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    MOTOR CONTROL DEVICE AND ELECTRIC POWER STEERING DEVICE EQUIPPED WITH SAME
    1.
    发明公开
    MOTOR CONTROL DEVICE AND ELECTRIC POWER STEERING DEVICE EQUIPPED WITH SAME 审中-公开

    公开(公告)号：EP3425789A1

    公开(公告)日：2019-01-09

    申请号：EP17760116.8

    申请日：2017-03-02

    Applicant: NSK Ltd.

    Inventor： KOGURE Teruyoshi ,  SHIMAKAWA Shigeru ,  KUMAGAI Shin ,  SUZUKI Ryoichi

    IPC: H02P6/12 ,  B62D5/04 ,  B62D6/00

    Abstract: [Problem]
    An object of the present invention is to provide a motor control unit that surely and high-reliably performs a protection of a motor release switch that compactly comprises semiconductor switching devices, depending on an abnormal mode and relevant to a temperature, without adding device components, and an electric power steering apparatus equipped with the motor control unit.
    [Means for solving the problem]
    The present invention is the motor control unit that is connected to a motor release switch which comprises FETs and is disposed between an inverter and a motor, comprising: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not, a motor rotational speed detecting section to detect a motor rotational speed, an energy calculating section to calculate an energy based on the motor rotational speed, a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation, and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting section detects abnormality.

    MOTOR CONTROL DEVICE AND ELECTRIC POWER STEERING DEVICE EQUIPPED WITH SAME
    2.
    发明公开
    MOTOR CONTROL DEVICE AND ELECTRIC POWER STEERING DEVICE EQUIPPED WITH SAME 有权
    电动机驱动器

    公开(公告)号：EP3157163A1

    公开(公告)日：2017-04-19

    申请号：EP15806040.0

    申请日：2015-05-08

    Applicant: NSK Ltd.

    Inventor： SHINKAWA Naoto ,  FUKINUKI Shigeru ,  KUMAGAI Shin ,  SHIMAKAWA Shigeru ,  KOGURE Teruyoshi

    IPC: H02P27/06 ,  B62D5/04 ,  B62D6/00 ,  B62D137/00

    CPC classification number: B62D5/0484 ,  B62D5/046 ,  B62D5/0481 ,  B62D5/0496 ,  H02P27/06 ,  H02P27/08 ,  H02P29/68

    Abstract: [Problem]
    An object of the present invention is to provide a motor control apparatus that, with a high reliability, protects the motor release-switch comprising the semiconductor switching elements in small size and an electric power steering apparatus provided the same.
    [Means for solving the problem]
    An electric power steering apparatus that drive-controls a motor by an inverter, and a motor release-switch is connected between the inverter and the motor, comprising: a control section to detect an assist state on a driving control system and to ON/OFF-switch a control of the inverter based on a detection result; a motor rotational number detecting section to detect a rotational number of the motor; an energy calculating section to calculate an energy of a motor back-EMF and a regenerative current based on the rotational number; and a judging section to compare the energy with an area of safety operation of the motor release-switch and to OFF-switch the d motor release-switch when the energy becomes within the area of safety operation. As occasion demands, the area of safety operation is calculated with the temperature.

    Abstract translation: 发明内容本发明的目的在于提供一种电动机控制装置，其以高可靠性保护包括小尺寸的半导体开关元件的电动机释放开关和提供该电动动力转向装置的电动动力转向装置。 解决问题的手段一种电动助力转向装置，其通过逆变器驱动电动机，并且电动机释放开关连接在逆变器和电动机之间，包括：控制部，用于检测驾驶时的辅助状态 控制系统，并根据检测结果对变频器的控制进行ON / OFF切换; 电动机转速检测部，检测电动机的转速; 能量计算部，其基于所述转数计算电动机反电动势的能量和再生电流; 以及判断部分，用于将能量与电动机释放开关的安全操作区域进行比较，并且当能量在安全操作区域内时，切断电动机释放开关。 根据需要，安全操作区域由温度计算。

    HEAT DISSIPATION SUBSTRATE FOR MOUNTING ELECTRIC COMPONENT
    4.
    发明公开
    HEAT DISSIPATION SUBSTRATE FOR MOUNTING ELECTRIC COMPONENT 审中-公开
    用于安装电子元件的散热基板

    公开(公告)号：EP3223308A1

    公开(公告)日：2017-09-27

    申请号：EP15861673.0

    申请日：2015-11-20

    Applicant: NSK Ltd.

    Inventor： SHIMAKAWA Shigeru ,  SUNAGA Takashi ,  SEKINE Takaaki ,  KOGURE Teruyoshi ,  SUZUKI Ryoichi

    IPC: H01L23/36 ,  H01L23/12 ,  H01L23/48 ,  H01L23/50

    CPC classification number: H01L23/49568 ,  B29C45/14065 ,  B29C2045/14122 ,  B62D5/0406 ,  G01R1/203 ,  H01L23/12 ,  H01L23/36 ,  H01L23/48 ,  H01L23/49524 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/34 ,  H01L24/37 ,  H01L25/071 ,  H01L28/20 ,  H01L2224/34 ,  H01L2224/37147 ,  H01L2224/37599 ,  H02K11/33 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/09881 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: [Problem]
    An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
    [Means for Solving]
    The present invention is an electronic part mounting heat-dissipating substrate which comprises: lead frames 110 of wiring pattern shapes on a conductor plate; and an insulating member 130 between the lead frames 110; wherein a plate surface of a part arrangement surface of the lead frames 110 and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein the part arrangement surface is provided on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames which are commonly used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

    Abstract translation: 发明内容本发明的目的在于提供一种电子部件安装用散热基板，该电子部件安装用散热基板能够使用流过大电流的功率半导体的电路来降低大功率动作的布线电阻， 散热。 用于解决问题的手段本发明是一种电子部件安装散热基板，其包括：导体板上的布线图案形状的引线框110; 以及引线框架110之间的绝缘构件130; 其中引线框架110的部分布置表面的板表面和部分布置表面侧的绝缘构件的顶表面形成一个连续表面，其中部件布置表面设置在电子部件安装件的两个表面上 在所述电子部件安装散热基板上形成包括至少类似的双系统电路的还原电路，所述双系统电路的第一系统电路形成在所述电子部件的第一表面上 安装散热基板时，双系统电路的第二系统电路形成在电子部件安装散热基板的第二表面上，并且共同用于电路布线的一部分的公共引线框架是 用于电子部件安装散热基板的第一表面和第二表面。

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