公开(公告)号：EP3969429A1

公开(公告)日：2022-03-23

申请号：EP20810182.4

申请日：2020-05-18

申请人： University of Maryland, College Park

发明人： HU, Liangbing ,  WANG, Chengwei

IPC分类号： C04B35/00 ,  C09K5/00 ,  G01C19/5783

公开(公告)号：EP3403053B1

公开(公告)日：2019-11-06

申请号：EP17704550.7

申请日：2017-01-12

申请人： Panasonic Intellectual Property Management Co., Ltd. ,  Continental Automotive GmbH

发明人： MITANI, Tomohiro ,  UCHIDA, Takashi ,  REFCIO, Georg

IPC分类号： G01C19/5783 ,  G01P1/02 ,  H01L23/04 ,  H01L23/10

公开(公告)号：EP3358357A1

公开(公告)日：2018-08-08

申请号：EP16850874.5

申请日：2016-08-03

申请人： Hitachi Automotive Systems, Ltd.

发明人： DEGAWA, Munenori ,  KIKUCHI, Hiroshi

IPC分类号： G01P15/08 ,  B81B3/00 ,  G01C19/5747 ,  G01C19/5783 ,  G01D21/02 ,  G01L9/00 ,  G01P15/125 ,  G01P15/18 ,  H01L29/84

CPC分类号： B81B7/02 ,  B81B3/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0109 ,  B81B2203/04 ,  B81B2203/051 ,  B81B2207/015 ,  B81B2207/07 ,  G01C19/5747 ,  G01C19/5783 ,  G01D21/02 ,  G01L9/0052 ,  G01L9/12 ,  G01P15/08 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18

摘要： Provided is an inertia sensor that can be reduced in size. An inertia sensor having layers 1a, 2a in which detection parts 20, 30 are formed, the inertial sensor being a laminated structure obtained by laminating two or more of the layers.

公开(公告)号：EP2860532B1

公开(公告)日：2016-09-21

申请号：EP14187546.8

申请日：2014-10-02

申请人： Freescale Semiconductor, Inc.

发明人： Liu, Lianjun ,  Bates, James S. ,  Chowdhury, Mamur ,  Monk, David J. ,  Taheri, Babak A.

IPC分类号： G01P15/125 ,  G01C19/5783 ,  G01L1/14

CPC分类号： B81B3/0021 ,  B81B7/0006 ,  B81C1/00158 ,  B81C1/00198 ,  G01C19/5783 ,  G01L1/142 ,  G01L1/246 ,  G01L9/0073 ,  G01P15/125

公开(公告)号：EP2988135A3

公开(公告)日：2016-06-22

申请号：EP15180657.7

申请日：2015-08-11

申请人： Honeywell International Inc.

发明人： Schlager, Matthew ,  Snyder, Scott ,  Van-Cao, Dang Tu

IPC分类号： G01P1/00 ,  G01P1/02 ,  G01C21/26 ,  G01P21/00 ,  G01C19/5783 ,  G01C25/00

CPC分类号： G01P21/00 ,  G01C19/5783 ,  G01C25/00 ,  G01P1/003 ,  G01P1/023

摘要： Systems and method for reducing the size of inertial measurement units are disclosed. In one embodiment, an inertial measurement unit assembly comprises: at least one inertial sensor configured to output uncompensated sensor data; an inertial isolator configured to isolate the at least one inertial sensor; an interface adapter, wherein the interface adapter includes at least one calibration alignment pin that is used as a reference point between the at least one inertial sensor, the inertial interface adapter and a vehicle to which the inertial interface adapter is attached. Furthermore, the inertial measurement unit is configured to output the uncompensated sensor data to a processing device located external to the inertial measurement unit.

公开(公告)号：EP2759802A2

公开(公告)日：2014-07-30

申请号：EP14152747.3

申请日：2014-01-27

申请人： MCube, Inc.

发明人： Lee, Terrence ,  Zhang, Wenhua ,  Sridharamurthy, Sudheer ,  Shingo, Yoneoka

IPC分类号： G01C19/5783 ,  G01P1/02

CPC分类号： G01C19/56 ,  B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/5783 ,  G01P1/003 ,  G01P15/02 ,  G01P15/18 ,  G01P2015/0871 ,  G01P2015/088

摘要： A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

摘要翻译： 多轴集成MEMS惯性传感器装置。 该设备可以在单个芯片上包含一个集成的3轴陀螺仪和3轴加速度计，创建一个6轴惯性传感器设备。 通过将加速度计装置添加到陀螺仪装置的中心，该结构在空间上有效地利用了芯片的设计区域。 设计架构可以是几何形状的矩形或方形形状，这样可以利用整个芯片区域，并在一定的区域内最大化传感器尺寸。 MEMS集中在封装中，这有利于传感器的温度性能。 此外，集成多轴惯性传感器装置的电接合焊盘可以配置在矩形芯片布局的四个角中。 该配置保证了设计的对称性和芯片面积的有效利用。

