公开(公告)号：EP2566298A1

公开(公告)日：2013-03-06

申请号：EP11775043.0

申请日：2011-04-27

申请人： Lumiotec Inc.

发明人： KAGOTANI Akihito ,  ARISAWA Makoto ,  KAMADA Hideki

IPC分类号： H05B33/06 ,  H01L51/50 ,  H05B33/04

CPC分类号： H05B33/06 ,  B32B17/10036 ,  B32B17/10541 ,  F21V29/74 ,  F21V29/89 ,  F21Y2105/00 ,  F21Y2115/20 ,  H01L51/5203 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/529 ,  H01L2251/5361 ,  H05B33/02 ,  H05B33/04 ,  H05K1/14 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/09836 ,  H05K2201/10128

摘要： Disclosed is an organic EL illumination device-which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)-wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.

摘要翻译： 公开了一种有机EL照明装置，其设置有：玻璃基板（10）上的有机EL元件（13）。 以及用于向上述玻璃基板（10）上的上述有机EL元件（13）均匀地供给电流的多个阳极端子电极（11）和阴极端子电极（12），其中在有机EL照明装置中设置有布线 具有与上述阳极端子电极（11）的位置对应的阳极配线（1a）的电路的电路板（1）和与上述阴极端子的位置对应的阴极配线（1b）的电路 形成电极（12）。

公开(公告)号：EP2503862A1

公开(公告)日：2012-09-26

申请号：EP12002024.3

申请日：2012-03-22

申请人： Giesecke & Devrient GmbH

发明人： Welling, Ando, Dr.

IPC分类号： H05K3/40 ,  H05K3/00 ,  H05K3/42 ,  G06K19/077

CPC分类号： H05K3/4084 ,  H05K3/005 ,  H05K3/4053 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/0221

摘要： Bei einem Verfahren zum gegenseitigen Kontaktieren von zwei auf einander gegenüberliegenden Oberflächen (1a, 1b) eines Substrats (1) angeordneten, elektrisch leitfähigen Strukturen (2, 3) durch das Substrat hindurch wird zunächst eine erste elektrisch leitfähige Struktur (3) auf einer ersten Oberfläche (1b) eines flexiblen Substrats (1) aufgebracht. Anschließend wird das flexible Substrat in einem Bereich der ersten elektrisch leitfähigen Struktur (3) in einer Richtung schräg zur ersten Oberfläche (1b) linienförmig durchtrennt, und die beiden an die Durchtrennungslinie (11) angrenzenden Bereiche (20, 30) des flexiblen Substrats (1) werden aneinander vorbeibewegt, bis sie hintereinander verrasten. Schließlich wird auf der gegenüberliegenden Oberfläche (1a) des flexiblen Substrats (1) eine zweite elektrisch leitfähige Struktur (2) so aufgebracht, dass sie mit der ersten elektrisch leitfähigen Struktur (3) in Kontakt kommt und so eine durch das Substrat (1) hindurchführende elektrisch leitende Verbindung herstellt.

摘要翻译： 的导电结构（3）被施加的表面（1b）中的柔性基材（1），和基片的在倾斜的方向上与第一表面沿着导电结构的区域上切割。 导电结构（2）的基板施加，搜索的表面（1a）的上，DASS死导电结构（2）抵接于其他导电结构接触并电连接的基板的对置面。 一个独立的claimsoft包括用于衬底。

公开(公告)号：EP0926931B1

公开(公告)日：2008-01-16

申请号：EP98914051.2

申请日：1998-04-16

申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.

发明人： HORIUCHI, Michio Shinko Electric Ind., Co., Ltd. ,  SUYAMA, Toshiaki Shinko Electric Ind., Co., Ltd. ,  TOKITA, Masakuni Shinko Electric Ind., Co., Ltd.

IPC分类号： H05K1/11 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4038 ,  H05K2201/09836 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/0235 ,  H01L2924/00

摘要： A wiring board in which vias radially extending through the wiring board from one side to the other side in such a way that the interval between the vias on one side of the wiring board is smaller than those between the vias on the other side, characterized in that a plurality of vias (12, 12, ...) are radially arranged from one side (10a) of the wiring board (10) to the other side (10b) in such a way that the interval (Wa) between the vias on one side (10a) is smaller than the interval (Wa) between the vias on the other side (10b) in order to prevent electrical short-circuit even if the interval between the vias on one side of the wiring board is very small, and that a conductor forming a core portion (14) of each of the vias (12) is covered with a sheath portion (16) made of an insulator.

公开(公告)号：EP1690283A2

公开(公告)日：2006-08-16

申请号：EP04812006.7

申请日：2004-11-22

申请人： FormFactor, Inc.

发明人： MATHIEU, Gaetan, L. ,  KHANDROS, Igor, K. ,  REYNOLDS, Carl, V.

IPC分类号： H01K3/10

CPC分类号： H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338

摘要： Methods are provide for making vertical feed through electrical connections structure in a substrate or tile. The vertical feed through (Fig. 2, 10) can be configured to make plated through holes usable for inserting and attaching connector probes ( Fig. 2, 12). Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure (Fig. 9D, 74) is formed by supporting twisted sacrificial wire coated with the plating material in a substrate (Fig. 9D, 79), and later etching away the wires (Fig. 9A, 74).

