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1.发明公开Method for implanting an electronic component on a support in order to increase resistance of the assembly to repeated impacts and vibrations and system comprising said component and support 有权以增加过程的电子Komponentes的组件上的支持，以提高结构的电阻以抵抗所带来的冲击和振动
公开(公告)号：EP1694103A3
公开(公告)日：2006-08-30
申请号：EP06110146.5
申请日：2006-02-20
发明人： Aujay, Olivier , Grohando, Claude
CPC分类号： H05K3/303 , H05K1/0271 , H05K3/3457 , H05K2201/09781 , H05K2201/10015 , H05K2201/10651 , H05K2201/2036 , H05K2201/2045 , H05K2203/043 , Y02P70/613
摘要： A method for implanting electronic components on an electronic board (100) proposes that the electronic components (200) be held on an interconnection support (101) having solderable holding pads (104a,104b,104c), distinct from the electrical connection and solder receiving pads (102) on the electronic components. This implantation finds an application in the assembly of surface mounted components/electronic board subject to environments of repeated vibrations and impacts.
摘要翻译： 一种用于在电子板（100）注入的电子部件方法提出那样的电子部件（200）被在互连支承件（101）保持在具有可焊保持垫（104A，104B，104C）从电连接和焊料接收不同 垫（102）上的电子部件。 该注入发现应用在表面的组件，其安装部件/电子板经受反复的振动和冲击的环境中。
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2.发明公开Method for implanting an electronic component on a support in order to increase resistance of the assembly to repeated impacts and vibrations and system comprising said component and support 有权以增加过程的电子Komponentes的组件上的支持，以提高结构的电阻以抵抗冲击和拾取振动和系统，其包括这样的支撑和组件
公开(公告)号：EP1694103A2
公开(公告)日：2006-08-23
申请号：EP06110146.5
申请日：2006-02-20
发明人： Aujay, Olivier , Grohando, Claude
CPC分类号： H05K3/303 , H05K1/0271 , H05K3/3457 , H05K2201/09781 , H05K2201/10015 , H05K2201/10651 , H05K2201/2036 , H05K2201/2045 , H05K2203/043 , Y02P70/613
摘要： A method for implanting electronic components on an electronic board (100) proposes that the electronic components (200) be held on an interconnection support (101) having solderable holding pads (104a,104b,104c), distinct from the electrical connection and solder receiving pads (102) on the electronic components. This implantation finds an application in the assembly of surface mounted components/electronic board subject to environments of repeated vibrations and impacts.
摘要翻译： 一种用于在电子板（100）注入的电子部件方法提出那样的电子部件（200）被在互连支承件（101）保持在具有可焊保持垫（104A，104B，104C）从电连接和焊料接收不同 垫（102）上的电子部件。 该注入发现应用在表面的组件，其安装部件/电子板经受反复的振动和冲击的环境中。
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