公开(公告)号：EP2608243A4

公开(公告)日：2014-08-13

申请号：EP12792387

申请日：2012-05-25

Applicant: PANASONIC CORP

Inventor： ONO MASAHIRO ,  NAKAGAWA TAKASHI ,  TAKANO AKIRA

IPC: H01H85/08 ,  H01H69/02 ,  H01H85/00 ,  H01H85/12 ,  H01H85/143 ,  H01M2/10 ,  H01M2/30 ,  H01M2/34 ,  H02J7/00

CPC classification number: H01H85/00 ,  H01H69/02 ,  H01H85/0241 ,  H01H85/12 ,  H01H85/143 ,  H01H85/205 ,  H01M2/30 ,  H01M2/34 ,  H01M10/4207 ,  H01M10/425 ,  H01M2200/103 ,  Y10T29/49107

公开(公告)号：EP1933609A4

公开(公告)日：2011-01-05

申请号：EP06714109

申请日：2006-02-20

Applicant: PANASONIC CORP

Inventor： HAYAKAWA HARUO ,  ONO MASAHIRO ,  YAMAGUCHI SEIJI ,  UDA YOSHIHIRO ,  SHINCHI KAZUHIRO ,  TOMEKAWA SATORU ,  NAKANISHI KIYOSHI ,  KUBOTA KOSUKE ,  KATAGIRI ATSUSHI ,  KOTANI MOTOHISA ,  KONISHI KAZUHIRO ,  NISHIMURA EIJI ,  MATSUKI TAKEO

IPC: H05K3/28 ,  H05K7/20 ,  H05K9/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. ln the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

公开(公告)号：EP1933610A4

公开(公告)日：2009-05-06

申请号：EP06782280

申请日：2006-08-03

Applicant: PANASONIC CORP

Inventor： ONO MASAHIRO ,  UDA YOSIHIRO ,  YAMAGUCHI SEIJI ,  SHINCHI KAZUHIRO ,  TOMEKAWA SATORU

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

Abstract: A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided. A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

公开(公告)号：EP2667076A4

公开(公告)日：2014-04-16

申请号：EP12845163

申请日：2012-10-29

Applicant: PANASONIC CORP

Inventor： MIYAKAWA HIDENORI ,  ONO MASAHIRO ,  NOMURA TSUYOSHI

IPC: H01M2/10 ,  B32B7/02 ,  B60R16/04 ,  F16L59/02 ,  H01M10/625 ,  H01M10/627 ,  H01M10/653 ,  H01M10/6551 ,  H01M10/6554 ,  H01M10/6567 ,  H01M10/6571 ,  H01M10/658 ,  H01M10/663

CPC classification number: H01M10/5095 ,  H01M2/1077 ,  H01M2/1083 ,  H01M2/1094 ,  H01M10/625 ,  H01M10/627 ,  H01M10/653 ,  H01M10/6551 ,  H01M10/6554 ,  H01M10/6567 ,  H01M10/6571 ,  H01M10/658 ,  H01M10/663