公开(公告)号：EP2195830A2

公开(公告)日：2010-06-16

申请号：EP08807647.6

申请日：2008-09-12

申请人： NXP B.V.

发明人： WYLAND, Christopher

IPC分类号： H01L21/48 ,  H01L23/538 ,  H01L23/473

CPC分类号： H05K3/00 ,  B33Y80/00 ,  H01L21/4846 ,  H01L23/473 ,  H01L23/5389 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0237 ,  H05K1/185 ,  H05K3/0005 ,  H05K3/0082 ,  H05K3/1241 ,  H05K3/4644 ,  H05K3/4664 ,  H05K2201/09836 ,  Y02P80/30 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of implementing arbitrary structures to provide electrical interconnection and mechanical fixturing for integrated circuits is provided. According to exemplary embodiments of the invention said arbitrary structures are manufactured using three dimensional manufacturing processes employing only additive steps for all materials within the arbitrary structure. Accordingly the arbitrary structure is provided in a single step incorporating mechanical, electrical, and thermal elements as required by the design incorporating simultaneously dielectric and metallic materials. The arbitrary structures may be manufactured directly in association with the integrated circuits or separately for subsequent assembly to the integrated circuits. Arbitrary structures ranging from a fraction of to all of the structural and electrical elements required for packaging the integrated circuit(s) being provided by the arbitrary structures according to the design boundary established.

摘要翻译： 提供实现任意结构来提供电互连和机械固定用于集成电路的方法。 。根据本发明的示例性实施例所述的任意结构使用三维制造工艺仅采用对于任意结构之内的所有材料添加剂步骤制造。 因此，任意的结构在单个步骤中所要求的设计掺入同时电介质和金属材料结合的机械，电气和热元件提供。 任意结构可以直接在协会组件继集成电路制造用的集成电路或单独。 通过gemäß既定设计边界任意结构设置范围从几分之一到所有用于封装集成电路（多个）所需的结构和电气元件的任意结构。