公开(公告)号：EP2161976A1

公开(公告)日：2010-03-10

申请号：EP07721472.4

申请日：2007-06-15

Applicant: Princo Corp.

Inventor： YANG, Chih-kuang ,  HSING, Chieh-Lin

IPC: H05K3/34

CPC classification number: H05K3/4007 ,  H05K3/107 ,  H05K3/20 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/099

Abstract: A surface finish structure of multi-layer substrate and manufacturing method thereof. The surface finish structure of the present invention includes a bond pad layer, at least one cover metal layer and a solder mask. The cover metal layer covers the bond pad layer. The solder mask has a hole to expose the cover metal layer. The present invention can form the cover metal layer to cover the bond pad layer and then forms the solder mask. Thereafter, the hole is made to the solder mask at the position of the cover metal layer to expose thereof. Because the bond pad layer is embedded in a dielectric layer of the multi-layer substrate, adhesion intensity between the bond pad layer and the dielectric layer can be enhanced. Meanwhile, contact of the bond pad layer with the solder can be prevented with the cover metal layer.

Abstract translation: 多层基板的表面处理结构及其制造方法。 本发明的表面光洁度结构包括接合焊盘层，至少一个覆盖金属层和焊接掩模。 覆盖金属层覆盖接合焊盘层。 焊接掩模具有用于暴露覆盖金属层的孔。 本发明可以形成覆盖金属层以覆盖接合焊盘层，然后形成焊接掩模。 此后，在覆盖金属层的位置处将该孔制成焊料掩模以使其露出。 由于接合焊盘层嵌入在多层基板的电介质层中，所以可以提高接合焊盘层与电介质层之间的粘合强度。 同时，可以通过覆盖金属层来防止接合焊盘层与焊料的接触。

公开(公告)号：EP2161976B1

公开(公告)日：2013-09-25

申请号：EP07721472.4

申请日：2007-06-15

Applicant: Princo Corp.

Inventor： YANG, Chih-kuang ,  HSING, Chieh-Lin

IPC: H05K3/34

CPC classification number: H05K3/4007 ,  H05K3/107 ,  H05K3/20 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/099