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1.发明授权FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE DEVICES AND METHODS OF MANUFACTURE 有权FILTERED实施安排用于植入的装置和方法
公开(公告)号：EP2205316B1
公开(公告)日：2014-06-25
申请号：EP08832054.4
申请日：2008-09-10
申请人： MEDTRONIC, INC.
IPC分类号： A61N1/375 , B23K35/02 , H05K3/34 , H01L21/48 , H01G4/35 , H01G4/236 , H01G2/10 , H01G4/224 , B23K1/00
CPC分类号： A61N1/3754 , B23K1/0016 , B23K35/02 , B23K35/0233 , B23K35/0244 , B23K2201/36 , H01G4/224 , H01G4/236 , H01G4/35 , H05K3/3447 , H05K3/3478 , Y10T29/435
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公开(公告)号：EP2928558B1
公开(公告)日：2017-09-06
申请号：EP13821010.9
申请日：2013-12-06
申请人： Medtronic, Inc.
发明人： TISCHENDORF, Brad C. , KAST, John E. , MILTICH, Thomas P. , MUNNS, Gordon O. , ROLES, Randy S. , SCHMIDT, Craig L. , VIAVATTINE, Joseph J. , NIELSEN, Christian S. , TAMIRISA, Prabhakar A. , CHASENSKY, Anthony M. , REITERER, Markus W. , PAIDOSH, Chris J. , ROBINSON, Reginald D. , LI, Bernard Q. , SCOTT, Erik R. , FALKNER, Phillip C. , WEI, Xuan K. , BONDE, Eric H.
CPC分类号： A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
摘要： An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
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公开(公告)号：EP2928558A1
公开(公告)日：2015-10-14
申请号：EP13821010.9
申请日：2013-12-06
申请人： Medtronic Inc.
发明人： TISCHENDORF, Brad C. , KAST, John E. , MILTICH, Thomas P. , MUNNS, Gordon O. , ROLES, Randy S. , SCHMIDT, Craig L. , VIAVATTINE, Joseph J. , NIELSEN, Christian S. , TAMIRISA, Prabhakar A. , CHASENSKY, Anthony M. , REITERER, Markus W. , PAIDOSH, Chris J. , ROBINSON, Reginald D. , LI, Bernard Q. , SCOTT, Erik R. , FALKNER, Phillip C. , WEI, Xuan K. , BONDE, Eric H.
CPC分类号： A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
摘要： An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
摘要翻译： 可植入医疗设备（IMD）具有封闭电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接头。 在各种实施例中，聚合物外壳构件围绕接头并围绕外壳。 公开了IMD外壳的其他实施例。
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4.发明公开FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE DEVICES AND METHODS OF MANUFACTURE 有权FILTERED实施安排用于植入的装置和方法
公开(公告)号：EP2205316A1
公开(公告)日：2010-07-14
申请号：EP08832054.4
申请日：2008-09-10
申请人： MEDTRONIC, INC.
IPC分类号： A61N1/375 , B23K35/02 , H05K3/34 , H01L21/48 , H01G4/35 , H01G4/236 , H01G2/10 , H01G4/224 , B23K1/00
CPC分类号： A61N1/3754 , B23K1/0016 , B23K35/02 , B23K35/0233 , B23K35/0244 , B23K2201/36 , H01G4/224 , H01G4/236 , H01G4/35 , H05K3/3447 , H05K3/3478 , Y10T29/435
摘要： A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.
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