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    Vibration isolated MEMS structures and methods of manufacture
    1.
    发明公开
    Vibration isolated MEMS structures and methods of manufacture 审中-公开
    振动分离器MEMS-Strukturen和Herstellungsverfahren

    公开(公告)号：EP2672220A2

    公开(公告)日：2013-12-11

    申请号：EP13170705.1

    申请日：2013-06-05

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P. ,  Childress, Marcus A.

    IPC分类号： G01C19/5712 ,  G01C19/5783

    摘要： A microstructure device has a microstructure (e.g., a circuit card assembly, a printed circuit board, etc.) defining a sensitive axis and one or more isolators configured and adapted to be compliant along the sensitive axis and to be rigid along one or more other axes.

    摘要翻译： 微结构装置具有限定敏感轴的微结构（例如，电路卡组件，印刷电路板等）和一个或多个隔离器，其被配置和适于沿着敏感轴线顺从并且沿着一个或多个其它的刚性 轴。

    MEMs gyros with quadrature reducing springs
    3.
    发明公开
    MEMs gyros with quadrature reducing springs 审中-公开
    MEMS陀螺仪具有减少位移的羽毛

    公开(公告)号：EP2444775A3

    公开(公告)日：2014-05-07

    申请号：EP11250871.8

    申请日：2011-10-25

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P. ,  Childress, Marc A. ,  Christenson, John C.

    IPC分类号： G01C19/5712

    摘要： Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.

    Stress isolated mems structures and methods of manufacture
    4.
    发明公开
    Stress isolated mems structures and methods of manufacture 有权
    Spannungsisolierte MEMS-Strukturen und Herstellungsverfahren

    公开(公告)号：EP2653443A2

    公开(公告)日：2013-10-23

    申请号：EP13164524.4

    申请日：2013-04-19

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P. ,  Christenson, John C. ,  Satterlund, Bruce H. ,  Phillips, Randy ,  Holmquist, Dave

    IPC分类号： B81B7/00

    CPC分类号： B81B7/0048 ,  H01L2224/48147 ,  H01L2224/48472

    摘要： A MEMS pressure sensor may be manufactured to include a backing substrate (104) having a diaphragm backing portion (106) and a pedestal portion (108). A diaphragm substrate (102) may be manufactured to include a pedestal portion (110) and a diaphragm (112) that is mounted to the diaphragm backing portion (106) of the backing substrate (104) to form a stress isolated MEMS die (101). The pedestal portions of the backing and diaphragm substrates form a pedestal (116) of the stress isolated MEMS die (101). The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.

    摘要翻译： 可以制造MEMS压力传感器以包括具有隔膜背衬部分（106）和基座部分（108）的背衬基底（104）。 可以制造隔膜基板（102）以包括安装到背衬基板（104）的隔膜背衬部分（106）上的基座部分（110）和隔膜（112），以形成应力隔离的MEMS管芯（101 ）。 背衬和隔膜基板的基座部分形成应力隔离MEMS管芯（101）的基座（116）。 基座被配置为隔离隔离应力，包括施加在应力隔离的MEMS管芯上的封装和安装应力。

    Separation Mode Capacitors for Sensors
    6.
    发明公开
    Separation Mode Capacitors for Sensors 审中-公开
    用于传感器分离模式电容器

    公开(公告)号：EP2662677A2

    公开(公告)日：2013-11-13

    申请号：EP13166298.3

    申请日：2013-05-02

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P.

    IPC分类号： G01L9/00

    CPC分类号： G01L9/0048 ,  G01L9/0072 ,  G01L27/007

    摘要： A capacitor (100) for use in sensors includes opposed first and second capacitor plates (102, 104), wherein the second capacitor plate (104) is mounted to the first capacitor plate (102) by a flexible attachment (108). The flexible attachment (108) is configured and adapted so that flexure of the attachment (108) causes a change in the spacing between the first and second capacitor plates (102, 104) to cause a change in the capacitance thereacross.

    MEMs gyros with quadrature reducing springs
    7.
    发明公开
    MEMs gyros with quadrature reducing springs 审中-公开
    MEMS-Kreisel mit Federn zur Reduzierung der Verschiebung

    公开(公告)号：EP2444775A2

    公开(公告)日：2012-04-25

    申请号：EP11250871.8

    申请日：2011-10-25

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P. ,  Childress, Marc A. ,  Christenson, John C.

    IPC分类号： G01C19/5712

    摘要： Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.

    摘要翻译： 公开了包括弹簧几何形状的有利组合的弹簧组合。 具有弯曲和直的部分的弹簧元件，相对于公共半径的弹簧元件锚定点的取向，弹簧元件段相对于特定轴线的取向，弹簧元件围绕公共半径的平衡以及关于公共半径的质量平衡 公共半径可用于减轻不需要的平面外运动。 弹簧组提供平面运动，同时减少不期望的平面外运动，使得MEMS器件对于弹簧元件的工艺感应蚀刻角度变化基本上不敏感。 弹簧组可以用在MEMS陀螺仪装置中，即使在制造过程中的变化导致不希望的蚀刻角度时，它也保持期望的谐振模式和始终如一的低正交误差。

    Vibration isolated MEMS structures and methods of manufacture
    9.
    发明公开
    Vibration isolated MEMS structures and methods of manufacture 审中-公开
    振动隔离MEMS结构和制造方法

    公开(公告)号：EP2672220A3

    公开(公告)日：2017-10-04

    申请号：EP13170705.1

    申请日：2013-06-05

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P. ,  Childress, Marcus A.

    IPC分类号： G01C19/5712 ,  G01C19/5783 ,  B81B3/00

    摘要： A microstructure device has a microstructure (e.g., a circuit card assembly, a printed circuit board, etc.) defining a sensitive axis and one or more isolators configured and adapted to be compliant along the sensitive axis and to be rigid along one or more other axes.

    摘要翻译： 微结构器件具有限定敏感轴的微结构（例如，电路卡组件，印刷电路板等）以及一个或多个隔离器，所述隔离器被配置成适于沿着敏感轴顺从且沿着一个或多个其他 轴。

    Separation Mode Capacitors for Sensors
    10.
    发明公开
    Separation Mode Capacitors for Sensors 审中-公开
    传感器用分离模式电容器

    公开(公告)号：EP2662677A3

    公开(公告)日：2017-04-26

    申请号：EP13166298.3

    申请日：2013-05-02

    申请人： ROSEMOUNT AEROSPACE INC.

    发明人： Potasek, David P.

    IPC分类号： G01L9/00 ,  G01L27/00

    CPC分类号： G01L9/0048 ,  G01L9/0072 ,  G01L27/007

    摘要： A capacitor (100) for use in sensors includes opposed first and second capacitor plates (102, 104), wherein the second capacitor plate (104) is mounted to the first capacitor plate (102) by a flexible attachment (108). The flexible attachment (108) is configured and adapted so that flexure of the attachment (108) causes a change in the spacing between the first and second capacitor plates (102, 104) to cause a change in the capacitance thereacross.

    摘要翻译： 用于传感器的电容器（100）包括相对的第一和第二电容器板（102,104），其中第二电容器板（104）通过柔性附件（108）安装到第一电容器板（102）。 柔性附件（108）被配置并适于使得附件（108）的弯曲引起第一和第二电容器极板（102,104）之间的间隔的变化，以引起其间的电容的变化。