公开(公告)号：EP2573913A4

公开(公告)日：2015-12-02

申请号：EP12786458

申请日：2012-03-13

Applicant: PANASONIC CORP

Inventor： SADANAGA YUICHIRO ,  KOJIMA MASAO ,  KAMADA YASUSHI ,  KUYAMA KOJI ,  HIDAKA MASAHITO

IPC: H02K5/24 ,  H02K5/167

CPC classification number: H02K5/16 ,  F04D25/0606 ,  F04D29/0467 ,  F04D29/0513 ,  F04D29/056 ,  H02K5/1675 ,  H02K5/24 ,  H02K7/085 ,  H02K2205/03

公开(公告)号：EP2595284A4

公开(公告)日：2016-12-14

申请号：EP11806470

申请日：2011-07-11

Applicant: PANASONIC CORP

Inventor： OKINAGA KINJIROU ,  HIDAKA MASAHITO ,  KUYAMA KOJI ,  CHIBA YOSHIO

IPC: H02K3/50 ,  H02K3/52 ,  H02K5/22 ,  H02K11/00 ,  H02K11/33 ,  H02K15/00 ,  H02K29/08

CPC classification number: H02K5/225 ,  H02K3/522 ,  H02K11/33 ,  H02K15/0006 ,  H02K2203/03 ,  H02K2203/09 ,  Y10T29/49009

公开(公告)号：EP2623253A4

公开(公告)日：2016-11-23

申请号：EP11828490

申请日：2011-03-09

Applicant: KOKI COMPANY LTD ,  PANASONIC CORP

Inventor： IRISAWA ATSUSHI ,  KASHIWABARA MASASHI ,  KONDO KENJI ,  HIDAKA MASAHITO

IPC: B23K35/363 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  C22C1/04 ,  C22C13/00 ,  C22C13/02 ,  H05K3/12 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3616 ,  B23K35/3618 ,  B23K35/362 ,  C22C1/0483 ,  C22C13/00 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489

Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at -40°C to 150°C as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn-Ag-Bi-In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at - 40°C to 150°C is obtained.

公开(公告)号：EP2573913B1

公开(公告)日：2017-05-03

申请号：EP12786458

申请日：2012-03-13

Applicant: PANASONIC CORP

Inventor： SADANAGA YUICHIRO ,  KOJIMA MASAO ,  KAMADA YASUSHI ,  KUYAMA KOJI ,  HIDAKA MASAHITO

IPC: H02K5/24 ,  H02K5/167

CPC classification number: H02K5/16 ,  F04D25/0606 ,  F04D29/0467 ,  F04D29/0513 ,  F04D29/056 ,  H02K5/1675 ,  H02K5/24 ,  H02K7/085 ,  H02K2205/03

公开(公告)号：EP2827475A4

公开(公告)日：2016-04-27

申请号：EP13761997

申请日：2013-01-17

Applicant: PANASONIC CORP

Inventor： OKINAGA KINJIROU ,  SEKI YASUTAKE ,  IIDA TOMOMITSU ,  YASUNO MASATO ,  HIDAKA MASAHITO

IPC: H02K3/18 ,  H02K1/18 ,  H02K3/46 ,  H02K3/52 ,  H02K15/04

CPC classification number: H02K3/28 ,  H02K1/148 ,  H02K3/18 ,  H02K3/345 ,  H02K3/522 ,  H02K15/0081 ,  H02K15/022 ,  H02K15/095 ,  H02K2203/06 ,  Y10T29/49009

Abstract: A stator core is formed by deforming a core assembly having core pieces coupled in a strip form into an annular shape, and by joining both ends of the core assembly together to make a core-fastening portion. Individual phase windings are routed from one end of the core assembly toward another end. Lead portion (43v) of phase winding (40v) and lead portion (43w) of phase winding (40w) make up respective wire terminals. Lead portion (43u) of another phase winding (40u) is extended through a plural number of the core pieces in a direction of the lead portions (43v and 43w), and a wire terminal of the extended lead portion (43u) and the wire terminals of the other lead portions (43v and 43w) are electrically connected to provide a neutral point of three-phase Y-connection circuit.

Abstract translation: 定子芯通过将具有以条形连接的芯片的芯组件变形成环形而形成，并且通过将芯组件的两端连接在一起以形成芯紧固部分而形成。 单个相绕组从芯组件的一端向另一端引导。 相绕组（40v）的引线部分（43v）和相绕组（40w）的引线部分（43w）构成相应的导线端子。 另一个相绕组（40u）的引线部分（43u）沿引线部分（43v和43w）的方向延伸穿过多个芯片，延伸引线部分（43u）和导线 其他引线部分（43v和43w）的端子电连接以提供三相Y连接电路的中性点。

公开(公告)号：EP2395823A4

公开(公告)日：2013-01-23

申请号：EP10721264

申请日：2010-02-22

Applicant: PANASONIC CORP

Inventor： KONDO KENJI ,  HIDAKA MASAHITO ,  KUYAMA KOJI ,  KAMOGI YUTAKA

IPC: H05K3/34 ,  B23K35/26 ,  C22C13/00

CPC classification number: H05K3/3463 ,  B23K1/0016 ,  B23K35/262 ,  H05K2201/068 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/12493 ,  Y10T428/24132 ,  Y10T428/24826 ,  Y10T428/24926

Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn-Ag-Bi-In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from -40 to 150°C has been suppressed.