公开(公告)号：EP3264457A1

公开(公告)日：2018-01-03

申请号：EP17170726.8

申请日：2017-05-11

申请人： NXP USA, Inc.

发明人： FOONG, Chee Seng

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/49555 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of making a packaged integrated circuit device includes forming a lead frame with leads that have an inner portion and an outer portion, the inner portion of the lead is between a periphery of a die pad and extends to one end of openings around the die pad. The outer portion of the leads are separated along their length almost up to an opposite end of the openings. Leads in a first subset of the leads alternate with leads in a second subset of the leads. The inner portion of the first subset of the leads is bent. The die pad, the inner portion of the leads, and only a first portion of the openings adjacent the inner portion of the leads are encapsulated. A second portion of the openings and the output portions of the leads form a dam bar for the encapsulating material.

摘要翻译： 一种制造封装集成电路器件的方法包括形成引线框架，引线框架具有内部部分和外部部分，引线的内部部分位于管芯焊盘的外围之间并且延伸至管芯周围的开口的一端 垫。 引线的外部部分沿其长度几乎直到开口的相对端。 导线的第一个子集中的导线与导线的第二个子集中的导线交替排列。 引线的第一子集的内部是弯曲的。 芯片焊盘，引线的内部以及仅与引线的内部相邻的开口的第一部分被封装。 开口的第二部分和引线的输出部分形成封装材料的挡条。