摘要:
An assimilation lamp device (1) for stimulating plant and crop growth comprises a central lamp unit (10), comprising a body (14) and a plurality of LEDs (12) mounted to an under surface of the body (14), wherein the body (14) is made of a thermally well conducting material, for instance aluminum, and acts as a heat sink for the heat generated by the LEDs. The body (14) is provided with cooling fins or lamellae (41). The assimilation lamp device further comprises air stream generating means (42) such as a fan for generating a downward air stream (43) in heat exchanging contact with the cooling fins or lamellae, so that heat is removed from the respective cooling block and used to increase the temperature of said downward air stream (43).
摘要:
The present invention relates to a COB lighting device having improved light-distribution, illuminance, and heat-dissipation efficiency that: can reflect emitted light with a reflective plate to prevent glare caused by direct rays of the light; can allow the light traveling forwards from the reflector to have travel paths similar to each other to minimize the amount of light leaked out of an illuminated area, thereby improving luminous intensity; and can allow the light to be uniformly supplied rather than being limited to one point, the COB lighting device comprising: a polygonal prismatic heat-dissipation rod having a thermal conductor formed on at least one of the inside and the outside thereof; a plurality of lighting modules attached to the outer circumferential surface of the heat-dissipation rod in the longitudinal direction, each of which has a plurality of lighting elements arranged in a line; a reflector having the shape of a container that is open at an opposite end thereof, wherein the heat-dissipation rod is fixedly inserted into the central portion of the reflector, and the reflector has a plurality of planar reflective plates that are formed such that side surfaces thereof are in constant contact with each other; a heat-dissipation plate assembly that is in contact with an end portion of the heat-dissipation rod and releases, to the outside, heat conducted from the heat-dissipation rod; and a stabilizer provided on a side of the heat-dissipation plate assembly to supply power to the lighting modules.
摘要:
A searchlight assembly has a first housing portion and a second housing portion, wherein each of the first housing portion and the second housing portion has operably secured to form an enclosed space: a heat sink, a reflector and a lens. The first housing portion and the second housing portion being are joined to form a housing assembly. The first housing portion heat sink and the second housing portion heat sink are disposed adjacent to one another and form a cooling medium flow path there between, and the heat sink elements of each heat sink thermally communicate with the flow path. A first LED is directly thermally coupled to the heat sink within in the first housing portion enclosed space and a second LED is directly thermally coupled to the heat sink within the second housing portion enclosed space.
摘要:
Embodiments relate to a illumination apparatus (110) comprising a mechanical support (102) a light source (105), a heat absorption element (107), thermally coupled and mechanically connected with the light source (105), a heat dissipation element (109), which is mechanically connected within the mechanical support (102). Furthermore, the illumination apparatus (110) comprises the flexible heat conducting element (112) which is coupled on a first end (112a) to the heat absorption element (107) and on a second end (112b) to the heat dissipation element (109), and wherein the flexible heat conducting element is configured to conduct heat from the heat absorption element (107) to the heat dissipation element (109) and to allow a relative movement between the heat absorption element (107) and the heat dissipation element (109), and a bearing (115) to support the light source (105) so that the light source is movable relative to the mechanical support (102).
摘要:
Disclosed are a lamp radiator and an LED lamp for mining use having the lamp radiator. The lamp radiator comprises a heat source plate (1), a fixed ring (2), a fixed plate (3) and a plurality of heat dissipation fins (4), wherein the plurality of heat dissipation fins (4) form a circular array and there are gaps among the heat dissipation fins (4). The upper end of each heat dissipation fin (4) is fixed to the fixed ring (2) and the fixed plate (3), and the lower end of each heat dissipation fin (4) is fixed to the heat source plate (1) and is in direct contact with the heat source plate (1). The lamp radiator is provided with the plurality of heat dissipation fins (4) and there are gaps among the heat dissipation fins (4), which are beneficial for the hot gas circulation and able to accelerate the heat dissipation; and in addition, the lamp radiator is not a single component and can significantly reduce the weight of the lamp.
摘要:
An LED based illumination module includes a thermal interface surface that is coupled to a thermal interface surface of a reflector using engaging members that generate a compressive force between the thermal interface surfaces. The engaging members may be, e.g., protrusions that interface with recesses, spring pins, formed sheet metal, magnets, mounting collar, etc. The reflector may include a vented portion that is not optically coupled to the LED based illumination module to allow air to pass through the reflector.
摘要:
Disclosed is a low light failure high power LED street lamp and a method for manufacturing the same. A color mark is made in advance on a tail end surface used for manufacturing an N-type semiconductor element (6) or a P-type semiconductor element (7); then the N-type semiconductor element (6) and P-type semiconductor element (7) are arranged in a manner of matrix between an upper beryllium-oxide ceramic wafer (8) and a lower beryllium-oxide ceramic wafer (9), so that the head end of the N-type semiconductor element (6) is connected with the tail end of the P-type semiconductor element (7) or the tail end of the N-type semiconductor element (6) is connected with the head end of the P-type semiconductor element (7), then the lower beryllium-oxide ceramic wafer (9) is attached, through a graphene thermal conductive greaseon layer (4), on the backside of the circuit board (2) which is mounted with LED bulbs (3), and a heat sink (15) is mounted on the upper beryllium-oxide ceramic wafer (8), then the circuit board (2) together with the heat sink (15) are mounted into a street lamp housing (1).