公开(公告)号：EP2447672A3

公开(公告)日：2014-01-22

申请号：EP12151093.7

申请日：2004-10-28

申请人： Seiko Epson Corporation

发明人： Ishikawa, Seiji ,  Kikuchi, Takayuki ,  Hayashi, Shigeki

IPC分类号： G01C19/56 ,  G01C19/5621 ,  G01C19/5628 ,  G01C19/5783

CPC分类号： G01C19/5621 ,  G01C19/5628 ,  G01C19/5783

摘要： The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member for supporting a vibrator with a bonding wire.
The supporting member comprises a supporting plate with an opening formed therein to be positioned direct under a vibrator; and a bonding wire 31, 32 comprising an end portion 29 to be bonded with said vibrator, a fixed portion 31a, 32a fixed on said supporting plate, a leg portion 31b, 32b extending from said end portion and a curved portion 31d, 32d provided between said leg portion and fixed portion.

公开(公告)号：EP1951609A4

公开(公告)日：2014-01-22

申请号：EP06808049

申请日：2006-11-21

申请人： MURATA ELECTRONICS OY

发明人： KUISMA HEIKKI

IPC分类号： B81B7/02 ,  B81B20060101 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  G01L9/00 ,  G01P15/18

CPC分类号： G01C19/56 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2203/0792 ,  G01C19/5783 ,  G01L9/0042 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

公开(公告)号：EP1684047A4

公开(公告)日：2014-01-22

申请号：EP04793341

申请日：2004-10-28

申请人： SEIKO EPSON CORP

发明人： ISHIKAWA SEIJI ,  KIKUCHI TAKAYUKI ,  HAYASHI SHIGEKI

IPC分类号： G01C19/56 ,  G01C19/5621 ,  G01C19/5628 ,  G01C19/5783

CPC分类号： G01C19/5621 ,  G01C19/5628 ,  G01C19/5783

摘要： The present invention provides, in a physical quantity measuring system using a vibrator, a supporting structure of a vibrator for reducing the zero-point temperature drift of detection signal. It is provided a supporting member 22 for supporting a vibrator 1A with bonding wires 26. The supporting member 22 has a supporting plate 40 with an opening 25 formed therein to be positioned direct under a vibrator 1A, and a bonding wire 26 comprising a bonding end 29 to be bonded with the vibrator 1A, a fixed portion 26a fixed on the supporting plate 40 and a bent portion 28 direct under the opening 25. A distance "L1" between the bent portion 28 and a position 39 where the bonding wire 26 starts to protrude from the supporting plate 40 is 10 percent or more of a distance "L2" of the bent portion 28 and the bonding end 29.

公开(公告)号：EP2639823A2

公开(公告)日：2013-09-18

申请号：EP13157681.1

申请日：2013-03-04

申请人： Honeywell International, Inc.

发明人： Eskridge, Mark

IPC分类号： H01L21/60 ,  H01L23/488 ,  B81B7/00 ,  G01C19/5783 ,  H01S3/02

CPC分类号： H01L24/83 ,  B81B7/0048 ,  B81C1/00095 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01S5/02272 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2224/16225 ,  H01L2924/00

摘要： A method of fabricating a semiconductor comprises forming a plurality of stud bumps (110) in a pattern having a geometrical shape on a surface of a substrate (118), the pattern defining a periphery of a bonding area (114) on the surface of the substrate (118), and placing a solder material in the bonding area (114) such that the solder material is surrounded by the stud bumps (110). The solder material is heated to a temperature where the solder material begins to flow within the bonding area (114). A bonding surface of a die (130) is pressed onto the stud bumps (110) with a sufficient pressure to crush the stud bumps (110) a predetermined extent such that the solder material substantially evenly spreads between the stud bumps (110) within the bonding area (114). The solder material is then solidified to form a final solder area (132) that conforms to the geometrical shape of the pattern of stud bumps (110).

摘要翻译： 一种制造半导体的方法包括：形成具有基板（118）的一个表面上的几何形状柱形凸起的图案有多个（110），所述图案限定在基板的表面上的接合区的周边（118 ），以及将焊接材料（120）（以检查的接合区域没有焊料材料（120）由所述柱形凸点包围110）。 焊接材料（120）被加热到其中所述焊接材料（120）开始在接合区域内流动的温度。 的所述（130）的接合表面用足够的压力以粉碎柱形凸起（110）检测预定程度做了焊料材料内的柱形凸起（110）之间基本上均匀地分布压在柱形凸起（110） 接合面积。 然后将焊接材料（120）固化以形成最终的焊料区域（132）做个符合柱形凸起的图案（110）的几何形状。