公开(公告)号：EP1610596A1

公开(公告)日：2005-12-28

申请号：EP05253641.4

申请日：2005-06-13

Applicant: Radstone Technology PLC

Inventor： Ireland, Robert Mowat ,  Kirk, Graham Charles ,  Boocock, John Albert ,  Isles, Michael Arthur

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/10416

Abstract: A circuit card assembly comprises a PCB (1) having first and second opposing major faces with a first pair of elongated edges (4, 5) extending therebetween. Heat management layers are disposed within the CCA and/or PCB (1), which extend to said edges (4,5), and a thermally conductive bar (8) is engaged in a slot (6) provided in each of the elongated edges (4, 5). Each conductive bar (8) extends over at least the thickness of the PCB (1), one face preferably being flush with one of the major faces of the PCB (1) and is thermally connected to the heat management layer(s) by thermal connecting means so as to conduct heat from the or each heat management layer to said bar (8).

Abstract translation: 电路卡组件包括具有第一和第二相对主面的PCB（1），其间延伸有第一对细长边缘（4,5）。 热管理层设置在CCA和/或PCB（1）内，其延伸到所述边缘（4,5），并且导热棒（8）接合在设置在每个细长边缘中的狭槽（6）中 （4,5）。 每个导电棒（8）至少延伸PCB（1）的厚度，一个面优选地与PCB（1）的主面之一齐平，并通过热量热连接到热管理层 连接装置，以便将热量从每个热管理层传导到所述条（8）。

公开(公告)号：EP1610596B1

公开(公告)日：2007-06-06

申请号：EP05253641.4

申请日：2005-06-13

Applicant: Radstone Technology PLC

Inventor： Ireland, Robert Mowat ,  Kirk, Graham Charles ,  Boocock, John Albert ,  Isles, Michael Arthur

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/10416