公开(公告)号：EP0069390A3

公开(公告)日：1984-11-14

申请号：EP82106033

申请日：1982-07-06

申请人： Matsushita Electronics Corporation

发明人： Nishikawa, Mikio ,  Fujii, Hiroyuki ,  Tateno, Kenichi ,  Yokozawa, Masami

IPC分类号： H01L23/48 ,  H01L23/30

CPC分类号： H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The invention provides a lead frame for a plastic encapsulated semiconductor device wherein one of the external leads connected to a first connecting band extends from one edge of a substrate support which supports a semiconductor substrate and also serves as a heat sink, two strips are connected to a second connecting band from the other edge of the substrate support, a notch is formed between the two strips of the second connecting band to allow proper positioning of the lead frame and to decrease thermal deformation during plastic encapsulation. Further, another lead frame is provided wherein a through hole is formed extending within the substrate support in the direction of thickness thereof in order to allow uniform flow of the resin and to form a thin resin layer on the rear surface of the substrate support.

摘要翻译： 本发明提供了一种用于塑料封装的半导体器件的引线框架，其中连接到第一连接带的外部引线之一从支撑半导体衬底的基板支撑件的一个边缘延伸并且还用作散热器，两个条带连接到 来自基板支撑件的另一边缘的第二连接带，在第二连接带的两个条之间形成切口，以允许引线框架的适当定位并且在塑料封装期间减小热变形。 此外，提供另一个引线框架，其中形成在基板支撑件的厚度方向上延伸的通孔，以允许树脂均匀流动并在基板支撑件的后表面上形成薄树脂层。

公开(公告)号：EP0063811A1

公开(公告)日：1982-11-03

申请号：EP82103521.9

申请日：1982-04-26

申请人： Matsushita Electronics Corporation

发明人： Tateno, Kenichi ,  Yokozawa, Masami ,  Fujii, Hiroyuki ,  Nishikawa, Mikio ,  Katoh, Michio ,  Wada, Fujio

IPC分类号： H01L21/56 ,  H01L23/30 ,  H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T428/12194 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

摘要： method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds (13, 14) at least external leads (6) and strips (15, 16) of a semiconductor device assembly formed using a lead frame which has a first connecting band (9) connected to the external leads extending from one side of a substrate support (2) further used as a heat sink, and a second connecting band (17) connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds (13, 14) and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic (30) into the cavity; and cutting the portions of small cross-sectional areas of the strips which extend outside a plastic encapsulating housing along the end face of the plastic encapsulating housing and cutting a connecting portion between the external leads and the first connecting band.
Also provided is a lead frame having the strips as described above.

公开(公告)号：EP0059926B1

公开(公告)日：1986-10-08

申请号：EP82101605.2

申请日：1982-03-02

申请人： Matsushita Electronics Corporation

发明人： Fujii, Hiroyuki ,  Tateno, Kenichi ,  Nishikawa, Mikio

IPC分类号： H01L21/56 ,  H01L23/30 ,  H01L23/48

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

公开(公告)号：EP0059926A1

公开(公告)日：1982-09-15

申请号：EP82101605.2

申请日：1982-03-02

申请人： Matsushita Electronics Corporation

发明人： Fujii, Hiroyuki ,  Tateno, Kenichi ,  Nishikawa, Mikio

IPC分类号： H01L21/56 ,  H01L23/30 ,  H01L23/48

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed is a method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor. A semiconductor device assembly is formed, using a lead frame an external lead (6) of which extends to one side of a substrate support (2) serving as a heat sink and supporting a semiconductor substrate, (1) and strips (15, 16) of which extend to the other end of the substrate support. The external lead and strips are clamped by upper and lower molds (13, 14) for plastic encapsulation. A connecting portion between the external lead (6) and a connecting band (9) and the strips (15, 16) extending from a plastic encapsulating housing to the outside are cut.
The substrate support (2) is, thus, held properly at the time of plastic encapsulation, preventing bending of the semiconductor device due to injection pressure of the plastic (30). Therefore, a thin film of plastic is uniformly and with high precision formed on a lower surface of the substrate support.

