SEMICONDUCTOR OPTICAL CONVERTER
    2.
    发明公开
    SEMICONDUCTOR OPTICAL CONVERTER 有权
    光学半导体变

    公开(公告)号:EP1602963A4

    公开(公告)日:2007-11-07

    申请号:EP04719592

    申请日:2004-03-11

    IPC分类号: G02F1/017 G02F1/025 G02F1/225

    摘要: A semiconductor optical converter for use principally in an optical communication system or an optical information processing system. The semiconductor optical converter comprises an n-InP clad layer (12), an optical waveguide layer (13), an SI-InP clad layer (14), and an n-InP clad layer (15) formed sequentially on an SI-InP substrate (11), characterized in that a voltage is applied from an electrode (16) connected with the n-InP clad layer (15) and a ground electrode (17) connected with the n-InP clad layer (12). The semiconductor optical converter is especially applicable as a semiconductor phase modulator or a semiconductor Mach-Zehnder phase modulator operating at low voltages and having a low waveguide loss.

    LENS HOLDER, LENS OPTICAL ASSEMBLY COMPONENT, AND PACKAGE WHEREIN LENS OPTICAL ASSEMBLY COMPONENT IS MOUNTED
    3.
    发明公开
    LENS HOLDER, LENS OPTICAL ASSEMBLY COMPONENT, AND PACKAGE WHEREIN LENS OPTICAL ASSEMBLY COMPONENT IS MOUNTED 有权
    镜头支架,光学镜片的结构单元和有安装在其中部件包装的光学透镜的结构

    公开(公告)号:EP2871506A4

    公开(公告)日:2016-02-24

    申请号:EP13813792

    申请日:2013-07-01

    摘要: Provided is a lens holder, a lens optical component, or a package equipped with the lens optical component, in which poor welding between a lens housing and the lens holder may not occur. A lens holder includes a pair of leg members inclined and extending to a lens housing from a support member that supports the lens holder at a predetermined position. A distance between pair of leg members is set such that the distance between lower end portions is equal to or larger than a width of the lens housing to be supported, and the distance between upper end portions is equal to or smaller than the width of the lens housing to be supported, and that the distance becomes gradually smaller from the lower end portions to the upper end portions of the legs. A lens optical component includes a lens housing holding a lens, and the lens holder. The pair of leg members at the upper end portions are in contact with the lens housing, and welded at portions in contact with the lens housing. A package is equipped with the lens optical component and two or more optical components. The lens optical component is inserted in an optical path of the two or more optical components, and the height of the lens holder is set to be equal to a height of the input-output portion of an optical device.

    OPTICAL MODULATOR
    6.
    发明公开
    OPTICAL MODULATOR 审中-公开

    公开(公告)号:EP3232255A4

    公开(公告)日:2018-07-25

    申请号:EP15866773

    申请日:2015-12-08

    IPC分类号: G02F1/025 G02F1/21 G02F1/225

    摘要: The present invention provides an optical modulator including a substrate and a phase modulation portion on the substrate. The phase modulation portion includes an optical waveguide comprised of a first clad layer, a semiconductor layer that is laminated on the first clad layer and has a refraction index higher than the first clad layer and a second clad layer that is laminated on the semiconductor layer and has a refraction index lower than the semiconductor layer, a first traveling wave electrode, and a second traveling wave electrode. The semiconductor layer includes a rib that is formed in the optical waveguide in an optical axis direction and is a core of the optical waveguide, a first slab that is formed in the optical axis direction in one side of the rib, a second slab that is formed in the optical axis direction in the other side of the rib, a third slab that is formed in the first slab in the optical axis direction at the opposite side to the rib, and a fourth slab that is formed in the second slab in the optical axis direction at the opposite side to the rib. The first slab is formed to be thinner than the rib and the third slab, and the second slab is formed to be thinner than the rib and the fourth slab.

    OPTICAL COMPONENT
    7.
    发明公开
    OPTICAL COMPONENT 审中-公开
    OPTISCHE KOMPONENTE

    公开(公告)号:EP2546686A4

    公开(公告)日:2017-07-12

    申请号:EP11753050

    申请日:2011-03-09

    摘要: Degradation in an optical characteristic attributed to thermal stress and mechanical external force is suppressed in an optical component that a part of a waveguide type optical device is fixed to a convex portion of a mount. First and second optical device support bases (301, 302), opposed to each other, are fixed to a second waveguide type optical device (202) at clearances away from a mount (210). First and second presser support bases (311, 312) are disposed on the mount (210), and are also opposed to each other. A presser member (313) is disposed on the first and second optical device support bases (301, 302), and is fixed by the first and second presser support bases (311, 312) at clearances away from the first and second optical device support bases (301, 302). The second waveguide type optical device (202) and the first and second optical device support bases (301, 302) are not fixed to the surrounding members thereof, and are slidable in a direction parallel to the surface of the mount (210).

    摘要翻译: 在波导型光学器件的一部分固定在安装件的凸部上的光学部件中,抑制了由热应力和机械外力引起的光学特性的劣化。 彼此相对的第一和第二光学装置支撑基座(301,302)在远离安装座(210)的间隙处固定到第二波导型光学装置(202)。 第一和第二按压支承座(311,312)设置在座架(210)上,并且也彼此相对。 在第一和第二光学装置支撑底座(301,302)上设置有一个按压件(313),并通过第一和第二按压支撑底座(311,312)以远离第一和第二光学设备支撑件 基地(301,302)。 第二波导型光学器件(202)以及第一和第二光学器件支撑基座(301,302)未固定到其周围构件,并且可在与安装件(210)的表面平行的方向上滑动。

    SEMICONDUCTOR PHOTOELECTRON WAVEGUIDE
    9.
    发明公开
    SEMICONDUCTOR PHOTOELECTRON WAVEGUIDE 审中-公开
    光电子半导体波导

    公开(公告)号:EP1672410A4

    公开(公告)日:2008-02-20

    申请号:EP04792011

    申请日:2004-10-04

    IPC分类号: G02F1/025

    CPC分类号: G02F1/01708 B82Y20/00

    摘要: A semiconductor photoelectron waveguide having an nin-type heterostructure enabling stable operation of an optical modulator. The waveguide has a core layer (11) having a structure determined so that the electro-optical effect effectively acts with an operating light wavelength and light absorption does not result in a problem. Intermediate clad layers (12-1, 12-2) having a band gap larger than that of the core layer (11) are formed on the upper and lower surfaces of the core layer (11) so as to prevent carriers produced by light absorption from being trapped at the heterointerface. Clad layers (13-1, 13-2) having band gaps larger than those of the intermediate clad layers are formed on the upper surface of the intermediate clad layer (12-1) and on the lower surface of the intermediate clad layer (12-2). A p-type layer (15) and an n-type layer (16) are formed sequentially over the upper surface of the clad layer (13-1). The whole region of the p-type layer (15) and a part or the whole of the region of the n-type layer (16) are depleted within the applied voltage region used in an operating mode.