VERFAHREN UND SYSTEM ZUM SELEKTIVEN BESCHICHTEN ODER ÄTZEN VON OBERFLÄCHEN
    1.
    发明授权
    VERFAHREN UND SYSTEM ZUM SELEKTIVEN BESCHICHTEN ODER ÄTZEN VON OBERFLÄCHEN 有权
    VERFAHREN UND系统ZUM SELEKTIVEN BESCHICHTEN ODERÄZZENVONOBERFLÄCHEN

    公开(公告)号:EP1753896B1

    公开(公告)日:2007-08-29

    申请号:EP05750428.4

    申请日:2005-05-04

    IPC分类号: C25D5/02 C25D7/06 C23C14/04

    摘要: The invention relates to a method for selectively coating or etching surfaces during which the surface areas that are not to be treated are masked with a masking device (18) during the actual coating or etching process. The masking device (18) is pressed against these surface areas in a liquid-tight manner by a magnetic interaction between a magnet device (24) and a counter magnet device (26), during which at least one of the magnet devices (24) is situated on the side of the masking device (18) facing away from the surface. The inventive method is particularly suited for electroplating (endless) metal strips (12). The metal strips (12) are moved past, for example, an anode spraying head (16) for applying a suitable electrolyte, around which a masking strip (18) is guided in a circle with a ferromagnetic mask pressing strip (24) situated on the side of the masking strip facing away from the metal strip. Opposite the anode spraying head (16), a carrying strip (30) is guided in a circle around a magnet head (26) having a number of electromagnets (26, , 26g). These are selected in such a manner that said strips (12, 18, 24, 30) are pressed tightly against one another and are moved past the anode spraying head (16) as a single unit. The invention also relates to a masking system and to a selective coating or etching system for carrying out this method.

    摘要翻译: 本发明涉及一种用于选择性地涂覆或蚀刻表面的方法,在该方法期间,在实际涂覆或蚀刻过程期间,不被处理的表面区域被掩模装置(18)掩蔽。 通过磁体装置(24)和反磁体装置(26)之间的磁性相互作用将掩蔽装置(18)以液密方式压靠在这些表面区域上,在此期间,至少一个磁体装置(24) 位于掩蔽装置(18)的远离表面的一侧。 本发明的方法特别适用于电镀(环形)金属带(12)。 例如,将金属条12移动通过用于施加合适电解质的阳极喷射头16,掩蔽带18围绕该阳极喷射头在圆上引导,铁磁掩模压制带24位于 掩蔽带的背离金属带的一侧。 与阳极喷射头(16)相对,承载带(30)围绕具有多个电磁体(26,,26g)的磁头(26)引导成圆形。 这些被选择为使得所述条带(12,18,24,30)彼此紧密地压紧并作为单个单元移动经过阳极喷洒头(16)。 本发明还涉及用于实施该方法的掩蔽系统和选择性涂层或蚀刻系统。

    VERFAHREN ZU RAFFINATION VON GOLD
    2.
    发明公开
    VERFAHREN ZU RAFFINATION VON GOLD 有权
    法精炼金的

    公开(公告)号:EP1604047A1

    公开(公告)日:2005-12-14

    申请号:EP04718618.4

    申请日:2004-03-09

    IPC分类号: C22B11/00 C22B1/00 C22B3/00

    摘要: The invention relates to a method for refining gold containing metallic impurities. According to said method, the proportion of metal oxides is increased in a targeted manner by annealing the gold at preferably between 450 and 550 °C for between 1.5 to 2.5 hours. The gold is then treated with concentrated hydrochloric acid at a controlled redox potential, enabling a large part of the metal oxides and metals to dissolve immediately. In order to create identical reaction conditions, the gold used preferably has essentially the same particle size or gold concentration. Air can then be guided through the softened gold, in order to oxidise the previously formed monovalent copper chloride in a strong exothermic reaction. Said reaction is monitored by measuring the temperature and is optionally controlled as required. The gold is then post-treated with concentrated hydrochloric acid and a small amount of hydrogen peroxide at a controlled redox potential, and the purification effect can be controlled by the mixing ratio of said two substances. The refined gold is then washed with concentrated hydrochloric acid and deionised water and, according to requirement, is either further purified by a subsequent fine refinement method or is directly supplied elsewhere for a different use. The inventive method is especially suitable for the refinement of powdery, ground, small-particle, film-type or wire-shaped gold.

