SEMICONDUCTOR DEVICE AND POWER CONTROL DEVICE
    1.
    发明公开
    SEMICONDUCTOR DEVICE AND POWER CONTROL DEVICE 审中-公开
    半导体器件和功率控制装置

    公开(公告)号:EP3297029A1

    公开(公告)日:2018-03-21

    申请号:EP17188615.3

    申请日:2017-08-30

    摘要: To realize a reduction in the number of parts in a system including a driver IC (semiconductor device). A high potential side power supply voltage (VP) is applied to a power supply application area (AR_VP). A high side area (AR_HVBK) is formed with a circuit which includes a driver driving a high side transistor (HA) and is operated at a boot power supply voltage (VB) with a floating voltage (VS) as a reference. A low side area (AR_LVBK) is formed with a circuit operated at a power supply voltage (VCC) with a low potential side power supply voltage (COM) as a reference. A first termination area (AR_TRMBK1) is disposed in a ring form so as to surround the power supply application area. A second termination area (AR_TRMBK2) is disposed in a ring form so as to surround the high side area.

    摘要翻译: 为了实现包括驱动器IC(半导体器件)的系统中的部件数量的减少。 高电位侧电源电压(VP)被施加到电源施加区域(AR_VP)。 高侧区域(AR_HVBK)由包括驱动高侧晶体管(HA)的驱动器并以浮动电压(VS)作为参考以开机电源电压(VB)运行的电路形成。 低电位侧区域(AR_LVBK)由以低电位侧电源电压(COM)作为基准的电源电压(VCC)工作的电路形成。 第一终端区域(AR_TRMBK1)以围绕供电应用区域的方式配置成环状。 第二终端区域(AR_TRMBK2)以包围高侧区域的方式配置成环状。