connection involves a set or plurality of connecting elements that are soldered directly on the circuit board and a set or plurality of mating connecting elements that are soldered to a secondary circuit board having soldering pads for a cable.

Abstract translation: 连接在高温下的电容测量探头是通过在温度基底金属连接部件的直接连接来实现。 一种用于高温电缆到电路板的连接方法和装置涉及到一组或连接元件的多元性并在电路板和配合连接元件的一组或多元直接焊接也被焊接到具有用于焊盘的次级电路板 电缆。

公开(公告)号：EP1043920A2

公开(公告)日：2000-10-11

申请号：EP00302525.1

申请日：2000-03-28

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Heinrich, Randy Thomas ,  Rozman, Allen Frank ,  Truong, Thang D. ,  Woods, William Lonzo, Jr.

IPC: H05K3/34 ,  H05K1/16

CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Abstract translation: 一种可表面安装的电源及其制造方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）上部电气部件，其具有安装在上部导电层上的第二焊盘上的第二引线，（4）位于第一引线附近的焊料， 所述较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，所述平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述衬底的孔并且靠近所述绕组设置的芯体，以及（6）衬底间导电安装件，其耦合到所述下导电层，所述衬底的导电层由熔点高于焊料回流温度的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

公开(公告)号：EP0901695A4

公开(公告)日：2000-04-12

申请号：EP97926707

申请日：1997-05-22

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  DISTEFANO THOMAS H ,  KARAVAKIS KONSTANTINE ,  FARACI ANTHONY B ,  NGUYEN TAN

IPC: H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R9/09

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1061 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A connector (10) for microelectronic elements includes a sheetlike body (24) having a plurality of active contacts (22) arranged in a regular grid pattern. The active contacts (22) may include several metallic projections (28) extending inwardly around a hole (27) in the sheetlike element (24), on a first major surface (32). A support structure such as a grid array of noncollapsing structural posts (23) is on a second major surface (33), and each of the posts (23) is electrically connected to one of the active contacts (22). The grid array of the posts (23) and the grid array of active contacts (22) are offset from one another so that an active contact (22) is surrounded by several posts (23). The posts (23) support the sheetlike element (24) spaced away from a substrate (41) to which the posts (23) are attached. A microelectronic element (45) having bump leads (46) thereon may be engaged by contacting the bump leads (46) with the active contacts (22), and deflecting the sheetlike element (24) between the bump leads (46) on one side and the posts (23) on the other side.