    VERFAHREN UND SYSTEM ZUM SELEKTIVEN BESCHICHTEN VON METALLOBERFLAECHEN
    3.
    发明授权
    VERFAHREN UND SYSTEM ZUM SELEKTIVEN BESCHICHTEN VON METALLOBERFLAECHEN 有权
    METHOD AND SYSTEM FOR选择性涂层的金属表面

    公开(公告)号:EP1678351B1

    公开(公告)日:2007-09-26

    申请号:EP04789982.8

    申请日:2004-10-14

    IPC分类号: C25D5/02 C23C18/16 B05D1/32

    摘要: The invention relates to a method for selectively coating metal surfaces, wherein the surface areas that are not to be covered are masked initially with a molten, waxy water-soluble substance, for instance, polyethylene glycol, 1-Hexadecanol, 1-Octadecanol or the like (first masking). After the waxy substance has been allowed to solidify, the metal surface is then selectively or fully coated with an appropriate liquid dielectric fluid or varnish (second masking). The first masking, i. e. the waxy substance, along with the dielectric fluid possibly found thereupon is completely removed from the metal surface with water. The originally waxy masked surface areas which are now free once again can be subjected to a corresponding aftertreatment, for instance, selective galvanic coating. The second masking, i. e. the dielectric coating or varnishing applied, can then be removed completely from the surface, preferably in an appropriate aqueous-alkaline solution or a microphase cleaner. Said second masking can then be preferably subjected to a subsequent cleaning and drying step. In order to achieve better coating results, a corresponding cleaning and drying step can also be carried out before applying the waxy masking substance and the dielectric coating or varnishing. The invention also relates to a selective coating system for implementing the inventive method.

    VERFAHREN ZUR KONSERVIERUNG VON METALLOBERFLÄCHEN
    4.
    发明公开
    VERFAHREN ZUR KONSERVIERUNG VON METALLOBERFLÄCHEN 审中-公开
    法金属表面保

    公开(公告)号:EP1570100A1

    公开(公告)日:2005-09-07

    申请号:EP03812556.3

    申请日:2003-12-03

    发明人: LANDAU, Uwe

    摘要: Disclosed is a method for the conservation of metal surfaces (10a) by means of plasma treatment in a CO2 containing and/or N2- containing reactive gas atmosphere, wherein the metal surfaces (10a) are preferably exposed to a dielectric barrier discharge (DBE) at atmospheric pressure. Ignition occurs with a high-frequency alternating current of typically approximately 1-10 kV between a discharge electrode (14) and a counter electrode (10), whereby at least one thereof is insulated dielectrically in relation to the discharge chamber (16) formed therebetween by means of a suitable dielectric (14a) such as, for instance glass or ceramic material. Preferably, the metal surface (10a) to be treated is earthed and used as a counter electrode (10) for at least one discharge electrode (14) which is embodied as a form electrode which reproduces the surface contours in a plane-parallel manner. The dielectric barrier discharge cannot, however, also be performed between plane-parallel electrodes whereby at least one of which is electrically insulated. According to the invention, an indirect dielectric barrier discharge can also be used, whereby the discharges (20) are carried out in an adjacent position in relation to the metal surface (10a) and whereby the respectively used inflowing reactive gas, is brought into contact therewith by means of plasma jets, for example. The above-mentioned method is particulary suitable for continuous or quasi-continuous conservation of metal strips (10), cut strips, circuit boards or succesively arranged individual parts.

    VERFAHREN UND SYSTEM ZUR SELEKTIVEN GALVANISCHEN BESCHICHTUNG VON METALLOBERFLÄCHEN
    5.
    发明公开
    VERFAHREN UND SYSTEM ZUR SELEKTIVEN GALVANISCHEN BESCHICHTUNG VON METALLOBERFLÄCHEN 有权
    方法和系统金属表面选择性电镀层

    公开(公告)号:EP1468127A2

    公开(公告)日:2004-10-20

    申请号:EP02779151.6

    申请日:2002-10-11

    IPC分类号: C25D5/02

    CPC分类号: C25D5/022 B41J3/407

    摘要: Disclosed is a method for selective electro-coating of the surfaces of metals, wherein the surface areas which not are to be coated are initially masked by contactless application of a liquid dielectric and, subsequently, the non-masked surface areas are electroplated. The dielectric is applied in a very precise manner in very fine droplets (14) having a substantially identical droplet size of between 3 and 70 micrometers and a contour acuity of less or equal to 80 micrometers. The droplets (14) are initially electrically charged and are then controlled according to requirements upon application by an electric field. The dielectric can be applied in at least one continuous interruption-free strip (16) or in a controlled discontinuous manner, enabling masking layers (16) of almost all conceivable forms to be produced, especially for flat, flat-stamped or embossed metal strips (10). After electroplating has occurred, the applied dielectric (16) is removed in a residue-free state in an aqueous solution with microdisperse additives. The invention also relates to an electroplating system for carrying out the above-mentioned method.

