公开(公告)号：EP1669991B1

公开(公告)日：2012-06-06

申请号：EP05762045.2

申请日：2005-07-20

申请人： Panasonic Corporation

发明人： TOMIYAMA, Morio c/o Matsushita Electric Industrial Co., Ltd. ,  NISHIKIORI, Keiji c/o Matsushita Electric Industrial Co., Ltd. ,  TOMEKAWA, Yuuko c/o Matsushita Electric Industrial Co., Ltd.

IPC分类号： G11B7/26 ,  G11B7/24

CPC分类号： B29C41/20 ,  B29C41/12 ,  B29C41/36 ,  B29C43/021 ,  B29C43/06 ,  B29C43/146 ,  B29C43/203 ,  B29C2035/0827 ,  B29C2043/025 ,  B29C2043/561 ,  B29D17/005 ,  B29L2017/005 ,  G11B7/24038 ,  G11B7/246 ,  G11B7/252 ,  G11B7/253 ,  G11B7/2533 ,  G11B7/2542 ,  G11B7/257 ,  G11B7/258 ,  G11B7/259 ,  G11B7/2595 ,  G11B7/263 ,  G11B2007/24306 ,  G11B2007/24316 ,  G11B2007/2432 ,  Y10T156/1189

摘要： A method for manufacturing a multilayer information recording medium including a signal substrate 601, at least two information recording portions disposed on the signal substrate 601 and a resin layer disposed between the information recording portions adjacent to each other is provided. The method includes forming the resin layer, and in the forming of the resin layer 603, a resin-containing coating is applied onto the signal substrate 601 except for edge portions 601a and 601b of the signal substrate 601 through openings of a screen, the signal substrate 601 and a signal transfer substrate are attached to each other via the applied resin-containing coating under a pressure lower than atmospheric pressure, a resin contained in the applied resin-containing coating is cured to form the resin layer, and then the signal transfer substrate is peeled off from the resin layer.