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    Cathode- depositing electrodepostion coating composition
    3.
    发明公开
    Cathode- depositing electrodepostion coating composition 失效
    通过阴极电沉积涂料组合物。

    公开(公告)号：EP0159883A2

    公开(公告)日：1985-10-30

    申请号：EP85302592.2

    申请日：1985-04-12

    申请人： NIPPON OIL CO. LTD. ,  Nippon Paint Co., Ltd.

    发明人： Otsuki, Yutaka ,  Omika, Hiroyoshi ,  Oshima, Akio ,  Araki, Yoshihiko ,  Tsuchiya, Yasuyuki

    IPC分类号： C09D5/44

    CPC分类号： C09D5/4488

    摘要： A cathode-depositing electrodeposition coating composition having excellent low-temperature curability comprising as essential ingredients

    (A) 100 parts by weight of a reaction product of (11 a high molecular compound having a molecular weight of 500 to 5,000 and containing carbon-carbon double bonds with an iodine number of 50 to 500 and 3 to 12% by weight of oxirane oxygen, and (2) 30 to 300 millimoles, per 100 g of the high molecular compound (1), of a specified amine compound,
    (B) 10 to 200 parts by weight of a reaction product of a specified diglycidyl compound with 1.9 to 2.1 moles, per molecule of the diglycidyl compound, of an alpha, beta-unsaturated carboxylic acid or an unsaturated fatty acid having a molecular weight of 100 to 350 and containing at least 10% by weight of a carbon-carbon double bond, or a mixture of both,
    (C) 0.5 to 10 parts by weight of a reaction product of a high molecular compound having a molecular weight of 500 to 5,000 and containing a carbon-carbon double bond with an iodine number of 50 to 500 and 40 to 400 millimoles, per 100 g of the high molecular compound, of a specified alpha, beta-unsaturated dicarboxylic acid and
    (D) 0.005 to 1.0 part by weight, as. I, of a water-soluble salt of an organic acid with a metal selected from manganese, cobalt, and copper.

    Process for preparing printed circuit board having through-hole
    4.
    发明公开
    Process for preparing printed circuit board having through-hole 失效
    Verfahren zur Herstellung einer gedruckten Schaltung mit Loch。

    公开(公告)号：EP0441308A2

    公开(公告)日：1991-08-14

    申请号：EP91101500.6

    申请日：1991-02-05

    申请人： NIPPON OIL CO., LTD.

    发明人： Yuasa, Hitoshi ,  Sato, Haruyoshi ,  Yamasita, Yukio ,  Yoda, Eiji ,  Otsuki, Yutaka

    IPC分类号： G03F7/038 ,  H05K3/42

    CPC分类号： C09D5/4488 ,  G03F7/038 ,  G03F7/164 ,  H05K3/0076 ,  H05K3/061 ,  H05K2203/0582 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/1105 ,  H05K2203/135

    摘要： A process for preparing a through-hole printed circuit board having at least one through-hole, involves the steps of: (a) applying an acid-soluble cationic electrodeposit photoresist by electrodeposition all over on a surface of a board covered by an electrically conductive metal layer including the through-hole, while setting the board as a cathode; (b) heating the board passed through the step (a) to a tempeature of 50°C to 120°C; (c) exposing the acid-soluble cationic electrodeposit photoresist to light through a photo-mask having a pattern complementary to a pattern of a circuit to be formed, thereby to cure the photoresist, and then developing with a developer to remove only an uncured portion of the photoresist; (d) applying an alkali-soluble anionic electrodeposit etching resist by electrodeposition on a surface of a portion of the electrically conductive metal layer uncoated with the cured photoresist, while setting the board passed through the step (c) as an anode; (e) heating the board passed through the step (d) to a tempeature of 50 to 120°C; (f) removing a coating of the cured acid-soluble cationic electrodeposit photoresist with an aqueous acid solution; (g) etching a portion of the electrically conductive metal layer exposed by the step (f); and (h) removing the remaining alkali-soluble anionic electrodeposit etching resist with an aqueous alkali solution.

    摘要翻译： 一种用于制备具有至少一个通孔的通孔印刷电路板的方法，包括以下步骤：（a）通过电沉积在由导电覆盖的板的表面上电沉积的酸溶性阳离子电沉积光致抗蚀剂 包括通孔的金属层，同时将板设置为阴极; （b）将通过步骤（a）的板加热至50℃至120℃的温度; （c）将酸溶性阳离子电沉积光致抗蚀剂曝光通过具有与要形成的电路图案互补的图案的光掩模，从而固化光致抗蚀剂，然后用显影剂显影以除去未固化部分 的光刻胶; （d）通过电沉积在未固化的光致抗蚀剂的未导电的导电金属层的一部分的表面上施加碱溶性阴离子电沉积抗蚀剂，同时使板通过步骤（c）作为阳极; （e）将通过步骤（d）的板加热至50至120℃的温度; （f）用酸水溶液去除固化的酸溶性阳离子电沉积光致抗蚀剂的涂层; （g）蚀刻由步骤（f）暴露的导电金属层的一部分; 和（h）用碱水溶液除去剩余的碱溶性阴离子电沉积抗蚀剂。

