公开(公告)号：EP0588406B1

公开(公告)日：1997-06-11

申请号：EP93202535.6

申请日：1993-08-31

申请人： Philips Electronics N.V.

发明人： de Poorter, Johannes Antonius ,  Tijburg, Rudolf Paulus ,  van de Pas, Hermanus Antonius

IPC分类号： H01L33/00 ,  H01S3/025

CPC分类号： H01L33/62 ,  H01L25/162 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01S5/0201 ,  H01L2924/00014

公开(公告)号：EP0589524A3

公开(公告)日：1994-04-20

申请号：EP93202701.4

申请日：1993-09-17

申请人： Philips Electronics N.V.

发明人： van de Pas, Hermanus Antonius ,  Tijburg, Rudolf Paulus ,  De Poorter, Johannes Antonius

IPC分类号： H01S3/025 ,  H01L33/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01S5/02236 ,  H01S5/02276 ,  H01L2224/78 ,  H01L2224/05599 ,  H01L2924/00

摘要： Optoelectronic devices often comprise an optoelectronic semiconductor element such as a diode laser fastened on a carrier. The desired path of a beam of radiation from or to such an element often implies that such an element has to be fastened on the carrier at a certain, for example right angle. As a result, a contact surface of such an element also encloses an angle with another contact surface which lies on the carrier. The provision of a wire connection by means of a wire bonding unit is rendered difficult by this. In the known method, two wire connections and an interposed block are used for solving this problem. A disadvantage of the known method is that it is comparatively laborious and expensive, so that the manufactured devices are also expensive. In a method according to the invention, one of the two contact surfaces is provided with a wire which has a free end, and after fastening of the diode laser or photodiode the free end of the wire is fastened on the other contact surface. One wire connection can suffice and no auxiliary block is necessary with this wire connection method in two steps. Preferably, the wire having the free end is provided on the element. This has various additional advantages such as a less critical fastening of the free end of the wire and the possibility of a reliable intermediate test owing to which the yield of the expensive end product is increased. The invention also relates to an element, preferably fastened on a support body, on which a wire having a free end has been applied.

摘要翻译： 光电器件通常包括光电半导体元件，例如固定在载体上的二极管激光器。 来自或向这种元件的辐射束的期望路径通常意味着这种元件必须以一定的例如直角紧固在载体上。 结果，这种元件的接触表面也与位于载体上的另一个接触表面包围一个角度。 通过引线接合单元提供电线连接变得困难。 在已知的方法中，使用两个线连接和插入块来解决这个问题。 已知方法的缺点在于它相当费力且昂贵，因此制造的装置也是昂贵的。 在根据本发明的方法中，两个接触表面中的一个设置有具有自由端的线，并且在紧固二极管激光器或光电二极管之后，线的自由端紧固在另一个接触表面上。 这种电线连接方法可以通过两个步骤完成一个电线连接，而不需要辅助电源。 优选地，具有自由端的线设置在元件上。 这具有各种附加的优点，例如线的自由端的紧密紧固以及可靠的中间测试的可能性，由此导致昂贵的最终产品的产量增加。 本发明还涉及一种优选地紧固在支撑体上的元件，其上已经施加了具有自由端的线。

公开(公告)号：EP0589524A2

公开(公告)日：1994-03-30

申请号：EP93202701.4

申请日：1993-09-17

申请人： Philips Electronics N.V.

发明人： van de Pas, Hermanus Antonius ,  Tijburg, Rudolf Paulus ,  De Poorter, Johannes Antonius

IPC分类号： H01S3/025 ,  H01L33/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01S5/02236 ,  H01S5/02276 ,  H01L2224/78 ,  H01L2224/05599 ,  H01L2924/00

摘要： Optoelectronic devices often comprise an optoelectronic semiconductor element such as a diode laser fastened on a carrier. The desired path of a beam of radiation from or to such an element often implies that such an element has to be fastened on the carrier at a certain, for example right angle. As a result, a contact surface of such an element also encloses an angle with another contact surface which lies on the carrier. The provision of a wire connection by means of a wire bonding unit is rendered difficult by this. In the known method, two wire connections and an interposed block are used for solving this problem.
A disadvantage of the known method is that it is comparatively laborious and expensive, so that the manufactured devices are also expensive.
In a method according to the invention, one of the two contact surfaces is provided with a wire which has a free end, and after fastening of the diode laser or photodiode the free end of the wire is fastened on the other contact surface. One wire connection can suffice and no auxiliary block is necessary with this wire connection method in two steps. Preferably, the wire having the free end is provided on the element. This has various additional advantages such as a less critical fastening of the free end of the wire and the possibility of a reliable intermediate test owing to which the yield of the expensive end product is increased. The invention also relates to an element, preferably fastened on a support body, on which a wire having a free end has been applied.