    VERFAHREN ZUR RÜCKGEWINNUNG VON EDELMETALLEN
    6.
    发明公开
    VERFAHREN ZUR RÜCKGEWINNUNG VON EDELMETALLEN 有权
    中回收贵金属

    公开(公告)号:EP1099010A2

    公开(公告)日:2001-05-16

    申请号:EP99939935.5

    申请日:1999-06-23

    摘要: The invention relates to a method for detaching precious metal layers from a correspondingly coated material by dissolving the precious metals in a salt-containing alkali cyanide solution containing oxidizing agents. According to the invention the alkali cyanide solution continuously flows around the material positioned in a dissolution unit (22), preferably contains at least an alkali sulfate, an alkali metaborate and/or a nitroaromatic compound and for obtaining and/or regenerating the oxidizing agent is electrolytically oxidized in a closed circuit in an electrolytic cell (10). The method provided for by the invention there requires minimal quantities of chemicals, which results in correspondingly low recycling costs. If a nitroaromatic compound is used the oxidized solution is stable to such a degree that the dissolution process in the dissolution unit (22) and the oxidizing process in the electrolytic cell (10) can be carried out independently of each other. The precious metals dissolved in the alkali cyanide solution, such as gold, silver, palladium or such like, and/or impurities are preferably separated out electrolytically in the cathode compartment (28) of a further electrolytic cell (26) which chamber is separated from the corresponding anode compartment (30), which is filled with a powerful electrolyte, for example a 10 % potassium hydroxide solution, by a cation exchange membrane (32). Said membrane is preferably coated with a precious metal, notably gold, since this permits extremely high degrees of purity of up to 99 % during separation.

    PASSIVIERUNGS- UND SCHMIERMITTEL FÜR GOLD-, SILBER- UND KUPFEROBERFLÄCHEN UND VERFAHREN ZU SEINER ANWENDUNG
    7.
    发明公开
    PASSIVIERUNGS- UND SCHMIERMITTEL FÜR GOLD-, SILBER- UND KUPFEROBERFLÄCHEN UND VERFAHREN ZU SEINER ANWENDUNG 有权
    钝化和润滑油金,银,铜表面和申请流程。

    公开(公告)号:EP1969157A1

    公开(公告)日:2008-09-17

    申请号:EP06805360.2

    申请日:2006-10-04

    IPC分类号: C23F11/16 C10M105/72

    摘要: Disclosed is a passivator and lubricant for gold, silver, and copper surfaces and corresponding alloy surfaces. Said passivator and lubricant comprises an aqueous emulsion with a linear fatty alcohol as an emulsifier, especially at least one C12-C14 fatty alcohol containing about 8 ethoxy units. Preferably, the concentration of the fatty alcohol amounts to about 25 to 35 g/l. An organic hydrophobic thiol compound, particularly hexadecanethiol and/or octadecanethiol, is dissolved in said aqueous emulsion as an inhibitor at a preferred concentration of about 6 to 12 g/l. In order to prepare said emulsion, the emulsifier is first dissolved in a certain amount of water. Said solution is then thoroughly mixed and is preferably heated to a temperature ranging from about 42 to 49°, whereupon the inhibitor is added. The resulting solution is then further mixed until a uniform milky emulsion is obtained. Silver and copper surfaces that are to be passivated are initially treated with said aqueous emulsion and are then rinsed with water, the temperatures of the emulsion and the water being selected so as to exceed the melting point of the inhibitor.

