公开(公告)号：EP3404709A1

公开(公告)日：2018-11-21

申请号：EP18163158.1

申请日：2018-03-21

Applicant: NXP USA, Inc.

Inventor： VISWANATHAN, Lakshminarayan ,  LI, Lu ,  SHAH, Mahesh ,  HART, Paul

IPC: H01L23/36 ,  H01L23/373 ,  H01L23/367 ,  H01L23/433

CPC classification number: H05K1/0206 ,  H01L21/78 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4334 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48175 ,  H01L2924/13091 ,  H05K1/181 ,  H05K3/303 ,  H05K3/32 ,  H05K2201/0215 ,  H05K2201/066 ,  H05K2203/1131

Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.

公开(公告)号：EP2899235B1

公开(公告)日：2018-06-06

申请号：EP13836370.0

申请日：2013-09-05

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou ,  AKASHI Naohisa

IPC: C08L101/00 ,  C08J7/00 ,  C08K3/22 ,  C08K7/04 ,  C08L77/00 ,  H01Q1/38 ,  B41M5/26 ,  H05K3/18

CPC classification number: H01Q1/38 ,  B29C59/16 ,  B29K2101/12 ,  B29K2509/08 ,  B29L2031/3456 ,  B41M5/267 ,  C08G69/265 ,  C08K3/22 ,  C08K3/2279 ,  C08K7/14 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/2248 ,  C08K2003/2255 ,  C08K2003/2296 ,  C08L53/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/243 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/165 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0326 ,  H05K2201/10098 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition.A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.

公开(公告)号：EP3250013A4

公开(公告)日：2018-01-24

申请号：EP16758718

申请日：2016-02-09

Applicant: OMRON TATEISI ELECTRONICS CO

Inventor： KAWAI WAKAHIRO

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/119 ,  H01L2224/20 ,  H01L2224/24195 ,  H05K1/185 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09118

Abstract: An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.

公开(公告)号：EP2484795A3

公开(公告)日：2017-06-21

申请号：EP12163295.4

申请日：2007-11-02

Applicant: Sulzer Metco (US) Inc.

Inventor： Schmid, Richard K. Dr. ,  Doesburg, Jason C.

IPC: C23C4/12 ,  C23C24/04 ,  B23K35/26 ,  B22F3/115 ,  B22F1/02 ,  H05K3/34 ,  B23K35/30 ,  B23K35/38 ,  B23K35/36 ,  B23K35/02

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

Abstract translation: 本发明提供了粉末混合物或复合粉末也被送入动态喷涂设备，以比现有的更好的焊料形成的热和电性能的复合焊料加速朝向基板或一部分。 建立这样一个焊料层的其它优点包括低氧化物含量以提高后续soldcrability，沉积厚度的良好的控制，沉积化学，最后，制造的高速的良好的控制。

公开(公告)号：EP2639262A1

公开(公告)日：2013-09-18

申请号：EP12159858.5

申请日：2012-03-16

Applicant: Mitsubishi Chemical Europe GmbH

Inventor： Schrauwen, Bernardus Antonius Gerardus

IPC: C08K3/22 ,  H05K1/03 ,  H05K3/10

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

Abstract: The present invention relates to a thermoplastic composition comprising: a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt% with respect to the weight of the total composition, wherein the LDS additive comprises a mixed metal oxide comprising at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminum and molybdenum, wherein the LDS additive comprises at least 40 wt% of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1 .

Abstract translation: 本发明涉及一种热塑性组合物，其包含：a）热塑性树脂和b）相对于总组合物重量为至少1重量％的量的激光直接结构化（LDS）添加剂，其中LDS添加剂包括 包含至少含有锡和选自锑，铋，铝和钼的第二金属的混合金属氧化物，其中所述LDS添加剂包含至少40重量％的锡，并且其中所述第二金属与锡的重量比为 至少0.02：1。

公开(公告)号：EP1921176A3

公开(公告)日：2012-04-04

申请号：EP07119869.1

申请日：2007-11-02

Applicant: Sulzer Metco (US) Inc.

Inventor： Schmid, Dr., Richard K. ,  Doesburg, Jacobus C.

IPC: C23C4/12 ,  C23C24/04 ,  B23K35/26 ,  B22F3/115 ,  B22F1/02 ,  H05K3/34

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent soldcrability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

公开(公告)号：EP1667507B1

公开(公告)日：2012-02-01

申请号：EP06003717.3

申请日：1999-09-14

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

公开(公告)号：EP1061785B1

公开(公告)日：2010-07-28

申请号：EP00305072.1

申请日：2000-06-15

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Gaku, Morio, ,  Ikeguchi, Nobuyuki, ,  Kato, Yoshihiro, ,  Aoto, Hiroki,

IPC: H05K3/00 ,  H05K3/42 ,  B32B15/08 ,  B23K26/18

CPC classification number: H05K3/0038 ,  B23K2201/42 ,  H05K3/429 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/0346 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP2156713A1

公开(公告)日：2010-02-24

申请号：EP08717788.7

申请日：2008-03-13

Applicant: Robert Bosch GmbH

Inventor： WERNER, Michael ,  LACHENMAIER, Armin ,  LISCHECK, Andre ,  SCHULZ, Udo ,  PROEPPER, Thomas ,  DIEKE, Stephan ,  BARTH, Heinrich ,  HENNEL, Udo ,  KIRSCHNER, Manfred

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K3/105 ,  B82Y10/00 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0284 ,  H05K1/0293 ,  H05K1/0373 ,  H05K1/119 ,  H05K3/4069 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/083 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/107 ,  H05K2203/159 ,  H05K2203/173

Abstract: The invention relates to a control device of a motor vehicle, preferably a motor control device of the motor vehicle, comprising at least one plastic substrate, with which an electrically conductive and/or thermally conductive element is associated. The invention provides for the plastic substrate (1) to have at least one electrically conductive and/or thermally conductive doping (16, 17) forming the element in at least some regions. The invention further relates to a method for the production of a plastic substrate for a control device of a motor vehicle, particularly as described above. The invention also provides for the plastic substrate to be doped for the configuration of an electrically conductive and/or thermally conductive structure, at least in some regions.

公开(公告)号：EP1030544B1

公开(公告)日：2009-12-30

申请号：EP98947819.3

申请日：1998-10-12

Applicant: IBIDEN CO., LTD.

Inventor： ASAI, Motoo ,  SHIMADA, Kenichi ,  NODA, Kouta ,  KARIYA, Takashi ,  SEGAWA, Hiroshi

IPC: H05K3/46

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Over a board in which through-holes are formed, conductor circuits are formed on interlayer resin insulating layers. The through-holes have roughed inner walls and are filled with filling material. The parts where the filling material are exposed are covered with through-hole covering conductor layers. Further, via-holes formed directly above the through-hole covering conductor layers are connected to the conductor layers. The filling material is not separated from the through-holes, the connection reliability between the through-holes and the internal layer circuits is high and, further, high density wiring can be realized.