利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

355 条记录 (耗时 0.019 秒)

    HYBRID MULTI-DIE QFP-QFN PACKAGE
    1.
    发明公开
    HYBRID MULTI-DIE QFP-QFN PACKAGE 审中-实审

    公开(公告)号：EP4425537A3

    公开(公告)日：2024-09-25

    申请号：EP24159904.2

    申请日：2024-02-27

    申请人： STMicroelectronics International N.V.

    发明人： LOO, Shei Meng ,  DE JESUS, Edsel Bernaldez

    IPC分类号： H01L21/48 ,  H01L23/495

    CPC分类号： H01L23/49503 ,  H01L23/49575 ,  H01L21/4832 ,  H01L23/49541

    摘要： A hybrid QFN and QFP integrated circuit package includes a leadframe with first second die pads supporting first and second integrated circuits, respectively. The leadframe further includes QFN conductive pads QFP conductive leads. A package housing encapsulates the first and second die pads, the first and second integrated circuits mounted thereto, the QFN conductive pads, and proximal ends of the QFP conductive leads. Distal ends of the QFP conductive leads extend away from side edges of the package housing. Bottom surfaces of the QFN conductive pads are exposed at a bottom surface of the package housing. The QFN conductive pads are located between the first and second die pads.

    HYBRID MULTI-DIE QFP-QFN PACKAGE
    2.
    发明公开
    HYBRID MULTI-DIE QFP-QFN PACKAGE 审中-实审

    公开(公告)号：EP4425537A2

    公开(公告)日：2024-09-04

    申请号：EP24159904.2

    申请日：2024-02-27

    申请人： STMicroelectronics International N.V.

    发明人： LOO, Shei Meng ,  DE JESUS, Edsel Bernaldez

    IPC分类号： H01L21/48 ,  H01L23/495

    CPC分类号： H01L23/49503 ,  H01L23/49575 ,  H01L21/4832 ,  H01L23/49541

    摘要： A hybrid QFN and QFP integrated circuit package includes a leadframe with first second die pads supporting first and second integrated circuits, respectively. The leadframe further includes QFN conductive pads QFP conductive leads. A package housing encapsulates the first and second die pads, the first and second integrated circuits mounted thereto, the QFN conductive pads, and proximal ends of the QFP conductive leads. Distal ends of the QFP conductive leads extend away from side edges of the package housing. Bottom surfaces of the QFN conductive pads are exposed at a bottom surface of the package housing. The QFN conductive pads are located between the first and second die pads.

    DIE PADDLE STANDOFFS IN SEMICONDUCTOR PACKAGES
    4.
    发明公开
    DIE PADDLE STANDOFFS IN SEMICONDUCTOR PACKAGES 审中-公开

    公开(公告)号：EP4418316A1

    公开(公告)日：2024-08-21

    申请号：EP23157121.7

    申请日：2023-02-16

    申请人： Nexperia B.V.

    发明人： Dimaano Jr, Antonio B. ,  Yandoc, Ricardo ,  Malveda, Homer ,  Fadullo, Marlon

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49503

    摘要： A leadframe (202) for a semiconductor package is proposed, comprising one or more mechanical standoffs (204) for placing a die (208) at a distance from the leadframe defined by a height of the standoffs and for enabling an adhesive layer (206) between the leadframe and the die for bonding the die to the leadframe. The leadframe includes a substantially planar surface and the standoffs protrude from this surface. Surrounding perimeters, if present, of the leadframe are lower than the standoffs. The leadframe and the standoffs are a one-piece of conducting material and form a die paddle.

    INTEGRATED PACKAGE DESIGN WITH WIRE LEADS FOR PACKAGE-ON-PACKAGE PRODUCT
    7.
    发明公开
    INTEGRATED PACKAGE DESIGN WITH WIRE LEADS FOR PACKAGE-ON-PACKAGE PRODUCT 审中-公开
    ENTWURF EINER INTEGRIERTEN KAPSELUNG MIT DRAHTLEITERNFÜREIN KAPSELUNG-AUF-KAPSELUNG-PRODUKT

    公开(公告)号：EP3058590A4

    公开(公告)日：2017-08-02

    申请号：EP14893691

    申请日：2014-12-23

    申请人： INTEL CORP

    发明人： SUN ZHIYONG SIMON

    IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10

    CPC分类号： H01L23/49503 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49506 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49555 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    摘要： An integrated package design for a package-on-package product is described that uses wire leads. Some embodiments pertain to a stacked package assembly that includes a first die having a front side and a back side, a die paddle attached to the back side of the first die, a plurality of wire leads, one end being connected to the front side of the die for connection to an external device, a mold compound encapsulating the first die and at least a portion of the die paddle, a land pad cut from the die paddle and supported by the mold compound, a second plurality of wire leads, one end of the wire leads being connected to the front side of the first die and the other end of the wire leads being connected to the land pad, a second die stacked over the die paddle and a third plurality of wire leads, one end being connected to the second die and the other end being connected to the land pad.

    摘要翻译： 描述了使用引线的封装式封装产品的集成封装设计。 一些实施例涉及一种堆叠封装组件，其包括具有正面和背面的第一裸片，附接到第一裸片的背面的裸片焊盘，多个引线，一端连接到第一裸片的正面 用于连接到外部装置的管芯，封装第一管芯和管芯焊盘的至少一部分的模制化合物，从管芯焊盘切割并由模制化合物支撑的焊盘，第二多个导线，一端 的导线连接到第一管芯的正面，并且导线的另一端连接到焊盘，堆叠在管芯焊盘上的第二管芯和第三多个导线，一端连接到 第二管芯和另一端连接到焊盘。