    VERFAHREN ZU RAFFINATION VON GOLD
    8.
    发明授权
    VERFAHREN ZU RAFFINATION VON GOLD 有权
    法精炼金的

    公开(公告)号:EP1604047B1

    公开(公告)日:2006-08-16

    申请号:EP04718618.4

    申请日:2004-03-09

    IPC分类号: C22B11/00 C22B1/00 C22B3/00

    摘要: The invention relates to a method for refining gold containing metallic impurities. According to said method, the proportion of metal oxides is increased in a targeted manner by annealing the gold at preferably between 450 and 550 DEG C for between 1.5 to 2.5 hours. The gold is then treated with concentrated hydrochloric acid at a controlled redox potential, enabling a large part of the metal oxides and metals to dissolve immediately. In order to create identical reaction conditions, the gold used preferably has essentially the same particle size or gold concentration. Air can then be guided through the softened gold, in order to oxidise the previously formed monovalent copper chloride in a strong exothermic reaction. Said reaction is monitored by measuring the temperature and is optionally controlled as required. The gold is then post-treated with concentrated hydrochloric acid and a small amount of hydrogen peroxide at a controlled redox potential, and the purification effect can be controlled by the mixing ratio of said two substances. The refined gold is then washed with concentrated hydrochloric acid and deionised water and, according to requirement, is either further purified by a subsequent fine refinement method or is directly supplied elsewhere for a different use. The inventive method is especially suitable for the refinement of powdery, ground, small-particle, film-type or wire-shaped gold.

    VERFAHREN UND SYSTEM ZUM SELEKTIVEN BESCHICHTEN VON METALLOBERFLAECHEN
    9.
    发明公开
    VERFAHREN UND SYSTEM ZUM SELEKTIVEN BESCHICHTEN VON METALLOBERFLAECHEN 有权
    METHOD AND SYSTEM FOR选择性涂层的金属表面

    公开(公告)号:EP1678351A1

    公开(公告)日:2006-07-12

    申请号:EP04789982.8

    申请日:2004-10-14

    IPC分类号: C25D5/02 C23C18/16 B05D1/32

    摘要: The invention relates to a method for selectively coating metal surfaces, wherein the surface areas that are not to be covered are masked initially with a molten, waxy water-soluble substance, for instance, polyethylene glycol, 1-Hexadecanol, 1-Octadecanol or the like (first masking). After the waxy substance has been allowed to solidify, the metal surface is then selectively or fully coated with an appropriate liquid dielectric fluid or varnish (second masking). The first masking, i. e. the waxy substance, along with the dielectric fluid possibly found thereupon is completely removed from the metal surface with water. The originally waxy masked surface areas which are now free once again can be subjected to a corresponding aftertreatment, for instance, selective galvanic coating. The second masking, i. e. the dielectric coating or varnishing applied, can then be removed completely from the surface, preferably in an appropriate aqueous-alkaline solution or a microphase cleaner. Said second masking can then be preferably subjected to a subsequent cleaning and drying step. In order to achieve better coating results, a corresponding cleaning and drying step can also be carried out before applying the waxy masking substance and the dielectric coating or varnishing. The invention also relates to a selective coating system for implementing the inventive method.

    VERFAHREN UND SYSTEM ZUR SELEKTIVEN GALVANISCHEN BESCHICHTUNG VON METALLOBERFLÄCHEN
    10.
    发明授权
    VERFAHREN UND SYSTEM ZUR SELEKTIVEN GALVANISCHEN BESCHICHTUNG VON METALLOBERFLÄCHEN 有权
    方法和系统金属表面选择性电镀层

    公开(公告)号:EP1468127B1

    公开(公告)日:2005-05-04

    申请号:EP02779151.6

    申请日:2002-10-11

    IPC分类号: C25D5/02

    CPC分类号: C25D5/022 B41J3/407

    摘要: Disclosed is a method for selective electro-coating of the surfaces of metals, wherein the surface areas which not are to be coated are initially masked by contactless application of a liquid dielectric and, subsequently, the non-masked surface areas are electroplated. The dielectric is applied in a very precise manner in very fine droplets (14) having a substantially identical droplet size of between 3 and 70 micrometers and a contour acuity of less or equal to 80 micrometers. The droplets (14) are initially electrically charged and are then controlled according to requirements upon application by an electric field. The dielectric can be applied in at least one continuous interruption-free strip (16) or in a controlled discontinuous manner, enabling masking layers (16) of almost all conceivable forms to be produced, especially for flat, flat-stamped or embossed metal strips (10). After electroplating has occurred, the applied dielectric (16) is removed in a residue-free state in an aqueous solution with microdisperse additives. The invention also relates to an electroplating system for carrying out the above-mentioned method.