公开(公告)号：EP1403913B1

公开(公告)日：2008-04-23

申请号：EP02743801.9

申请日：2002-07-03

申请人： Ohmi, Tadahiro ,  TOKYO ELECTRON LIMITED

发明人： OHMI, Tadahiro ,  SUGAWA, Shigetoshi, Tohoku University ,  HIRAYAMA, Masaki, Ind. Creation Hatchery Ctr.Tohoku Univ. ,  GOTO,Tetsuya, New Ind. Creation Hatchery Ctr.Tohoku Univ.

IPC分类号： H01L21/324 ,  H01L21/00 ,  H01L21/30 ,  H01L21/32

CPC分类号： H01L21/67115 ,  H01L21/3003 ,  H01L21/324 ,  H01L21/67098 ,  H01L21/67109 ,  H01L27/1214 ,  H01L27/127 ,  H01L29/66757 ,  H01L29/78603

摘要： A substrate processing apparatus has a processing space provided with a holding stand for holding a substrate to be processed. A hydrogen catalyzing member is arranged in the processing space to face the substrate and for decomposing hydrogen molecules into hydrogen radicals H*. A gas feeding port is arranged in the processing space on an opposite side of the hydrogen catalyzing member to the substrate for feeding a processing gas including at least hydrogen gas. An interval between the hydrogen catalyzing member and the substrate on the holding stand is set less than the distance that the hydrogen radicals H* can reach.