    Resin composition for forming durable protection coating and process for forming durable protection coating on substrate
    6.
    发明公开
    Resin composition for forming durable protection coating and process for forming durable protection coating on substrate 失效
    用于制造耐久防护涂层和方法，用于在衬底上制备耐久防护涂层树脂组合物。

    公开(公告)号：EP0430175A1

    公开(公告)日：1991-06-05

    申请号：EP90122659.7

    申请日：1990-11-27

    申请人： NIPPON OIL CO., LTD.

    发明人： Yuasa, Hitoshi ,  Sato, Haruyoshi ,  Yoda, Eiji ,  Otsuki, Yutaka

    IPC分类号： G03F7/033

    CPC分类号： G03F7/033 ,  H05K3/287

    摘要： 1. A resin composition for forming a durable protection coating contains (A) an alkali-soluble resin which is a polymer of a conjugated diene and has a monoamidated succinic acid group represented by the following formula (I) of:
    wherein R¹ and R² each stand for a hydrogen atom, a halogen atom or an organic residue having 1 to 3 carbon atoms; and R³ stands for an organic residue having 1 to 16 carbon atoms; (B) a pre-polymer having a photosensitive ethylenic double bond; and (C) a photo polymerization initiator. The mixing ratio by weight of the alkali-soluble resin (A) to the pre-polymer (B) ranges from 1:4 to 4:1. A process for preparing the durable protection coating contains applying the resin composition on a substrate, and exposing the resin composition to ultraviolet ray through a circuit pattern mask to cure the resin composition followed by development and after-curing to form the protection coating.

    摘要翻译： 1.用于形成耐久保护涂层的树脂组合物含有（A）碱可溶性树脂，其全部是共轭服务的聚合物，并且具有由下式（I）表示的单酰胺琥珀酸基团的： worinř <1>和R <2>各自代表一个氢原子，卤原子或具有1至3个碳原子的有机残基; 且R <3>表示在具有1至16个碳原子的有机残基; （B）具有感光乙烯性双键的预聚物; 和（C）光聚合引发剂。 （重量）的碱溶性树脂（A）与预聚物（B）的混合比例为1：4至4：1。 一种制备耐用的保护涂层处理包含涂布在基板上的树脂组合物，并且暴露的树脂组合物，紫外线通过的电路图案掩模以固化随后进行显影和后固化，以形成保护涂层的树脂组合物。 Ë

    Process for preparing printed circuit board having through-hole
    8.
    发明公开
    Process for preparing printed circuit board having through-hole 失效
    用于制备具有通孔的印刷电路板的工艺

    公开(公告)号：EP0441308A3

    公开(公告)日：1991-12-27

    申请号：EP91101500.6

    申请日：1991-02-05

    申请人： NIPPON OIL CO., LTD.

    发明人： Yuasa, Hitoshi ,  Sato, Haruyoshi ,  Yamasita, Yukio ,  Yoda, Eiji ,  Otsuki, Yutaka

    IPC分类号： G03F7/038 ,  H05K3/42

    CPC分类号： C09D5/4488 ,  G03F7/038 ,  G03F7/164 ,  H05K3/0076 ,  H05K3/061 ,  H05K2203/0582 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/1105 ,  H05K2203/135

    摘要： A process for preparing a through-hole printed circuit board having at least one through-hole, involves the steps of: (a) applying an acid-soluble cationic electrodeposit photoresist by electrodeposition all over on a surface of a board covered by an electrically conductive metal layer including the through-hole, while setting the board as a cathode; (b) heating the board passed through the step (a) to a tempeature of 50°C to 120°C; (c) exposing the acid-soluble cationic electrodeposit photoresist to light through a photo-mask having a pattern complementary to a pattern of a circuit to be formed, thereby to cure the photoresist, and then developing with a developer to remove only an uncured portion of the photoresist; (d) applying an alkali-soluble anionic electrodeposit etching resist by electrodeposition on a surface of a portion of the electrically conductive metal layer uncoated with the cured photoresist, while setting the board passed through the step (c) as an anode; (e) heating the board passed through the step (d) to a tempeature of 50 to 120°C; (f) removing a coating of the cured acid-soluble cationic electrodeposit photoresist with an aqueous acid solution; (g) etching a portion of the electrically conductive metal layer exposed by the step (f); and (h) removing the remaining alkali-soluble anionic electrodeposit etching resist with an aqueous alkali solution.