摘要:
A silicon carbide vertical MOSFET (30, 60) formed on a silicon carbide substrate (35, 65) with portions of epitaxial layers (39, 48 or 69, 78) defining the various transistor electrodes, rather than defining the electrodes with implants and diffusion. An opening (40, 70) is formed in some of the epitaxial layers and a conductive layer (48, 85) is formed therein to electrically connect a drain contact (95) on the rear of the substrate to the components on the front of the substrate.
摘要:
A silicon carbide LOCOS vertical MOSFET formed on a silicon carbide substrate (55) with portions of epitaxial layers (57, 59, 60) defining the various transistor electrodes (83, 85, 87), rather than defining the electrodes with implants and diffusion. Because of the low diffusion rate in silicon carbide, the LOCOS (75) operation can be performed after the doped epitaxial layers are formed.
摘要:
A silicon carbide LOCOS vertical MOSFET formed on a silicon carbide substrate (55) with portions of epitaxial layers (57, 59, 60) defining the various transistor electrodes (83, 85, 87), rather than defining the electrodes with implants and diffusion. Because of the low diffusion rate in silicon carbide, the LOCOS (75) operation can be performed after the doped epitaxial layers are formed.
摘要:
A silicon carbide vertical MOSFET (30, 60) formed on a silicon carbide substrate (35, 65) with portions of epitaxial layers (39, 48 or 69, 78) defining the various transistor electrodes, rather than defining the electrodes with implants and diffusion. An opening (40, 70) is formed in some of the epitaxial layers and a conductive layer (48, 85) is formed therein to electrically connect a drain contact (95) on the rear of the substrate to the components on the front of the substrate.