摘要:
An electroplating apparatus (1) applies an electroplated coating to a female thread (20b) formed on a pipe end portion (20a) of a steel pipe (20). The electroplating apparatus (1) includes an inner seal member (2), a capsule (3), a discharge outlet (3c), an opening (3b), a cylindrical insoluble anode (4), a plating solution supply tube (5a), and a plurality of nozzles (5b). The inner seal member (2) divides the interior of the steel pipe (20) at a location longitudinally inward of a region on which the female thread is formed (20b). The capsule (3) is attached to the pipe end portion (20a). The discharge outlet (3c) is designed to discharge a plating solution inside the capsule (3) therefrom. The opening (3b) facilitates discharge of the plating solution inside the capsule (3). The anode (4) is disposed in the inside of the pipe end portion (20a). The supply tube (5a) projects from a leading end of the anode (4). The nozzles (5b) eject a plating solution between the outer peripheral surface of the anode (4) and the inner peripheral surface of the pipe end portion (20a). The anode (4) has a configuration that does not allow ingress of the plating solution thereto.
摘要:
Provided is a plating solution for a threaded connection for pipe or tube used for forming a plating film excellent in galling resistance, crevice corrosion resistance, and exposure corrosion resistance. The plating solution for a threaded connection for pipe or tube of the present embodiment contains no cyanide, but contains: a water-soluble copper salt; a water-soluble tin salt; a water-soluble bismuth salt; a free acid; and a thiourea-based compound of 10 g/L or less (excluding 0) that is represented by Chemical Formula (1):
X 1 X 2 N-C(=S)-NX 3 X 4 (1),
where each of X 1 , X 2 , X 3 , and X 4 is any one of hydrogen, an alkyl group, an allyl group, a tolyl group, or a group represented by Chemical Formula (2), but excluding that X 1 , X 2 , X 3 , and X 4 are all hydrogen:
摘要:
Provided is a plating solution for a threaded connection used for forming a plating film excellent in galling resistance, crevice corrosion resistance, and exposure corrosion resistance. The plating solution for a threaded connection of the present embodiment contains no cyanide, but contains copper pyrophosphate, tin pyrophosphate, zinc pyrophosphate, pyrophosphate as a metal complexing agent, and a sulfur-containing compound of 40 g/L or less (excluding 0). The sulfur-containing compound includes: a mercapto compound and a sulfide compound defined by Chemical Formula (1); a dimer formed through a disulfide bond of the mercapto compounds; and one or more types of salts thereof:
RS-(CHX 1 ) m -(CHX 2 ) n -CHX 3 X 4 (1),
where each of m and n is an integer of 1 or 0; each of X 1 , X 2 , X 3 and X 4 is any one of hydrogen, OH, NH 2 , SO 3 H, and CO 2 H, but excluding that X 1 , X 2 , X 3 , and X 4 are all hydrogen; and R is any one of hydrogen, a methyl group, and an ethyl group.
摘要:
An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.
摘要:
An electroplating apparatus (1) applies an electroplated coating to a female thread (20b) formed on a pipe end portion (20a) of a steel pipe (20). The electroplating apparatus (1) includes an inner seal member (2), a capsule (3), a discharge outlet (3c), an opening (3b), a cylindrical insoluble anode (4), a plating solution supply tube (5a), and a plurality of nozzles (5b). The inner seal member (2) divides the interior of the steel pipe (20) at a location longitudinally inward of a region on which the female thread is formed (20b). The capsule (3) is attached to the pipe end portion (20a). The discharge outlet (3c) is designed to discharge a plating solution inside the capsule (3) therefrom. The opening (3b) facilitates discharge of the plating solution inside the capsule (3). The anode (4) is disposed in the inside of the pipe end portion (20a). The supply tube (5a) projects from a leading end of the anode (4). The nozzles (5b) eject a plating solution between the outer peripheral surface of the anode (4) and the inner peripheral surface of the pipe end portion (20a). The anode (4) has a configuration that does not allow ingress of the plating solution thereto.
摘要:
An electro plating device includes a pipe inside seal mechanism which occludes an inner channel of a steel pipe,a tubular insoluble electrode which is disposed in a pipe end so as to be opposite to a female screw, a plating solution feed mechanism which includes a plurality of nozzles which extend radially with a pipe axis of the steel pipe as a center, and a pipe end seal mechanism which accommodates the nozzles thereinside and is mounted to the pipe end, when viewed in the pipe axial direction, a tip of each of the nozzles is positioned between the female screw and the insoluble electrode, and each of the nozzles injects the plating solution toward a direction which intersects an extension direction of the nozzle, the direction being a rotational direction of a clockwise direction or a counterclockwise direction in which the pipe axis is the center.