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1.发明公开MULTILAYER BOARD SURFACE-TREATED CONFIGURATION AND THE PRODUCING METHOD THEREOF 有权表面处理的配置多层印刷电路板及其制造方法
公开(公告)号：EP2161976A4
公开(公告)日：2011-07-13
申请号：EP07721472
申请日：2007-06-15
Applicant: PRINCO CORP
Inventor： YANG CHIH-KUANG , HSING CHIEH-LIN
IPC: H05K3/34
CPC classification number: H05K3/4007 , H05K3/107 , H05K3/20 , H05K3/243 , H05K3/3452 , H05K2201/0367 , H05K2201/0376 , H05K2201/099
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