摘要翻译： 光电器件OFT包括光电子半导体元件：如二极管激光器固定有载体上。 辐射束的从或向寻求元件所期望的路径经常意味着没有搜索元素具有在一定的载波上例如固定直角。 其结果，谋求元件的接触表面，因此在包围与另一接触面的位于载体上的角度。 通过引线键合单元的装置上的线材连接的提供由该变得困难。 在已知的方法中，两个导线连接并阻止插入用于此解决的一个问题。 该已知方法的缺点是这样做是比较费力的和昂贵的，所以没有所制造的装置是如此昂贵。 在雅丁到本发明的方法中，两个接触表面中的一个设置有具有自由端导线，并且导线的自由端上的二极管激光器或光电二极管的紧固之后被紧固的其它接触表面上。 一个导线连接可以是足够的和没有辅助块是必要的在两个步骤中该线的连接方法。 优选地，提供在元件上具有自由端的金属丝。 这具有各种附加的优点：如金属丝的自由端的不太关键的紧固和由于哪个昂贵的最终产品的产率的可靠中间试验的可能性增加。 因此，本发明涉及到元件，优选固定在支承体上，其上具有一个自由端的金属丝已被应用。

公开(公告)号：EP0589524B1

公开(公告)日：1997-07-09

申请号：EP93202701.4

申请日：1993-09-17

申请人： Philips Electronics N.V.

发明人： van de Pas, Hermanus Antonius ,  Tijburg, Rudolf Paulus ,  De Poorter, Johannes Antonius

IPC分类号： H01S3/025 ,  H01L33/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01S5/02236 ,  H01S5/02276 ,  H01L2224/78 ,  H01L2224/05599 ,  H01L2924/00

公开(公告)号：EP0588406A1

公开(公告)日：1994-03-23

申请号：EP93202535.6

申请日：1993-08-31

申请人： Philips Electronics N.V.

发明人： de Poorter, Johannes Antonius ,  Tijburg, Rudolf Paulus ,  van de Pas, Hermanus Antonius

IPC分类号： H01L33/00 ,  H01S3/025 ,  H05K1/00

CPC分类号： H01L33/62 ,  H01L25/162 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01S5/0201 ,  H01L2924/00014

摘要： In the known method, a plate of a heat-conducting material, for example silicon, is subdivided by means of grooves into blocks which remain connected to one another along break-off edges. The plate is metallized on two sides and (locally) provided with layer-shaped regions comprising solder at the upper side, the diode laser being fastened within each region, after which the blocks are separated from one another by breaking-off.
A disadvantage of this method is that the blocks thus obtained are not suitable for a final mounting in which the radiation beam of the diode laser is perpendicular to the carrier plate on which the support body is fastened.
In a method according to the invention, mutually parallel grooves are provided in the plate and the plate is subdivided into strips whose longitudinal direction is perpendicular to the direction of the grooves which are at most two support bodies wide and whose side surfaces are substantially smooth and flat, and the upper surface and the side surfaces of the strips are provided with a conductive layer in one step, after which the layer-shaped regions comprising solder are provided on one of these surfaces. This method is simple, comprises comparatively few steps, and results in a large number of interconnected support bodies which are suitable for mounting with the support body tilted through 90°. This renders it possible to mount diode lasers on the support bodies before the latter are separated and to mount them finally relative to a carrier plate in such a way that the radiation beam is approximately perpendicular to the carrier plate. Preferably, strips having a width of exactly one support body are formed.

摘要翻译： 在已知的方法中，导热材料（例如硅）的板通过凹槽被细分成块，其沿着断开边缘保持彼此连接。 该板在两侧金属化并且（局部地）设置有在上侧包括焊料的层状区域，二极管激光器被紧固在每个区域内，之后块通过断开彼此分离。 该方法的缺点在于，由此获得的块不适用于二极管激光器的辐射束垂直于固定有支撑体的承载板的最终安装。 在根据本发明的方法中，在板中设置相互平行的槽，并且板被细分成条，其长度方向垂直于至多两个支撑体宽的槽的方向，并且其侧表面基本上平滑， 平坦，并且条的上表面和侧表面在一个步骤中设置有导电层，之后在其中一个表面上设置包括焊料的层状区域。 该方法简单，包括较少的步骤，并且导致大量互连的支撑体，其适用于支撑体倾斜90°的安装。 这使得可以在支撑体分离之后将二极管激光器安装在支撑体上，并且相对于载板最终安装它们，使得辐射束大致垂直于载体板。 优选地，形成具有正好一个支撑体的宽度的条带。