专利检索 ap:("QUALCOMM INCORPORATED") AND inv:"CHINTARLAPALLI REDDY, Harikrishna" 第 1 页

1.

发明公开
CELL ARCHITECTURE WITH AN ADDITIONAL OXIDE DIFFUSION REGION 审中-公开

公开(公告)号：EP4256607A1

公开(公告)日：2023-10-11

申请号：EP21816620.5

申请日：2021-11-17

申请人： QUALCOMM INCORPORATED

发明人： CHINTARLAPALLI REDDY, Harikrishna , SANA, Pradeep Kumar , LEE, Chulkyu , LEE, Jeffrey Charles , MOHAMAD, Sajin

IPC分类号： H01L21/8238 , H01L27/02 , H01L27/092

2.

发明公开
THIN-FILM RESISTORS WITH FLEXIBLE TERMINAL PLACEMENT FOR AREA SAVING 审中-公开

公开(公告)号：EP3942608A1

公开(公告)日：2022-01-26

申请号：EP20715230.7

申请日：2020-02-26

申请人： QUALCOMM INCORPORATED

发明人： CHINTARLAPALLI REDDY, Harikrishna , LOKE, Alvin Leng Sun

IPC分类号： H01L27/01 , H01L49/02 , H01C1/14 , H01L27/08