-
公开(公告)号：EP3158604A1
公开(公告)日：2017-04-26
申请号：EP15733955.7
申请日：2015-06-16
申请人： Medtronic, Inc.
IPC分类号： H01M10/0525 , H01M10/0565 , A61N1/375 , A61N1/378 , H01M10/052 , H01M10/0567 , H01M10/0568 , H01M10/0569 , H01M2/02 , H01M4/38 , H01M4/40 , H01M4/485 , H01M4/505 , H01M4/525 , H01M4/58 , H01M4/583 , H01M4/587
CPC分类号： H01M6/187 , A61N1/378 , H01M2/0207 , H01M2/0222 , H01M4/382 , H01M4/405 , H01M4/485 , H01M4/505 , H01M4/525 , H01M4/5815 , H01M4/5835 , H01M4/587 , H01M6/18 , H01M10/052 , H01M10/0565 , H01M10/0567 , H01M10/0568 , H01M10/0569 , H01M2220/30 , H01M2300/0025 , H01M2300/0085 , H01M2300/0091
摘要： Semi-solid electrolyte compositions are disclosed. The semi-solid electrolyte compositions contain a glyme or mixture of glymes, a lithium salt(s), and a polymeric complexing agent(s).
摘要翻译： 公开了半固体电解质组合物。 半固体电解质组合物含有甘醇二甲醚或甘醇二甲醚的混合物，一种或多种锂盐和一种或多种聚合络合剂。
-
公开(公告)号：EP4260385A1
公开(公告)日：2023-10-18
申请号：EP21841062.9
申请日：2021-12-07
申请人： Medtronic, Inc.
发明人： YE, Hui , TAMIRISA, Prabhakar A.
-
公开(公告)号：EP3669412A1
公开(公告)日：2020-06-24
申请号：EP18759796.8
申请日：2018-08-08
申请人： Medtronic, Inc.
IPC分类号： H01M4/36 , H01M4/485 , H01M4/587 , H01M10/0567 , H01M10/0568 , H01M10/0569 , H01M10/0525
-
公开(公告)号：EP2928558B1
公开(公告)日：2017-09-06
申请号：EP13821010.9
申请日：2013-12-06
申请人： Medtronic, Inc.
发明人： TISCHENDORF, Brad C. , KAST, John E. , MILTICH, Thomas P. , MUNNS, Gordon O. , ROLES, Randy S. , SCHMIDT, Craig L. , VIAVATTINE, Joseph J. , NIELSEN, Christian S. , TAMIRISA, Prabhakar A. , CHASENSKY, Anthony M. , REITERER, Markus W. , PAIDOSH, Chris J. , ROBINSON, Reginald D. , LI, Bernard Q. , SCOTT, Erik R. , FALKNER, Phillip C. , WEI, Xuan K. , BONDE, Eric H.
CPC分类号： A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
摘要： An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
-
公开(公告)号：EP2928558A1
公开(公告)日：2015-10-14
申请号：EP13821010.9
申请日：2013-12-06
申请人： Medtronic Inc.
发明人： TISCHENDORF, Brad C. , KAST, John E. , MILTICH, Thomas P. , MUNNS, Gordon O. , ROLES, Randy S. , SCHMIDT, Craig L. , VIAVATTINE, Joseph J. , NIELSEN, Christian S. , TAMIRISA, Prabhakar A. , CHASENSKY, Anthony M. , REITERER, Markus W. , PAIDOSH, Chris J. , ROBINSON, Reginald D. , LI, Bernard Q. , SCOTT, Erik R. , FALKNER, Phillip C. , WEI, Xuan K. , BONDE, Eric H.
CPC分类号： A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
摘要： An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
摘要翻译： 可植入医疗设备（IMD）具有封闭电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接头。 在各种实施例中，聚合物外壳构件围绕接头并围绕外壳。 公开了IMD外壳的其他实施例。
-
公开(公告)号：EP4449517A1
公开(公告)日：2024-10-23
申请号：EP22812799.9
申请日：2022-11-14
申请人： Medtronic, Inc.
发明人： YE, Hui , TAMIRISA, Prabhakar A. , CHEN, Kaimin , JAIN, Gaurav
IPC分类号： H01M4/04 , H01M4/1391 , H01M4/1393 , H01M4/36 , H01M4/54 , H01M4/583 , H01M4/62 , H01M10/0565 , H01M10/0567 , H01M4/02
-
公开(公告)号：EP4268344A1
公开(公告)日：2023-11-01
申请号：EP21840255.0
申请日：2021-12-07
申请人： Medtronic, Inc.
发明人： YE, Hui , TAMIRISA, Prabhakar A.
IPC分类号： H02J7/00
-
-
公开(公告)号：EP3266055B1
公开(公告)日：2019-04-03
申请号：EP16708578.6
申请日：2016-02-26
申请人： Medtronic, Inc.
-
公开(公告)号：EP3416208B1
公开(公告)日：2020-01-01
申请号：EP18184508.2
申请日：2016-02-26
申请人： Medtronic, Inc.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.009 秒)
