THERMOSETTING RESIN COMPOSITION
    2.
    发明公开
    THERMOSETTING RESIN COMPOSITION 审中-公开
    HITZEHÄRTBAREHARZZUSAMMENSETZUNG

    公开(公告)号:EP1564257A4

    公开(公告)日:2007-07-04

    申请号:EP03774101

    申请日:2003-11-20

    发明人: TAKASHIMA TSUTOMU

    摘要: A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistances such as HDT and is suitable for the encapsulation of semiconductors or the like. The composition is characterized by comprising (A) a thermosetting resin, (B) any of the following liquid monoolefin polymers (a) to (c): (a) a liquid monoolefin polymer having at least one epoxy group (hereinafter referred to as “epoxy-containing liquid monoolefin polymer”), (b) a liquid monoolefin polymer having at least one aldehyde group (hereinafter referred to as “aldehyde-containing liquid monoolefin polymer”), and (c) a liquid monoolefin polymer having at least one keto group (hereinafter referred to as “keto-containing liquid monoolefin polymer”) (hereinafter the polymers (a) to (c) are collectively referred to as “reactive liquid monoolefin polymer”), and (C) an organometallic compound and/or a metal ester compound. The composition can develop a sea-island phase structure composed of a continuous phase mainly made of a product of curing of the thermosetting resin (containing a curing agent) and a dispersed phase which is mainly made of the thermosetting resin (containing a curing agent) and the reactive liquid monoolefin polymer wherein the whole periphery of each dispersed particle is covered with least one interfacial phase.

    摘要翻译: 提供耐冲击性,耐热裂纹性,耐氧化劣化性,耐热劣化性等不损害HDT等耐热性的热固性树脂组合物,适用于半导体等的封装。 该组合物的特征在于包含(A)热固性树脂,(B)以下液体单烯烃聚合物(a)至(c)中的任一种:(a)具有至少一个环氧基的液态单烯烃聚合物(以下称为“ (b)具有至少一个醛基的液态单烯烃聚合物(以下称为“含醛液态单烯烃聚合物”),和(c)具有至少一个酮基的液态单烯烃聚合物 (以下称为“含酮液体单烯烃聚合物”)(以下将聚合物(a)〜(c)统称为“反应性液态单烯烃聚合物”)和(C)有机金属化合物和/或 金属酯化合物。 该组合物可以形成由主要由热固性树脂(含有固化剂)固化产物和主要由热固性树脂(含有固化剂)组成的分散相组成的连续相构成的海岛相结构, 和反应性液态单烯烃聚合物,其中每个分散颗粒的整个外围被至少一个界面相覆盖。

    THERMOSETTING RESIN COMPOSITION
    4.
    发明公开
    THERMOSETTING RESIN COMPOSITION 审中-公开
    热固性树脂组合物

    公开(公告)号:EP1564256A4

    公开(公告)日:2007-06-06

    申请号:EP03774100

    申请日:2003-11-20

    发明人: TAKASHIMA TSUTOMU

    摘要: A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, resistance to oxidative deterioration, and resistance to thermal deterioration while retaining intact heat resistance represented by HDT and which is suitable for use in encapsulating semiconductors, etc. The thermosetting resin composition comprises (A) a thermosetting resin and (B) a liquid polybutene containing an aldehyde group and optionally contains (C) a hardener added thereto, wherein the main component of the liquid polybutene has an aldehyde structure at an end and the backbone thereof has a structure in which 80% or more of the repeating units have a structure represented by the formula (I). The impact resistance and thermal crack resistance are attained by making the thermosetting resin composition give a cured resin which has a phase structure comprising a continuous phase consisting mainly of the thermoset resin and, present therein, a micrometer-order dispersed phase consisting mainly of an ingredient derived from the liquid polybutene containing an aldehyde group.

    THERMOSETTING RESIN COMPOSITION
    7.
    发明公开
    THERMOSETTING RESIN COMPOSITION 审中-公开
    HITZEHÄRTBAREHARZZUSAMMENSETZUNG

    公开(公告)号:EP1422266A4

    公开(公告)日:2005-04-13

    申请号:EP02730721

    申请日:2002-05-27

    摘要: A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, resistance to oxidative deterioration, and resistance to thermal deterioration while retaining intact heat resistance represented by HDT, and is suitable for use in the encapsulation of semiconductors, etc. It comprises a thermosetting resin and a liquid epoxidized polybutene and optionally contains a hardener, wherein the liquid epoxidized polybutene mostly has a terminal epoxy structure and a backbone structure in which at least 80% of the repeating units have a specific chemical structure. The thermosetting resin composition, through a curing reaction, gives a cured article in which the resinous part is constituted of a continuous phase formed mainly from the thermosetting resin and, dispersed therein, a dispersed phase having a size on the order of micrometer formed mainly from the liquid epoxidized polybutene.

    摘要翻译: 一种热固性树脂组合物,其耐冲击性,耐热裂性,耐氧化劣化性和耐热劣化性得到改善,同时保持以HDT为代表的完整耐热性,并且适用于半导体等的封装。 热固性树脂和液体环氧化聚丁烯并且任选地含有硬化剂,其中液体环氧化聚丁烯大多具有末端环氧结构和主链结构,其中至少80%的重复单元具有特定的化学结构。 通过固化反应,热固性树脂组合物得到固化制品,其中树脂部分由主要由热固性树脂形成的连续相构成,并在其中分散有主要由以下物质形成的具有微米量级尺寸的分散相: 液体环氧化聚丁烯。