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206 条记录 (耗时 0.013 秒)

    LENS HOLDER, LENS OPTICAL ASSEMBLY COMPONENT, AND PACKAGE WHEREIN LENS OPTICAL ASSEMBLY COMPONENT IS MOUNTED
    2.
    发明公开
    LENS HOLDER, LENS OPTICAL ASSEMBLY COMPONENT, AND PACKAGE WHEREIN LENS OPTICAL ASSEMBLY COMPONENT IS MOUNTED 有权
    镜头支架，光学镜片的结构单元和有安装在其中部件包装的光学透镜的结构

    公开(公告)号：EP2871506A4

    公开(公告)日：2016-02-24

    申请号：EP13813792

    申请日：2013-07-01

    申请人： NIPPON TELEGRAPH & TELEPHONE ,  NTT ELECTRONICS CORP

    发明人： TSUZUKI KEN ,  NISHIZAWA TOSHIKI ,  MITSUHASHI YUJI

    IPC分类号： G02B7/02 ,  B23K26/20 ,  G02B6/32 ,  G02B6/42 ,  G02B7/00 ,  H01L31/0232 ,  H01S5/022

    CPC分类号： G02B7/02 ,  B23K26/21 ,  B23K33/00 ,  G02B6/4204 ,  G02B6/4237 ,  G02B6/4244 ,  H01L31/02325 ,  H01S5/02288

    摘要： Provided is a lens holder, a lens optical component, or a package equipped with the lens optical component, in which poor welding between a lens housing and the lens holder may not occur. A lens holder includes a pair of leg members inclined and extending to a lens housing from a support member that supports the lens holder at a predetermined position. A distance between pair of leg members is set such that the distance between lower end portions is equal to or larger than a width of the lens housing to be supported, and the distance between upper end portions is equal to or smaller than the width of the lens housing to be supported, and that the distance becomes gradually smaller from the lower end portions to the upper end portions of the legs. A lens optical component includes a lens housing holding a lens, and the lens holder. The pair of leg members at the upper end portions are in contact with the lens housing, and welded at portions in contact with the lens housing. A package is equipped with the lens optical component and two or more optical components. The lens optical component is inserted in an optical path of the two or more optical components, and the height of the lens holder is set to be equal to a height of the input-output portion of an optical device.

    Light emitting apparatus
    4.
    发明公开
    Light emitting apparatus 审中-公开
    发光装置

    公开(公告)号：EP2009708A3

    公开(公告)日：2009-02-18

    申请号：EP08166586.1

    申请日：2007-05-15

    申请人： Nichia Corporation

    发明人： Hama, Atsutomo ,  Hayashi, Yukihiro

    IPC分类号： H01L33/00

    CPC分类号： G02F1/37 ,  G02B6/4202 ,  G02B6/4237 ,  H01L33/483 ,  H01L33/507 ,  H01S3/109

    摘要： The light emitting apparatus according to the present invention includes a light source (8); and an optical component including a tubular member (1) having a through hole, and a wavelength conversion member (2) having at least one part thereof arranged in the through hole in a fit-in aperture (3-2), a cut-in part or a hole part being formed in a direction substantially perpendicular to the longitudinal direction of the through hole of the fixed member for receiving a solder glass; where the light from the light source is guided to the wavelength conversion member.

    摘要翻译： 根据本发明的发光装置包括光源（8）; 以及包括具有通孔的管状部件（1）和波长转换部件（2）的光学部件，波长转换部件（2）的至少一部分布置在装配孔（3-2）中的通孔中， 部分或孔部分形成在基本上垂直于用于接纳焊料玻璃的固定构件的通孔的纵向方向的方向上; 其中来自光源的光被引导至波长转换构件。

    OPTICAL ASSEMBLY CONNECTING A LASER WITH AN OPTICAL FIBRE
    6.
    发明公开
    OPTICAL ASSEMBLY CONNECTING A LASER WITH AN OPTICAL FIBRE 审中-公开
    光学组件，具有与光纤链路的激光

    公开(公告)号：EP1969407A1

    公开(公告)日：2008-09-17

    申请号：EP05813929.6

    申请日：2005-12-07

    申请人： Pirelli & C. S.p.A.

    发明人： PIRASTU, Alessio

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4204 ,  G02B6/4234 ,  G02B6/4237

    摘要： An optical assembly (1) is described, which comprises an optical package (3) having a wall (4a) with an aperture (5) and including a laser device (2) capable of emitting a laser beam (LB) through the aperture (5); and a collimator (7) including a sleeve (11) defining a first (8a) and a second end (8b), the collimator (7) including a terminating portion (10) of an optical fibre (F). In addition, the assembly (1) comprises a joint element (20) having a first (22a) and a second surface (22b), the first surface (22a) contacting the wall (4a) around the aperture (5) in a first contact area, and the second surface (22b) including a convex surface (23) contacting a portion of the surface of said sleeve (11) in correspondence of its first end (8a) in a second contact area, said convex surface (23) being at least partially inserted in said sleeve (11), so that said collimator (7) is aligned with respect to the laser beam (LB).

    OPTICAL COUPLING DEVICES
    8.
    发明公开
    OPTICAL COUPLING DEVICES 审中-公开
    光电耦合器件

    公开(公告)号：EP1620756A1

    公开(公告)日：2006-02-01

    申请号：EP04742890.9

    申请日：2004-04-29

    申请人： BAE Systems PLC

    发明人： HILL, Roger

    IPC分类号： G02B6/32 ,  G02B6/42

    CPC分类号： G02B6/4206 ,  G02B6/32 ,  G02B6/4208 ,  G02B6/4225 ,  G02B6/4233 ,  G02B6/4237

    摘要： A laser transmitter unit is described, the unit including a laser diode 2 emitting radiation into a lens system. The lens system includes collimating lenses L1, L3 and focussing lenses L2, L4. Additionally, compensating or steering lens S1, S2 are positioned between the collimating lenses L1, L3 and the focussing lenses L2, L4. The steering lenses S1, S2 act to reduce the sensitivity of the focussing lenses L2, L4 to position within the lens system. The position the focussing lenses can be difficult to control particularly when the lenses are welded into position on the laser transmitter unit 1.

    Laser welding components to a micro-optical bench
    10.
    发明公开
    Laser welding components to a micro-optical bench 审中-公开
    微光学试验台上部件的激光焊接

    公开(公告)号：EP1240971A3

    公开(公告)日：2004-06-16

    申请号：EP02251155.4

    申请日：2002-02-20

    申请人： JDS Uniphase Inc.

    发明人： Musk, Robert W.

    IPC分类号： B23K26/20 ,  G02B6/30

    CPC分类号： G02B6/4237 ,  B23K26/32 ,  B23K2203/50 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4224 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/423 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Many optical components now use a microelectronic substrate called an optical micro-bench as a base from which to build. Conventional devices use one or more methods of fixing the various elements together and/or onto the semiconductor micro-bench. Typically these conventional methods require special coatings to be deposited on the substrate, and the use of a separate bonding material, e.g. solder, glass or adhesive. The present invention relates to the direct fixation of a semiconductor, e.g. silicon, indium phosphide or gallium arsenide, structural component to the micro-bench made of a similar material using a laser welding technique, which uses wavelengths that are not harmful to the other elements of the component. The present invention eliminates the use of any separate bonding material, as well as several steps in the bonding process.