摘要:
An electrode for an ionization chamber and an ionization chamber including an electrode are provided wherein the electrode comprises a substrate comprising a first material, and a plurality of nanowires extending from the substrate and manufactured by processing the first material of the substrate.
摘要:
The present invention relates to a memory device, hereinafter SONOS memory device, comprising SONOS memory cells having a control gate terminal connected to a SONOS layer stack with a nitride layer, a source terminal and a drain terminal; and a programming unit, which is connected to the drain terminal and to the control gate terminal and which is configured to apply a predetermined positive drain voltage to the drain terminal of the selected SONOS memory cell and a predetermined negative gate voltage to the control gate terminal of the selected SONOS memory cell each upon receiving a programming request addressed to a selected SONOS memory cell, the drain voltage and the gate voltage being suitable for creating hot holes at a drain side of the selected SONOS memory cell in a gate-assisted band-to-band-tunneling process and for injecting the hot holes into the nitride layer of the selected SONOS memory cell, thus switching the selected SONOS memory cell from a high-VT state to a low-VT state.
摘要:
A memory cell (300, 500), the memory cell (300, 500) comprising a substrate (301), a nanowire (302) extending along a vertical trench formed in the substrate (301), a control gate (303) surrounding the nanowire (302), and a charge storage structure (320, 501) formed between the control gate (303) and the nanowire (302).
摘要:
A multi-transistor based non- volatile memory cell Ml arranged on a semiconductor substrate 1 includes at least one access transistor ATI; AT2; AT2'; AT2' and at least one memory transistor TM2a; TM2b; TM2c; TM2d. The at least one access transistor is a 'normally-off ' transistor and includes first and second diffusion regions Sl, S2, an access channel region Rl, and an access gate AG. The access channel region is intermediate the first and second diffusion regions. The at least one memory transistor includes third and fourth diffusion regions S2, S3, a channel region R2, a charge trapping element O1-N-O2 and a control gate CG. The channel region is intermediate the third and fourth diffusion regions, and the charge trapping element is above the channel region with the control gate being arranged above the charge trapping element. The semiconductor substrate is of a first conductivity type. The at least one memory transistor is provided with a memory threshold voltage window with an upper limit above and a lower limit below zero Volt.
摘要:
A method of programming a memory cell (100), the method comprising applying a first electric potential to a first electric terminal (101) of the memory cell (100) to accelerate first charge carriers of a first type of conductivity to thereby generate second charge carriers of a second type of conductivity by impact ionisation of the accelerated first charge carriers, and applying a second electric potential to a second electric terminal (102) of the memory cell (100) to accelerate the second charge carriers to thereby inject the second charge carriers in a charge trapping structure (103) of the memory cell (100).
摘要:
A non-volatile memory device on a semiconductor substrate comprises a semiconductor base, and a programmable memory transistor comprising a storage stack, a control gate, source and drain regions and a channel in between source and drain. The storage stack comprises a first insulating layer (9) , a trapping layer (10) and a second insulating layer (11) . The first layer is positioned above the channel, the trapping layer above the first layer and the second layer above the trapping layer. Next, the control gate is arranged above the storage stack. The storage stack is arranged for trapping charge in the trapping layer by tunneling of charge carriers from the channel through the first layer which comprises a high-K material. The high-K material has a relatively smaller difference between the barrier height energy for electrons and the barrier height energy for holes in comparison to the difference between the barrier height energies for electrons and for holes in silicon dioxide .