公开(公告)号：EP0063811B1

公开(公告)日：1986-04-16

申请号：EP82103521.9

申请日：1982-04-26

申请人： Matsushita Electronics Corporation

发明人： Tateno, Kenichi ,  Yokozawa, Masami ,  Fujii, Hiroyuki ,  Nishikawa, Mikio ,  Katoh, Michio ,  Wada, Fujio

IPC分类号： H01L21/56 ,  H01L23/30 ,  H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T428/12194 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012

公开(公告)号：EP0069390A2

公开(公告)日：1983-01-12

申请号：EP82106033.2

申请日：1982-07-06

申请人： Matsushita Electronics Corporation

发明人： Nishikawa, Mikio ,  Fujii, Hiroyuki ,  Tateno, Kenichi ,  Yokozawa, Masami

IPC分类号： H01L23/48 ,  H01L23/30

CPC分类号： H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The invention provides a lead frame for a plastic encapsulated semiconductor device wherein one of the external leads connected to a first connecting band extends from one edge of a substrate support which supports a semiconductor substrate and also serves as a heat sink, two strips are connected to a second connecting band from the other edge of the substrate support, a notch is formed between the two strips of the second connecting band to allow proper positioning of the lead frame and to decrease thermal deformation during plastic encapsulation. Further, another lead frame is provided wherein a through hole is formed extending within the substrate support in the direction of thickness thereof in order to allow uniform flow of the resin and to form a thin resin layer on the rear surface of the substrate support.

摘要翻译： 本发明提供了一种用于塑料封装的半导体器件的引线框架，其中连接到第一连接带的外部引线之一从支撑半导体衬底的基板支撑件的一个边缘延伸并且还用作散热器，两个条带连接到 来自基板支撑件的另一边缘的第二连接带，在第二连接带的两个条带之间形成切口，以允许引线框架的适当定位并且在塑料封装期间减小热变形。 此外，提供另一个引线框架，其中形成在基板支撑件的厚度方向上延伸的通孔，以允许树脂均匀流动并在基板支撑件的后表面上形成薄树脂层。

公开(公告)号：EP0069390B1

公开(公告)日：1987-11-25

申请号：EP82106033.2

申请日：1982-07-06

申请人： Matsushita Electronics Corporation

发明人： Nishikawa, Mikio ,  Fujii, Hiroyuki ,  Tateno, Kenichi ,  Yokozawa, Masami

IPC分类号： H01L23/48 ,  H01L23/30

CPC分类号： H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The invention provides a lead frame for a plastic encapsulated semiconductor device wherein one of the external leads connected to a first connecting band extends from one edge of a substrate support which supports a semiconductor substrate and also serves as a heat sink, two strips are connected to a second connecting band from the other edge of the substrate support, a notch is formed between the two strips of the second connecting band to allow proper positioning of the lead frame and to decrease thermal deformation during plastic encapsulation. Further, another lead frame is provided wherein a through hole is formed extending within the substrate support in the direction of thickness thereof in order to allow uniform flow of the resin and to form a thin resin layer on the rear surface of the substrate support.

摘要翻译： 本发明提供了一种用于塑料封装的半导体器件的引线框架，其中连接到第一连接带的外部引线之一从支撑半导体衬底的基板支撑件的一个边缘延伸并且还用作散热器，两个条带连接到 来自基板支撑件的另一边缘的第二连接带，在第二连接带的两个条带之间形成切口，以允许引线框架的适当定位并且在塑料封装期间减小热变形。 此外，提供另一个引线框架，其中形成在基板支撑件的厚度方向上延伸的通孔，以允许树脂均匀流动并在基板支撑件的后表面上形成薄树脂层。