公开(公告)号：EP1481575A2

公开(公告)日：2004-12-01

申请号：EP03743491.7

申请日：2003-03-03

Applicant: Printar Ltd.

Inventor： ZOHAR, Ron ,  MOZEL, Jacob ,  VILK, Ran

IPC: H05K3/02 ,  H01K3/10 ,  B05D5/12 ,  B05D5/00 ,  B05D3/02 ,  B05D3/00 ,  C08F2/48 ,  C08J7/06

CPC classification number: H05K3/0091 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/081 ,  H05K2203/1509

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board (360) having elevated pads defining pad edges, the method including flooding the printed circuit board (360) with ink such that the ink advances, without climbing onto the elevated pads.