OPTOELEKTRONISCHE BAUGRUPPE UND VERFAHREN ZUM HERSTELLEN EINER OPTOELEKTRONISCHEN BAUGRUPPE

    公开(公告)号:EP2981758A1

    公开(公告)日:2016-02-10

    申请号:EP14701784.2

    申请日:2014-01-30

    申请人: OSRAM GmbH

    摘要: An optoelectronic assembly (10) is provided in various embodiments. A circuit board (12) has a first side of the circuit board (12), a second side of the circuit board (12) facing away from the first side, a central opening (13) of the circuit board (12), at least two contact openings, and at least two connection points on the first side of the circuit board (12). A support element (11) is physically coupled to the circuit board (12), has a first side of the support element (11), which faces the second side of the circuit board (12), and has at least two contact points on the first side of the support element (11). A respective contact point of the support element (11) is exposed in each contact opening of the circuit board (12). An optoelectronic component (15) is electrically coupled to the at least two contact points of the support element (11) by means of the support element (11) and is arranged on the first side of the support element (11) in such a way that the optoelectronic component is exposed in the central opening (13) of the circuit board (12). A housing body (14) has a central opening (26) of the housing body (14) and is designed in such a way and physically coupled to the circuit board (12) in such a way that the optoelectronic component (15) is exposed in the central opening (26) of the housing body (14). At least two contact elements are arranged on an inner surface of the housing body (14) and are designed in such a way that each contact point of the support element (11) is electrically coupled to a respective connection point of the circuit board (12) by means of a respective contact element.

    摘要翻译: 各种实施例可以涉及包括印刷电路板的光电组件,其具有第一和第二侧面,中心切口,至少一个接触切口和至少一个连接位置,联接到印刷电路板的载体元件 具有第一侧和至少一个接触位置,至少一个光电子部件布置在载体元件的第一侧上,使得其暴露在印刷电路板的中央切口中,壳体主体具有 中央切口,并且其形成并物理耦合到印刷电路板,使得光电子部件暴露在中央切口中,并且布置在壳体主体的内侧上的至少一个接触元件形成为使得接触元件电 将载体元件的接触位置耦合到连接位置。

    LEUCHTMODUL
    2.
    发明公开
    LEUCHTMODUL 审中-公开

    公开(公告)号:EP2872824A1

    公开(公告)日:2015-05-20

    申请号:EP13734033.7

    申请日:2013-06-28

    申请人: OSRAM GmbH

    IPC分类号: F21Y101/02

    摘要: The invention relates to a lighting module, comprising a first printed circuit board (1) on which at least one light source (3) is arranged, a cover element (5) that covers the first printed circuit board (1) at least partially, and at least one electronic component (9) which is integrated into the cover element (5) and is electrically connected to the first printed circuit board (1).

    摘要翻译: 照明模块技术领域本发明涉及一种照明模块,该照明模块包括其上布置有至少一个光源(3)的第一印刷电路板(1),至少部分覆盖第一印刷电路板(1)的盖元件(5) 以及至少一个电子组件(9),其被集成到所述盖元件(5)中并且电连接到所述第一印刷电路板(1)。

    LED-MODUL MIT EINEM KÜHLKÖRPER
    3.
    发明公开
    LED-MODUL MIT EINEM KÜHLKÖRPER 有权
    LED-MODUL MIT EINEMKÜHLKÖRPER

    公开(公告)号:EP2766657A1

    公开(公告)日:2014-08-20

    申请号:EP12784467.8

    申请日:2012-10-02

    申请人: OSRAM GmbH

    IPC分类号: F21V19/00 F21Y101/02

    摘要: The invention relates to an illuminating device (100, 200, 300, 400, 500) comprising at least one lighting module (120, 220, 320, 420, 520) and at least one lighting module support (110, 210, 310, 410, 510). The lighting module support is provided in order to dissipate heat from the lighting module, and at least one first fixing element (145, 245, 345, 445, 545) is provided in order to fix the lighting module on the lighting module support. The fixing element is designed such that the lighting module is pressed onto the lighting module support with a defined pressing force in such a manner that a defined heat transfer between the lighting module and the lighting module support and a movement of the lighting module, in particular a thermal expansion, parallel to the main plane of the lighting module in the region of the first fixing element are allowed.

    摘要翻译: 照明装置包括:至少一个照明模块和至少一个照明模块支撑件,其中提供照明模块支撑件以便散发来自照明模块的热量和用于将照明模块紧固在照明上的至少一个第一紧固元件 提供了模块支撑,其中第一紧固元件被设计成使得照明模块以限定的按压力被按压到照明模块支撑件上,使得在照明模块和照明模块支撑之间定义的热传递 并且在第一紧固元件的区域中,启用与照明模块的主平面平行的照明模块的移动,特别是热膨胀。