公开(公告)号：EP3361502A1

公开(公告)日：2018-08-15

申请号：EP18155510.3

申请日：2018-02-07

申请人： MediaTek Inc.

发明人： Yu, Ta-Jen ,  Chen, Chi-Yuan ,  Hsu, Wen-Sung

IPC分类号： H01L23/485 ,  H01L23/29

CPC分类号： H01L24/13 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06051 ,  H01L2224/11462 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13027 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13582 ,  H01L2224/13655 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： The invention provides a semiconductor package. The semiconductor package includes a semiconductor die and a conductive pillar bump structure and a conductive plug. The semiconductor die has a die pad thereon. The conductive pillar bump structure is positioned overlying the die pad. The conductive pillar bump structure includes an under bump metallurgy (UBM) stack having a first diameter and a conductive plug on the UBM stack. The conductive plug has a second diameter that is different than the first diameter.