公开(公告)号：EP3780012A1

公开(公告)日：2021-02-17

申请号：EP19770918.1

申请日：2019-03-18

申请人： Nippon Chemi-Con Corporation

发明人： ICHIKURA, Osamu ,  KUROSU, Mitsuru ,  ABE, Tsubasa ,  TAMAI, Yuya ,  YAMAYA, Koji ,  IDEUE, Takashi

IPC分类号： H01B7/00 ,  B23K1/00 ,  B23K1/14 ,  H01B5/00 ,  H01B13/00 ,  H01G4/228 ,  H02M7/48

摘要： An object of the present invention is to provide an electronic component module or the like using a bus bar, which enables the use of flow solder by aligning the height of the solder mounting surface with the bus bar of the laminated anode and the bus bar of the cathode. A first bus bar layer stack comprising a first bus bar and a second busbar is insulated laminated, the first lead terminal opening of the electronic component is soldered on the outer surface side of the second bus bar is mounted on the outer surface side of the first bus bar is penetrated in a non-contact, and a second lead terminal insertion hole is soldered by inserting the first lead terminal at a position corresponding to the opening for the first lead terminal, the second lead terminal and the second lead terminal solder insertion hole at a position corresponding to the insertion hole for the second lead terminal is provided with a second lead terminal opening which is penetrated in a non-contact,The first lead terminal solder insertion hole and the second lead terminalsolderinsertion hole, Bus bar layer stack and Electronic component mounting module comprising the same, Method of manufacturing Bus bar layer stack Ver.1.1 on the outer surface side of the second bus bar, to the extent that it is possible to solder by flow solder, the bus bar layer stack is the same height.

公开(公告)号：EP3822997A1

公开(公告)日：2021-05-19

申请号：EP19814797.7

申请日：2019-05-18

申请人： Nippon Chemi-Con Corporation

发明人： ICHIKURA, Osamu ,  YAMAYA, Koji ,  ABE, Tsubasa ,  KUROSU, Mitsuru ,  TAMAI, Yuya

IPC分类号： H01G4/228 ,  H01G2/02 ,  H01G2/08 ,  H01G4/30 ,  H01G4/38 ,  H01G9/008 ,  H01L23/28 ,  H01L23/36 ,  H05K1/02

摘要： It was possible to use reflow solder by aligning the height of the solder mounting surface with the bus bar and the cathode of the stacked anode, and an object thereof is to provide a surface mount type electronic component module or the like using a bus bar. A bus bar stacked body in which a first bus bar and a second bus bar each having a region for soldering external terminals of an electronic component are laminated in an insulated manner, wherein the first bus bar includes an opening, the second bus bar includes a protrusion body projecting toward the first bus bar side and serving as a region for soldering, and the protrusion body of the second bus bar is disposed at a position corresponding to the opening, and the region for soldering the first bus bar and the region for soldering the protrusion body are formed as a bus bar stacked body having the same height to the extent that soldering of external terminals of the electronic component by reflow soldering is possible.