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公开(公告)号：EP1875518A2
公开(公告)日：2008-01-09
申请号：EP06722773.6
申请日：2006-04-11
申请人： Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH , Osram Opto Semiconductors GmbH & Co. OHG
发明人： BRAUNE, Bert , JERMANN, Frank , STRAUSS, Jörg
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a luminescence conversion of LED which uses a blue emitting chip and two illuminating substances, whereby one emits a red and the other a yellow to green. Both illuminating substances are separated upstream from the chip.
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公开(公告)号：EP1664238A1
公开(公告)日：2006-06-07
申请号：EP04786852.6
申请日：2004-09-24
申请人： Osram Opto Semiconductors GmbH , Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH , Osram Opto Semiconductors GmbH
发明人： BRUNNER, Herbert , FIEDLER, Tim , JERMANN, Frank , ZACHAU, Martin , BRAUNE, Bert , BRUNNER, Herbert , FIEDLER, Tim , JERMANN, Frank , ZACHAU, Martin , BRAUNE, Bert
CPC分类号： H01L33/502 , C09K11/0883 , C09K11/7734 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a luminous substance that belongs to the class of oxinitridosilicates, comprises a cation M which is doped with divalent europium, and is of general formula M(1-c)Si2O2N2:Dc, wherein M = Sr or M = Sr(1-x-y)BayCax with the stipulation x+y
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公开(公告)号：EP1611619A2
公开(公告)日：2006-01-04
申请号：EP04725878.5
申请日：2004-04-06
发明人： BRAUNE, Bert , BRUNNER, Herbert , JERMANN, Frank , ZACHAU, Martin
IPC分类号： H01L33/00
CPC分类号： H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is an LED comprising inorganic luminous substance. An LED chip emits primary radiation ranging between 300 and 470 nm, said radiation being partly or fully converted into longer-wave radiation by means of at least one luminous substance which is exposed to the primary radiation of the LED. The conversion is achieved at least with the aid of a luminous substance whose average particle size d50 ranges between 1 and 50 nm, preferably between 2 and 25 nm.
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4.发明公开OBERFLÄCHENMONTIERBARES OPTOELEKTRONISCHES HALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权VERFAHREN ZU DESSEN HERSTELLUNG的OBERFLÄCHENMONTIBARESOPTOELEKTRONISCHES HALBLEITERBAUELEMENT
公开(公告)号：EP1920470A1
公开(公告)日：2008-05-14
申请号：EP06775910.0
申请日：2006-08-24
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/97 , H01L25/167 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/8592 , H01L2924/01055 , H01L2924/01065 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12043 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a surface-mounted component comprising an optoelectronic semiconductor chip (1), a molded member (2) that is molded onto the semiconductor chip (1), an assembly area (3) which is formed at least in some points by a surface of the molded member (2), and at least one terminal point (4a, 4b) which is overlapped laterally by the molded member (2) or extends flush with the molded member (2). Also disclosed is a method for producing such a component.
摘要翻译： 表面安装的光电子部件包括光电子半导体芯片（1），成形体（2），其成形在芯片上，安装表面（3）至少定位成穿过成形体的表面，至少 通过切割产生的部件的一个连接点（4a，4b）和侧表面（2a，2b）。 对于上述的生产过程也包括独立权利要求。
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公开(公告)号：EP1153101A1
公开(公告)日：2001-11-14
申请号：EP00989932.9
申请日：2000-11-30
发明人： BRAUNE, Bert , WAITL, Guenther , BOGNER, Georg , HINTZEN, H.T.,Lab. Solid State & Materials Chem. , VAN KREVEL, J.W.H.,Lab. Solid State & Mat. Chemic , BOTTY, Ir.G.,Oce Technologies B.V.
IPC分类号： C09K11/79
CPC分类号： C09K11/7735 , C09K11/7734
摘要： A light source uses a yellow to red emitting phosphor with a host lattice of the nitridosilicate type MxSiyNz:Eu, wherein M is at least one of an alkaline earth metal chosen from the group Ca, Sr, Ba and wherein z = 2/3x + 4/3y.
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