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公开(公告)号：EP2099603B1
公开(公告)日：2013-02-20
申请号：EP07854641.3
申请日：2007-11-14
申请人： MEDTRONIC, INC.
IPC分类号： A61N1/375
CPC分类号： A61N1/375 , A61N1/36514 , A61N1/3702
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公开(公告)号：EP2099603A2
公开(公告)日：2009-09-16
申请号：EP07854641.3
申请日：2007-11-14
申请人： Medtronic, Inc.
CPC分类号： A61N1/375 , A61N1/36514 , A61N1/3702
摘要： The present invention is directed to an implantable medical device. The implantable medical device includes an optical member formed through diffusion bonding. In one embodiment, the optical member includes a window coupled to a ferrule through a joint that does not include gold.
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公开(公告)号：EP3378529A1
公开(公告)日：2018-09-26
申请号：EP18161181.5
申请日：2015-04-23
申请人： Medtronic, Inc.
发明人： TISCHENDORF, Brad C. , MUNNS, Gordon O. , NIELSEN, Christian S. , NORTON, John D. , REITERER, Markus W. , THOM, Andrew J. , PARALIKAR, Kunal J.
CPC分类号： A61N5/0601 , A61N1/05 , A61N1/36 , A61N2005/0626 , A61N2005/0651
摘要： An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element.
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公开(公告)号：EP2928558B1
公开(公告)日：2017-09-06
申请号：EP13821010.9
申请日：2013-12-06
申请人： Medtronic, Inc.
发明人： TISCHENDORF, Brad C. , KAST, John E. , MILTICH, Thomas P. , MUNNS, Gordon O. , ROLES, Randy S. , SCHMIDT, Craig L. , VIAVATTINE, Joseph J. , NIELSEN, Christian S. , TAMIRISA, Prabhakar A. , CHASENSKY, Anthony M. , REITERER, Markus W. , PAIDOSH, Chris J. , ROBINSON, Reginald D. , LI, Bernard Q. , SCOTT, Erik R. , FALKNER, Phillip C. , WEI, Xuan K. , BONDE, Eric H.
CPC分类号： A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
摘要： An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
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公开(公告)号：EP2928558A1
公开(公告)日：2015-10-14
申请号：EP13821010.9
申请日：2013-12-06
申请人： Medtronic Inc.
发明人： TISCHENDORF, Brad C. , KAST, John E. , MILTICH, Thomas P. , MUNNS, Gordon O. , ROLES, Randy S. , SCHMIDT, Craig L. , VIAVATTINE, Joseph J. , NIELSEN, Christian S. , TAMIRISA, Prabhakar A. , CHASENSKY, Anthony M. , REITERER, Markus W. , PAIDOSH, Chris J. , ROBINSON, Reginald D. , LI, Bernard Q. , SCOTT, Erik R. , FALKNER, Phillip C. , WEI, Xuan K. , BONDE, Eric H.
CPC分类号： A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
摘要： An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
摘要翻译： 可植入医疗设备（IMD）具有封闭电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接头。 在各种实施例中，聚合物外壳构件围绕接头并围绕外壳。 公开了IMD外壳的其他实施例。
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