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1.发明公开ELEKTRONISCHES BAUTEIL MIT KORROSIONSGESCHÜTZTER BONDVERBINDUNG UND VERFAHREN ZUR HERSTELLUNG DES BAUTEILS 有权根据上述制造COMPONENT防腐蚀的键合连接和方法电子元件
公开(公告)号：EP2803082A1
公开(公告)日：2014-11-19
申请号：EP12798672.7
申请日：2012-11-29
申请人： Robert Bosch GmbH
发明人： DUERR, Johannes , BECKER, Rolf , LAMERS, Sven , MUELLER, Lutz , BEZ, Fabian , SCHLECHT, Michael
IPC分类号： H01L23/053 , H01L23/26
CPC分类号： H01L23/26 , H01L21/56 , H01L23/053 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48644 , H01L2224/49 , H01L2224/73265 , H01L2224/85 , H01L2224/85203 , H01L2924/01327 , H01L2924/19105 , H01L2924/00 , H01L2924/2075 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012
摘要： The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).
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2.发明授权ELEKTRONISCHES BAUTEIL MIT KORROSIONSGESCHÜTZTER BONDVERBINDUNG UND VERFAHREN ZUR HERSTELLUNG DES BAUTEILS 有权根据上述制造COMPONENT防腐蚀的键合连接和方法电子元件
公开(公告)号：EP2803082B1
公开(公告)日：2016-02-03
申请号：EP12798672.7
申请日：2012-11-29
申请人： Robert Bosch GmbH
发明人： DUERR, Johannes , BECKER, Rolf , LAMERS, Sven , MUELLER, Lutz , BEZ, Fabian , SCHLECHT, Michael
IPC分类号： H01L23/053 , H01L23/26
CPC分类号： H01L23/26 , H01L21/56 , H01L23/053 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48644 , H01L2224/49 , H01L2224/73265 , H01L2224/85 , H01L2224/85203 , H01L2924/01327 , H01L2924/19105 , H01L2924/00 , H01L2924/2075 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012
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