公开(公告)号：EP2159995A4

公开(公告)日：2011-12-07

申请号：EP08764079

申请日：2008-06-10

Applicant: PANASONIC CORP

Inventor： UETA YOSHIAKI ,  MATSUKI TAKEO ,  TABATA TAICHI ,  TOMOBE SHINJI ,  MANDA YASUTOKI ,  MOCHIZUKI KENICHI

IPC: H04M1/02

CPC classification number: H04M1/0222

公开(公告)号：EP1933609A4

公开(公告)日：2011-01-05

申请号：EP06714109

申请日：2006-02-20

Applicant: PANASONIC CORP

Inventor： HAYAKAWA HARUO ,  ONO MASAHIRO ,  YAMAGUCHI SEIJI ,  UDA YOSHIHIRO ,  SHINCHI KAZUHIRO ,  TOMEKAWA SATORU ,  NAKANISHI KIYOSHI ,  KUBOTA KOSUKE ,  KATAGIRI ATSUSHI ,  KOTANI MOTOHISA ,  KONISHI KAZUHIRO ,  NISHIMURA EIJI ,  MATSUKI TAKEO

IPC: H05K3/28 ,  H05K7/20 ,  H05K9/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. ln the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.