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公开(公告)号：EP2490329B1
公开(公告)日：2018-08-29
申请号：EP10823299.2
申请日：2010-09-27
申请人： NEC Corporation
发明人： HAYAKAWA, Makoto , SHIIKUMA, Kazumi
CPC分类号： H03F1/0288 , H03F1/56 , H03F3/189 , H03F3/211 , H03F3/245 , H03F2200/222 , H03F2200/387 , H03F2200/411 , H03F2203/21106 , H03F2203/21142
摘要： A power amplifier is provided which is capable of performing efficient amplification in a wider transmission signal power range than conventional power amplifiers. The power amplifier for amplifying and outputting an input signal includes first to N-th amplifiers (N is an integer of two or more) which are cascaded. A Doherty amplifier is used in circuit configuration of each of the first to N-th amplifiers. At least one of the first to (N-1)-th amplifiers has a different power ratio from that of the N-th amplifier.
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公开(公告)号：EP2490329A1
公开(公告)日：2012-08-22
申请号：EP10823299.2
申请日：2010-09-27
申请人： NEC Corporation
发明人： HAYAKAWA, Makoto , SHIIKUMA, Kazumi
CPC分类号： H03F1/0288 , H03F1/56 , H03F3/189 , H03F3/211 , H03F3/245 , H03F2200/222 , H03F2200/387 , H03F2200/411 , H03F2203/21106 , H03F2203/21142
摘要： A power amplifier is provided which is capable of performing efficient amplification in a wider transmission signal power range than conventional power amplifiers. The power amplifier for amplifying and outputting an input signal includes first to N-th amplifiers (N is an integer of two or more) which are cascaded. A Doherty amplifier is used in circuit configuration of each of the first to N-th amplifiers. At least one of the first to (N-1)-th amplifiers has a different power ratio from that of the N-th amplifier.
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公开(公告)号：EP3327767A1
公开(公告)日：2018-05-30
申请号：EP16829994.9
申请日：2016-06-14
申请人： NEC Corporation
发明人： HAYAKAWA, Makoto
CPC分类号： H05K1/021 , H01L23/12 , H01L23/36 , H01L23/3735 , H01L23/3736 , H04B1/38 , H05K7/20 , H05K7/20463 , H05K7/20481 , H05K7/2049
摘要： Provided is a mounting structure that can bond a first heat dissipation element to a second substrate through a hole in a first substrate without using a binder such as solder, an adhesive, or the like. A mounting structure of the present disclosure includes a first substrate (10) in which a penetrating hole (11) is formed, a second substrate (20) and a first heat dissipation element (30) overlapped with both surfaces of the first substrate (10), respectively, so as to cover the penetrating hole (11), and a second heat dissipation element (40) sandwiched and attached between the second substrate (20) and the first heat dissipation element (30) inside the penetrating hole (11).
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