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公开(公告)号:EP2478637B1
公开(公告)日:2018-03-07
申请号:EP10816291.8
申请日:2010-09-14
申请人: Rambus Inc.
IPC分类号: H03K17/687 , H03F3/26 , G06F13/40 , H03F3/45 , H03M1/06 , H03M1/74 , H03M1/80 , H04L25/02 , H04L25/03 , H03K19/00 , H03K19/0175 , H03M1/10
CPC分类号: H03K19/0005 , H03K19/017581 , H03M1/1061 , H03M1/745 , H04L25/0278 , H04L25/0288 , H04L25/03343
摘要: High resolution output drivers having a relatively small number of sub-driver branches or slices each having nominal impedances substantially larger than a quantization step and that incrementally differ from one another by an impedance step substantially smaller than a quantization step. In one implementation, such "differential" or "non-uniform" sub-driver slices implement respective elements of an n choose k equalizer, with each such differential sub-driver slice being implemented by a uniform-element impedance calibration DAC. In another implementation, each component of a uniform-slice equalizer is implemented by a differential-slice impedance calibration DAC, and in yet another implementation, each component of a differential-slice equalizer is implemented by a differential-slice impedance calibration DAC. In an additional set of implementations, equalization and impedance calibration functions are implemented bilaterally in respective parallel sets of driver branches, rather than in the nested "DAC within a DAC" arrangement of the hierarchical implementations. Through such bilateral arrangement, multiplication of the equalizer and calibrator quantizations is avoided, thereby lowering the total number of sub-driver slices required to meet the specified ranges and resolutions.
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公开(公告)号:EP2478637A2
公开(公告)日:2012-07-25
申请号:EP10816291.8
申请日:2010-09-14
申请人: Rambus Inc.
IPC分类号: H03K17/687 , H03F3/26
CPC分类号: H03K19/0005 , H03K19/017581 , H03M1/1061 , H03M1/745 , H04L25/0278 , H04L25/0288 , H04L25/03343
摘要: High resolution output drivers having a relatively small number of sub-driver branches or slices each having nominal impedances substantially larger than a quantization step and that incrementally differ from one another by an impedance step substantially smaller than a quantization step. In one implementation, such "differential" or "non¬ uniform" sub-driver slices implement respective elements of an n choose k equalizer, with each such differential sub-driver slice being implemented by a uniform-element impedance calibration DAC. In another implementation, each component of a uniform-slice equalizer is implemented by a differential-slice impedance calibration DAC, and in yet another implementation, each component of a differential-slice equalizer is implemented by a differential-slice impedance calibration DAC. In an additional set of implementations, equalization and impedance calibration functions are implemented bilaterally in respective parallel sets of driver branches, rather than in the nested "DAC within a DAC" arrangement of the hierarchical implementations. Through such bilateral arrangement, multiplication of the equalizer and calibrator quantizations is avoided, thereby lowering the total number of sub-driver slices required to meet the specified ranges and resolutions.
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