公开(公告)号：EP1670075A2

公开(公告)日：2006-06-14

申请号：EP05026727.7

申请日：2005-12-07

申请人： NGK SPARK PLUG CO., LTD

发明人： Nagai, Makoto ,  Yada, Setsuo ,  Uchida, Atsushi

IPC分类号： H01L33/00

CPC分类号： H05K1/183 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/246 ,  H05K3/4614 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0347 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2203/061

摘要： A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metallized layer provided along a side face of said cavity and metallized layers provided in said substrate body are provided to continue to each other.

摘要翻译： 一种用于安装发光元件的布线基板，包括：基板主体，包括绝缘材料并具有第一表面和后表面; 并且一个空腔被打开到所述基片主体的第一表面中，并且具有用于将发光元件安装在所述空腔的底面的安装区域，其中沿着所述空腔的侧面设置的金属化层和设置在所述腔中的金属化层 衬底本体被设置成彼此连续。

公开(公告)号：EP1449415A1

公开(公告)日：2004-08-25

申请号：EP02791679.0

申请日：2002-11-14

申请人： Giesecke & Devrient GmbH

发明人： USNER, Jürgen ,  WELLING, Ando

IPC分类号： H05K3/40 ,  G06K19/077 ,  B26D7/27

CPC分类号： G06K19/0775 ,  B26D7/27 ,  B26F1/18 ,  B26F1/22 ,  G06K19/077 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49156 ,  Y10T29/5136 ,  Y10T29/5148 ,  Y10T29/5313 ,  Y10T83/0207

摘要： A method and device for through-hole plating of flexible substrates (1), especially printed circuit boards, by means of two electrically conductive contact areas (4,41) on opposite-lying surfaces (1a,1b) of the substrate. A cut (11) is made in the region of the contact areas in a slanted position with respect to the surfaces of the substrate and the two substrate areas (20,30) adjacent to the slanted cut are displaced until they interlock with each other. Said displacement is carried out by means of a tappet (12) with impingement of compressed area (13) and the application of a low pressure (14) or by means of a driver hook (15) fixed on the cutting tool. The two steps involving the production of the cut and displacement of the two substrate areas adjacent to the hut are carried out in a single work process.

公开(公告)号：EP2503859A1

公开(公告)日：2012-09-26

申请号：EP10839574.0

申请日：2010-12-24

申请人： Fujikura, Ltd.

发明人： YAMAMOTO Satoshi ,  SUZUKI Takanao ,  MATSUYAMA Masami

IPC分类号： H05K1/11 ,  H01L23/12 ,  H05K3/40

CPC分类号： H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

摘要： An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

摘要翻译： 本发明的内插基板具有平面基板和贯通孔布线，所述通孔布线通过填充将该基板的第一主表面和第二主表面连接在一起的通孔而形成。 当在基板的垂直截面图中看到通孔时，通孔具有梯形，其侧壁由通孔的内表面形成，并且梯形的两个侧面不平行于每个 其他。 梯形的两个侧面相对于形成梯形的顶面或底面的两个顶点处垂直于第一主表面或第二主表面的两条垂直线而朝向相同侧倾斜。

公开(公告)号：EP2298048A1

公开(公告)日：2011-03-23

申请号：EP09772960.2

申请日：2009-06-23

申请人： Koninklijke Philips Electronics N.V.

发明人： ELZINGA, Marcus, J., G.

IPC分类号： H05K3/34 ,  H01L33/48

CPC分类号： H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

摘要： A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

公开(公告)号：EP1988758A1

公开(公告)日：2008-11-05

申请号：EP07708420.0

申请日：2007-02-20

申请人： IBIDEN CO., LTD.

发明人： IKEDA, Tomoyuki c/o IBIDEN CO., LTD.,

IPC分类号： H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

摘要： To provide a printed wiring board having through-holes made by plating perforations formed on the insulating resin base material, wherein the position of an axis of the center of gravity of each of the through-holes exposed from the front surface and back surface of the insulating resin base material is out of alignment with each other to reduce defects such as voids and cracking in order to reduce poor connection and to improve the mechanism strength of the wiring board.

摘要翻译： 为了提供一种具有通过在绝缘树脂基材上形成的穿孔而形成的通孔的印刷电路板，其中每个通孔的重心的位置从该表面的表面和背面暴露出来 绝缘树脂基材彼此不对齐，以减少诸如空隙和开裂的缺陷，以减少连接不良和提高布线板的机械强度。

公开(公告)号：EP1449415B1

公开(公告)日：2005-03-16

申请号：EP02791679.0

申请日：2002-11-14

申请人： Giesecke & Devrient GmbH

发明人： USNER, Jürgen ,  WELLING, Ando

IPC分类号： H05K3/40 ,  G06K19/077 ,  B26D7/27

CPC分类号： G06K19/0775 ,  B26D7/27 ,  B26F1/18 ,  B26F1/22 ,  G06K19/077 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49156 ,  Y10T29/5136 ,  Y10T29/5148 ,  Y10T29/5313 ,  Y10T83/0207

摘要： A method and device for through-hole plating of flexible substrates (1), especially printed circuit boards, by means of two electrically conductive contact areas (4,41) on opposite-lying surfaces (1a,1b) of the substrate. A cut (11) is made in the region of the contact areas in a slanted position with respect to the surfaces of the substrate and the two substrate areas (20,30) adjacent to the slanted cut are displaced until they interlock with each other. Said displacement is carried out by means of a tappet (12) with impingement of compressed area (13) and the application of a low pressure (14) or by means of a driver hook (15) fixed on the cutting tool. The two steps involving the production of the cut and displacement of the two substrate areas adjacent to the hut are carried out in a single work process.